Method for manufacturing a hall sensor assembly and a hall sensor assembly
US-2015362565-A1 · Dec 17, 2015 · US
US2023027086A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023027086-A1 |
| Application number | US-202217954679-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 28, 2022 |
| Priority date | Apr 28, 2020 |
| Publication date | Jan 26, 2023 |
| Grant date | — |
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A spin-orbit torque (SOT) magnetic tunnel junction (MTJ) device includes a substrate, a seed layer over the substrate, and a bismuth antimony (BiSb) layer having (0120) orientation on the seed layer. The seed layer includes a silicide layer and a surface control layer. The silicide layer includes a material of NiSi, NiFeSi, NiFeTaSi, NiCuSi, CoSi, CoFeSi, CoFeTaSi, CoCuSi, or combinations thereof. The surface control layer includes a material of NiFe, NiFeTa, NiTa, NiW, NiFeW, NiCu, NiCuM, NiFeCu, CoTa, CoFeTa, NiCoTa, Co, CoM, CoNiM, CoNi, NiSi, CoSi, NiCoSi, Cu, CuAgM, CuM, or combinations thereof, in which M is Fe, Cu, Co, Ta, Ag, Ni, Mn, Cr, V, Ti, or Si.
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What is claimed is: 1 . A spin-orbit torque (SOT) device, comprising: a seed layer comprising: a surface control layer comprising a material selected from a group consisting of NiFe, NiFeTa, NiTa, NiW, NiFeW, NiCu, NiCuM, NiFeCu, CoTa, CoFeTa, NiCoTa, Co, CoM, CoNiM, CoNi, NiSi, CoSi, NiCoSi, Cu, CuAgM, CuM, and combinations thereof, wherein M is selected from a group consisting of Fe, Cu, Co, Ta, Ag, Ni, Mn, Cr, V, Ti, and Si; and a bismuth antimony (BiSb) layer disposed on the surface control layer, the BiSb layer having a (012) orientation. 2 . The SOT device of claim 1 , wherein the seed layer further comprises a silicide layer comprising a material selected from a group consisting of NiSi, NiFeSi, NiFeTaSi, NiCuSi, CoSi, CoFeSi, CoFeTaSi, CoCuSi, and combinations thereof. 3 . The SOT device of claim 2 , wherein the silicide layer comprises one or more stacks of a laminate comprising a silicon layer and a metal layer, the metal layer comprising a material selected from a group consisting of Ni, NiFe, NiFeTa, NiCu, Co, CoFe, CoFeTa, CoCu, and combinations thereof. 4 . The SOT device of claim 3 , wherein the silicide layer comprises one to four stacks of the laminate, and wherein the silicide layer has a thickness from about 1 Å to about 30 Å. 5 . The SOT device of claim 1 , wherein the surface control layer has a thickness from about 1 Å to about 20 Å. 6 . The SOT device of claim 1 , wherein the surface control layer comprises a first layer and a second layer disposed between the first layer and the BiSb layer, wherein the first layer comprises a material selected from a group consisting of NiFe, NiFeTa, NiTa, NiW, NiFeW, NiCu, NiCuAg, NiCuM, NiFeCu, CoTa, CoFeTa, NiCoTa, Co, CoCu, and combinations thereof, in which M is selected from a group consisting of Fe, Cu, Co, Ta, Ag, Ni, Mn, Cr, V, Ti, and Si, and wherein the second layer comprises a material selected from a group consisting of CoNi, NiSi, CoSi, NiCoSi, CuAgNi, CuM, CuNiM, Ni, CoCu, Cu, Co, NiCu, and combinations thereof, in which M is selected from a group consisting of Fe, Cu, Co, Ta, Ag, Ni, Mn, Cr, V, Ti, and Si. 7 . The SOT device of claim 1 , wherein the surface control layer has a fcc(111) orientation or an hcp(002) orientation. 8 . A magnetic media drive, comprising the SOT device of claim 1 . 9 . A magnetoresistive random access memory device, comprises the SOT device of claim 1 . 10 . A magnetic recording write head, comprising the SOT device of claim 1 . 11 . A spin-orbit torque (SOT) device, comprising: a bismuth antimony (BiSb) layer, the BiSb layer having a (012) orientation, and an interlayer on the BiSb layer, the interlayer comprising: a silicide layer comprising a material selected from a group consisting of NiSi, FeSi, CoSi, NiCuSi, NiFeTaSi, CoCuSi, and combinations thereof. 12 . The SOT device of claim 11 , wherein the silicide layer has a thickness from about 1 Å to about 30 Å. 13 . The SOT device of claim 11 , wherein the silicide layer comprises one or more stacks of a laminate, the laminate comprising a silicon layer and a metal layer, the metal layer comprising a material selected from a group consisting of Ni, Fe, Co, NiCu, NiFeTa, CoCu, NiFe, NiFeCu, Cu, and combinations thereof. 14 . The SOT device of claim 13 , wherein the silicide layer comprises one to four stacks of the laminate. 15 . The SOT device of claim 11 , wherein the interlayer further comprises a surface control layer between the BiSb layer and the silicide layer, the surface control layer comprising a material selected from a group consisting of Cu, Ni, NiFe, Fe, Co, NiCu, NiFeTa, CoCu, NiFeCu, and combinations thereof. 16 . The SOT device of claim 11 , further comprising: a seed layer disposed in contact with the BiSb layer; and a spin torque layer (STL) disposed over the interlayer. 17 . The SOT device of claim 11 , further comprising: a seed layer disposed in contact with the BiSb layer; and a perpendicular magnetic anisotropy (PMA) ferromagnetic layer disposed over the interlayer. 18 . The SOT device of claim 11 , further comprising: a seed layer disposed in contact with the BiSb layer; and a cap layer disposed over the interlayer. 19 . A magnetic media drive, comprising the SOT device of claim 11 . 20 . A magnetoresistive random access memory device, comprises the SOT device of claim 11 . 21 . A magnetic recording write head, comprising the SOT device of claim 11 . 22 . A spin-orbit torque (SOT) device, comprising: a bismuth antimony (BiSb) layer, the BiSb layer having a (012) orientation, and an interlayer disposed on the BiSb layer, the interlayer comprising: an amorphous film comprising a material with a nearest neighbor peak d-spacing matching a spacing selected from a group consisting of: a (111) d-spacing of an fcc lattice with an a-axis in the range of 3.54 Å to 3.78 Å, and a (002) d-spacing of an hcp lattice with an a-axis in the range of 2.52 Å to 2.68 Å. 23 . The SOT device of claim 22 , wherein the interlayer further comprises a silicide layer comprising a material selected from a group consisting of NiSi, NiFeSi, NiFeTaSi, NiCuSi, CoSi, CoFeSi, CoFeTaSi, CoCuSi, and combinations thereof. 24 . The SOT device of claim 22 , further comprising a seed layer disposed in contact with the BiSb layer, the seed layer comprising: an amorphous film, the amorphous film comprising: a material with a nearest neighbor peak d-spacing matching a spacing selected from a group consisting of: a (111) d-spacing of an fcc lattice with an a-axis in the range of 3.54 Å to 3.78 Å, and a (002) d-spacing of an hcp lattice with an a-axis in the range of 2.52 Å to 2.68 Å; and one or more stacks of a laminate, each stack of laminate comprising: a silicon layer comprising a material selected from a group consisting of NiSi, NiFeSi, NiFeTaSi, NiCuSi, CoSi, CoFeSi, CoFeTaSi, CoCuSi, and combinations thereof, and a metal layer comprising a material selected from a group consisting of Ni, NiFe, NiFeTa, NiCu, Co, CoFe, CoFeTa, CoCu, and combinations thereof. 25 . The SOT device of claim 24 , further comprising: a free perpendicular magnetic anisotropy (PMA) ferromagnetic layer disposed over the interlayer; and a reference PMA ferromagnetic layer disposed over the free PMA ferromagnetic layer. 26 . The SOT device of claim 24 , further comprising: a spin torque layer (STL) disposed over the interlayer; and a pinning layer disposed over the STL. 27 . A magnetic media drive, comprising the SOT device of claim 22 . 28 . A magnetoresistive random access memory device, comprises the SOT device of claim 22 . 29 . A magnetic recording write head, comprising the SOT device of claim 22 .
Electricity · mapped topic
Electricity · mapped topic
the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ] · CPC title
Electricity · mapped topic
by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets · CPC title
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