Method of manufacturing a hot-stamped part
US-11931786-B2 · Mar 19, 2024 · US
US2023150008A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023150008-A1 |
| Application number | US-202218076967-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 7, 2022 |
| Priority date | Oct 29, 2021 |
| Publication date | May 18, 2023 |
| Grant date | — |
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The present disclosure provides a method of manufacturing a hot stamping component, the method includes inserting a blank into a heating furnace, heating the blank, and transferring the heated blank from the heating furnace to a mold, wherein an air cooling time of the blank in the transferring of the blank satisfies Equation 1.
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1 . A method of manufacturing a hot stamping component, the method comprising: inserting a blank into a heating furnace; heating the blank; and transferring the heated blank from the heating furnace to a mold; wherein an air cooling time of the blank in the transferring of the blank satisfies Equation 1 below λ t = a t × T t + b t × t C t where λ t represents an air cooling time (s), at represents a heating furnace discharge temperature and an atmospheric temperature correction coefficient, Tt represents a heating temperature (°C), bt represents a material component correction coefficient, t represents a material thickness (mm), and c t represents a high temperature material thickness sensitivity correction coefficient. 2 . The method of claim 1 , wherein, in Equation 1, at is 0.0160 or greater and 0.0165 or less, T t is Ac3 or more and 1000° C. or less, bt is -10 or greater and 0.5 or less, t is 1 mm or greater and 2.6 mm or less, and c t is 0.7 or greater and 0.9 or less. 3 . The method of claim 2 , wherein, in Equation 1, λ t is 5 s or more and 20 s or less. 4 . The method of claim 3 , wherein, in the transferring of the blank, the heated blank is air-cooled at room temperature. 5 . The method of claim 1 , wherein the heating of the blank comprises: step-heating the blank in multiple stages; and soaking the blank in a temperature range of about Ac3 to about 1,000° C. 6 . The method of claim 5 , wherein, in the heating of the blank, the heating time of the blank satisfies equation (2) below λ n = a n × T n + b n × t C n where λ n represents a heating time (s), a n represents a heating furnace heat loss correction coefficient, T n represents a heating temperature (°C), b n represents an Ac3 temperature correction coefficient, t represents a material thickness (mm), and c n represents a high temperature material thickness sensitivity coefficient. 7 . The method of claim 6 , wherein, in Equation 2, a n is -0.60 or greater and -0.55 or less, T n is Ac3 or greater and 1000° C. or less, b n is 700 or greater and 900 or less, t is 1 mm or greater and 2.6 mm or less, and c n is 0.7 or greater and 0.9 or less. 8 . The method of claim 7 , wherein, in Equation 2, λ n is 100 s or more and 900 s or less. 9 . The method of claim 5 , wherein the heating furnace comprises a plurality of sections having different temperature ranges. 10 . The method of claim 9 , wherein a ratio of a length of sections for step-heating the blank to a length of a section for soaking the blank is about 1:1 to 4:1. 11 . The method of claim 1 , further comprising: after transferring the blank, forming a molded body by pressing the transferred blank with the mold; and cooling the formed molded body. 12 . The method of claim 11 , wherein, in the molding of the molded body, a molding start temperature of the blank is 500° C. or higher and 700° C. or less. 13 . The method of claim 11 , wherein the cooling of the molded body is performed within the mold. 14 . The method of claim 13 , wherein, in the cooling of the molded body, a mold cooling time during which the molded body is cooled in the mold satisfies Equation 3 below λ q = a q × P + b q × t C q where λ q represents a mold cooling time (s), a q represents a mold thermal conductivity correction coefficient, P represents a pressing force (MPa), b q represents a material hardenability correction coefficient, t represents a material thickness (mm), and c q represents a low temperature material thickness sensitivity coefficient. 15 . The method of claim 14 , wherein, in Equation 3, a q is -1.0 or greater and -0.2 or less, P is 0.1 MPa or greater and 5 MPa or less, b q is 11 or greater and 15 or less, t is 1 mm or greater and 2.6 mm or less, and c q is 1.00 or greater and 1.05 or less. 16 . The method of claim 15 , wherein, in Equation 3, λ q is 6 s or more and 40 s or less. 17 . The method of claim 11 , wherein, in the cooling of the molded body, a cooling end temperature of the mold at which the cooling is terminated is above the room temperature and below about 200° C. 18 . A hot stamping component manufactured according to the method of claim 1 , the hot stamping component having a tensile strength of 1,350 MPa or greater and less than 2,300 MPa.
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