System for Monitoring a Device

Patent metadata

Field	Value
Publication number	US-2023026139-A1
Application number	US-202217868975-A
Country	US
Kind code	A1
Filing date	Jul 20, 2022
Priority date	Jul 20, 2021
Publication date	Jan 26, 2023
Grant date	—

Abstract

A system and method includes at least one temperature sensor, a processing unit, and an output unit. The temperature sensor acquires a temperature measurement at a first location of an operational device, which first location is in thermal contact with a second location of the operational device. The processing unit selects a simulated temperature distribution of the first location of a simulated device from a plurality of simulated temperature distributions of the first location and compares the temperature measurement with simulated temperature distributions of the first location, and determines whether a hot spot exists or is developing at the second location. The determination comprises utilization of a correlation between the simulated temperature distribution of the first location and the second location for the selected simulated temperature distribution of the first location of the simulated device.

First claim

1 . A system for monitoring a device, the system comprising:
at least one temperature sensor; a processing unit; and an output unit; wherein the at least one temperature sensor is configured to acquire at least one temperature measurement at a first location of an operational device, and wherein the first location is in thermal contact with a second location of the operational device; wherein the at least one temperature sensor is configured to provide the at least one temperature measurement to the processing unit; wherein the processing unit is configured to select a simulated temperature distribution of the first location of the simulated device from a plurality of simulated temperature distributions of the first location of the simulated device, wherein the selection comprises a comparison of the at least one temperature measurement with the plurality of simulated temperature distributions of the first location, wherein the plurality of simulated temperature distributions of the first location each relate to a different situation with respect to simulated operation of the simulated device, and wherein for each of the different situations there is a correlation between a simulated temperature distribution of the first location and a simulated temperature at the second location of the simulated device; wherein the processing unit is configured to determine that a hot spot exists or is developing at the second location of the operational device, and wherein the determination comprises utilization of the correlation between the simulated temperature distribution of the first location and the second location for the selected simulated temperature distribution of the first location of the simulated device; and wherein the output unit is configured to output an indication of a fault at the second location of the operational device.

2 . The system according to claim 1 , wherein the at least one temperature sensor comprises one or more infrared cameras, one or more Surface Acoustic Wave sensor, or one or more RFID sensors.

3 . The system according to claim 1 , wherein the at least one temperature measurement comprises a plurality of temperature measurements, and wherein the plurality of temperature measurements were acquired at the same time.

4 . The system according to claim 2 , wherein the at least one temperature sensor is an infrared camera, and wherein the at least one temperature measurement comprises an infrared image of the first location.

5 . The system according to claim 1 , wherein the plurality of simulated temperature distributions are simulated in a process that comprises utilization of finite element analysis.

6 . The system according to claim 1 , wherein the correlation between the simulated temperature distribution of the first location and the simulated temperature at the second location of the simulated device for each of the different situations was determined through utilization of finite element analysis.

7 . The system according to claim 1 , wherein the comparison of the at least one temperature measurement with the plurality of simulated temperature distributions comprises utilization of a matrix norm or a machine learning algorithm implemented by the processing unit.

8 . A method for monitoring a device, the method comprising:
a) acquiring by at least one temperature sensor at least one temperature measurement at a first location of an operational device, and wherein the first location is in thermal contact with a second location of the operational device; b) providing the at least one temperature sensor to a processing unit; c) selecting by the processing unit a simulated temperature distribution of the first location of the simulated device from a plurality of simulated temperature distributions of the first location of the simulated device, wherein the selecting comprises comparing the at least one temperature measurement with the plurality of simulated temperature distributions of the first location, wherein the plurality of simulated temperature distributions of the first location each relate to a different situation with respect to simulated operation of the simulated device, and wherein for each of the different situations there is a correlation between a simulated temperature distribution of the first location and a simulated temperature at the second location of the simulated device; d) determining by the processing unit that a hot spot exists or is developing at the second location of the operational device, and wherein the determining comprises utilizing the correlation between the simulated temperature distribution of the first location and the second location for the selected simulated temperature distribution of the first location of the simulated device; and e) outputting by an output unit an indication of a fault at the second location of the operational device.

9 . The method according to claim 8 , wherein the at least one temperature sensor comprises one or more infrared cameras, one or more Surface Acoustic Wave sensor, or one or more RFID sensors.

10 . The method according to claim 8 , wherein the at least one temperature measurement comprises a plurality of temperature measurements, and wherein the plurality of temperature measurements were acquired at the same time.

11 . The method according to claim 8 , wherein the at least one temperature sensor is an infrared camera, and wherein the at least one temperature measurement comprises an infrared image of the first location.

12 . The method according to claim 8 , wherein the plurality of simulated temperature distributions are simulated in a process that comprises utilization of finite element analysis.

13 . The method according to claim 8 , wherein the correlation between the simulated temperature distribution of the first location and the simulated temperature at the second location of the simulated device for each of the different situations was determined through utilization of finite element analysis.

14 . The method according to claim 8 , wherein the comparing the at least one temperature measurement with the plurality of simulated temperature distributions comprises utilizing a matrix norm or a machine learning algorithm implemented by the processing unit.

Assignees

• Abb Schweiz Ag

Inventors

• Ostrowski Joerg
• Wildermuth Stephan
• Gitzel Ralf
• Kaufmann Patrik Reto
• Gebhardt Joerg
• Koenig Kai
• Samul Boguslaw

Classifications

• G01J5/80 Primary

  Calibration (using comparison with reference sources G01J5/52) · CPC title

• G01J2005/0077

  Imaging · CPC title

• G01K7/427 Primary

  Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation · CPC title

• G01K3/14

  in respect of space · CPC title

• G01K2003/145

  Hotspot localization · CPC title