Contact device and method for producing the contact device

Patent metadata

Field	Value
Publication number	US-2022243355-A1
Application number	US-202217588242-A
Country	US
Kind code	A1
Filing date	Jan 29, 2022
Priority date	Jan 29, 2021
Publication date	Aug 4, 2022
Grant date	—

Abstract

An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

First claim

What is claimed is:

1 . An electroplating device, comprising:
an electroplating bath adapted to contain an electroplating solution into which a workpiece defining a cathode to be electroplated is at least partially immersed; a first anode arranged in the electroplating bath; and a liquid spraying device, comprising:
a main body part having at least one inlet for conveying the electroplating solution into the main body part; and
a plurality of nozzles installed on the main body part,
wherein at least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

2 . The electroplating device according to claim 1 , wherein the first anode is arranged between the liquid spraying device and the workpiece, a plurality of first through holes are formed in the first anode, and a portion of the electroplating solution ejected from the nozzles flows through the first through holes.

3 . The electroplating device according to claim 2 , wherein a plurality of the first anodes are provided and a gap is defined between two adjacent first anodes.

4 . The electroplating device according to claim 1 , wherein the nozzle is detachably mounted on the main body part, and the spraying direction of at least part of the nozzles is adjustable.

5 . The electroplating device according to claim 1 , wherein an output of the nozzles is sparse in a high current density region and dense in a low current density region.

6 . The electroplating device according to claim 5 , wherein an arrangement density of the nozzles on an upper part of the main body part is greater than that of the nozzles on a lower part of the main body part.

7 . The electroplating device according to claim 1 , wherein the main body part comprises:
a first part; and two second parts provided at both ends of the main body part, respectively, and extending towards the workpiece, and wherein the nozzles comprise: a plurality of first nozzles mounted on the first part the flow direction of the electroplating solution ejected from the first nozzles is substantially parallel to the direction of the power line formed by the first anode and the cathode; and a plurality of second nozzles provided on the inner side of the two second parts and adapted to eject the electroplating solution toward the workpiece.

8 . The electroplating device according to claim 1 , wherein the workpiece is arranged on a material strip moving horizontally through the electroplating bath, the flow direction of the electroplating solution ejected from the first nozzle is perpendicular to the moving direction of the material strip, and each of two opposite side walls of the electroplating bath is provided with an overflow port, the material strip moves through the overflow port.

9 . The electroplating device according to claim 1 , wherein the electroplating device further comprises a second anode having an electrolytic potential that is lower than that of the first anode.

10 . The electroplating device according to claim 9 , wherein the second anode is arranged in a basket having a plurality of first through holes.

11 . The electroplating device according to claim 9 , further comprising two partition walls separating the electroplating bath into an outer containing part and an inner containing part located inside the outer containing part, wherein a plurality of pairs of the first anodes are arranged in the inner containing part and a plurality of pairs of the second anodes are arranged in the outer accommodation part, a plurality of second through holes are formed in the partition walls allowing the electroplating solution in the outer containing part to flow into the inner containing part through the second through holes.

12 . The electroplating device according to claim 11 , wherein the first anode is installed on the partition wall by a first bracket, and the second anode is installed on the side wall of the electroplating bath by the second bracket.

13 . The electroplating device according to claim 10 , further comprising a power supply supplying power to the first anode and the second anode.

14 . The electroplating device according to claim 13 , wherein the power supply device comprises a first current regulator and a second current regulator adjusting the current delivered to the first anode and the second anode respectively.

15 . The electroplating device according to claim 14 , wherein the first current regulator and the second current regulator adjust the proportion of current transmitted to the first anode and the second anode according to the proportion of metals in an alloy to be electroplated on the workpiece.

16 . The electroplating device according to claim 13 , further comprising an auxiliary cathode, the power supply device further comprising a third current regulator, a cathode of the third current regulator is connected to the auxiliary cathode, and an anode of the third current regulator is connected to the second anode, the third current regulator supplying power to the second anode during the second current regulator stops transmitting current to the second anode.

17 . The electroplating device according to claim 9 , wherein a plurality of first liquid inlet holes substantially aligned with the second anodes are arranged on the bottom wall of the electroplating bath, and the first liquid inlet holes are positioned to convey the electroplating solution towards the second anodes in a vertical direction.

18 . The electroplating device according to claim 1 , wherein a plurality of second liquid inlet holes substantially aligned with the workpiece are arranged on the bottom wall of the electroplating bath, and the second liquid inlet holes are positioned to convey the electroplating solution towards the workpiece in a vertical direction.

19 . The electroplating device according to claim 18 , wherein a pair of adjustment covers are respectively provided on both sides of the second liquid inlet hole, and the adjustment covers are adapted to adjust a liquid level of the electroplating solution at the workpiece.

20 . An electroplating system comprising:
an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed;
a first anode arranged in the electroplating bath; and
a liquid spraying device, comprising:
a main body part having at least one inlet for conveying the electroplating solution into the main body part; and
a plurality of nozzles installed on the main body part, wherein at least part of the nozzles are oriented such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode;

a tank into which the electroplating solution overflowing from the electroplating bath flows; and a pump adapted to pump the electroplating solution from the tank to the inlet of the liquid spraying device through a pipe.

Assignees

• Tyco Electronics Shanghai Co Ltd
• Tyco Electronics Suzhou Ltd

Inventors

• Zhang Daiqiong (Diana)
• Liang Yuelin (Kevin)
• Peng Dongqing (Gates)
• Zhou Chunyan (Cherie)
• Huang Zhongxi

Classifications

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/12 Primary

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D17/10

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title