Ceramic electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2023129225-A1
Application number	US-202218085840-A
Country	US
Kind code	A1
Filing date	Dec 21, 2022
Priority date	Jan 7, 2020
Publication date	Apr 27, 2023
Grant date	—

Abstract

A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.

First claim

What is claimed is:

1 . A ceramic electronic component comprising:
a body including first and second internal electrodes overlapping each other with a dielectric layer disposed therebetween, wherein, in a region of the dielectric layer disposed 0.41 μm or less from both the first and second internal electrodes, dielectric grains of the dielectric layer have core-shell structures having a core and a first shell surrounding at least a portion of the core and including a rare earth element in a concentration higher than the core.

2 . The ceramic electronic component according to claim 1 , wherein a thickness of the first shell along the straight line connecting α and β is 5 to 30% of the distance between α and β.

3 . The ceramic electronic component according to claim 1 , wherein a concentration of any rare earth element included in the core of the core-shell structure is 0.1 times or less than the concentration of the any rare earth element included in the first shell.

4 . The ceramic electronic component according to claim 1 , wherein the first shell in the core-dual shell structure is disposed to cover at least 90 area % of a surface of the core.

5 . The ceramic electronic component according to claim 1 , wherein a total number of dielectric grains having the core-shell structure in the dielectric layer is 50% or more of a total number of the plurality of dielectric grains in the dielectric layer.

6 . The ceramic electronic component according to claim 1 , wherein the dielectric layer comprises one or more of BaTiO3, (Ba,Ca)(Ti,Ca)O 3 , (Ba,Ca)(Ti,Zr)O 3 , Ba(Ti,Zr)O 3 , and (Ba,Ca)(Ti,Sn)O 3 as a main component.

7 . The ceramic electronic component according to claim 6 , wherein the dielectric layer has an amount of the rare earth element in a range of 0.1 to 15 moles, relative to 100 moles of the main component.

8 . The ceramic electronic component according to claim 1 , wherein the rare earth element is one or more of lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), and ruthenium (Ru).

9 . The ceramic electronic component according to claim 6 , wherein the dielectric layer further comprises one or more of Mn, Cr, Ba, Si, Al, Mg, and Zr as a minor component.

Assignees

• Samsung Electro Mech

Inventors

• Kang Sung Hyung
• Cho Jong Hyun
• Jo Ji Hong
• Cho Hang Kyu
• Shim Jae Shik
• Kim Yong In
• Lee Sang Roc

Classifications

• C04B35/4682

  based on BaTiO3 perovskite phase · CPC title

• C04B2235/3225

  Yttrium oxide or oxide-forming salts thereof · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• C04B2235/3229

  Cerium oxides or oxide-forming salts thereof · CPC title

• H01G4/0085 Primary

  Fried electrodes · CPC title