Semiconductor light-emitting element supply device and supply method

Patent metadata

Field	Value
Publication number	US-2023005888-A1
Application number	US-202017783731-A
Country	US
Kind code	A1
Filing date	Jan 8, 2020
Priority date	Dec 13, 2019
Publication date	Jan 5, 2023
Grant date	—

Abstract

A semiconductor light-emitting element supply device according to an embodiment of the present invention supplies semiconductor light-emitting elements in a fluid chamber in which self-assembly occurs, the semdconductor light-emitting element supply device comprising: a tray disposed in the fluid chamber; a transfer unit which includes a magnet and a magnet accommodating part for accommodating the magnet and which transfers the semiconductor light-emitting elements by using magnetic force; a supply unit disposed above the tray to supply the transferred semiconductor light-emitting elements to the tray; and a control unit for controlling operations of the tray, the transfer unit and the supply unit, wherein the control unit controls the position of the magnet accommodated in the magnet accommodating part so that the semiconductor light-emitting elements are adhered on one surface of the magnet accommodating part or the adhered semiconductor light-emittng elements are separated from the one surface of the magnet accommodating part.

First claim

1 . An apparatus for supplying a semiconductor light emitting diode among semiconductor light emitting diodes that are supplied in a fluid chamber to perform a self-assembly process for the semiconductor light emitting diodes, the apparatus comprising:
a tray disposed in the fluid chamber; a transferor including a magnet and a magnet receiver, which receives the magnet, to transfer the semiconductor light emitting diodes using magnetic force; a supplier disposed at an upper portion of the tray to supply the transferred semiconductor light emitting diodes to the tray; and a controller configured to control driving of the tray, the transferor, and the supplier, wherein the controller is configured to: adjust a position of the magnet received in the magnet receiver, so that the semiconductor light emitting diodes are adsorbed on one surface of the magnet receiver or the adsorbed semiconductor light emitting diodes are separated from the one surface of the magnet receiver.

2 . The apparatus of claim 1 , wherein the magnet receiver is formed to extend in one direction, and
wherein the controller moves the magnet in an extension direction of the magnet receiver.

3 . The apparatus of claim 1 , wherein the controller is configured to bring the magnet into the one surface of the magnet receiver, so that the semiconductor light emitting diodes are adsorbed on the one surface of the magnet receiver.

4 . The apparatus of claim 1 , wherein the supplier includes:
a housing which includes a first opening allowing the transferor to enter or exit, and a second opening facing the first opening and disposed to be adjacent to the tray.

5 . The apparatus of claim 4 , wherein the housing extends in a direction in which the transferor enters or exits, and has a width narrowed toward the second opening from a position in an extension direction of the housing.

6 . The apparatus of claim 1 , wherein the controller is configured to:
supply the semiconductor light emitting diodes to the tray by separating the adsorbed semiconductor light emitting diodes from the one surface of the magnet receiver while moving the transferor and the supplier along a path, after positioning the transferor in the housing, in which the semiconductor light emitting diodes are adsorbed on the one surface of the transferor.

7 . The apparatus of claim 6 , wherein the controller is configured to:
further move the magnet in a direction away from the one surface of the magnet receiver, while moving the transferor and the supplier.

8 . The apparatus of claim 1 , wherein the supplier includes:
a plurality of housings, and wherein the plurality of housings are arranged in a row in any one direction of an extension direction of the tray.

9 . The apparatus of claim 1 , wherein the transferor includes a plurality of magnets and a plurality of magnet receivers.

10 . A method for using semiconductor light emitting diodes in a fluid chamber to perform a self-assembly process, the method comprising:
adsorbing the semiconductor light emitting diodes on one surface of a magnet receiver, in which a magnet is received, using magnetic force; moving the magnet receiver having the adsorbed semiconductor light emitting diodes in a housing provided in the chamber; and supplying the semiconductor light emitting diodes to a tray provided under the housing, while moving the magnet receiver and the housing through a path.

11 . The method of claim 10 , wherein, in the adsorbing, the magnet makes contact with the one surface of the magnet receiver so that the semiconductor light emitting diodes are adsorbed on the one surface of the magnet receiver.

12 . The method of claim 10 , wherein, in the supplying, the magnet received in the magnet receiver is moved in a direction away from the one surface of the magnet receiver, while the magnet receiver and the housing are moving in a state of maintaining a distance to the tray.

13 . The method of claim 10 , wherein, in the supplying, the semiconductor light emitting diodes are continuously supplied in any one of an extension direction of the tray.

14 . The method of claim 10 , wherein after the supplying, the semiconductor light emitting diodes are arranged on a surface of the tray in a line that extends in a direction of the path.

15 . The method of claim 14 , wherein the magnet receiver is provided in plural, and
wherein the supplying arranges the semiconductor light emitting diodes in a plurality of lines that correspond to the number of the plurality of magnet receivers.

16 . The method of claim 15 , wherein the plurality of lines are parallel to each other.

17 . An apparatus for supplying semiconductor light emitting diodes for a self-assembly process for the semiconductor light emitting diodes, the apparatus comprising:
a tray disposed in a fluid chamber; a transferor to transfer the semiconductor light emitting diodes using magnetic force; a supplier paired with the transferor to supply the semiconductor light emitting diodes to the tray; and a controller configured to control driving of transferor, and the supplier by adjusting a position transferor and the supplier to arranged the semiconductor light emitting diodes in parallel lines on a surface of the tray.

18 . The apparatus of claim 17 , wherein the transferor includes a magnet and a magnet receiver that receives the magnet, and
wherein the semiconductor light emitting diodes become adsorbed on one surface of the magnet receiver or the adsorbed semiconductor light emitting diodes become separated from the one surface of the magnet receiver based on the driving of the controller to arrange the semiconductor light emitting diodes in parallel lines on the surface of the tray.

19 . The apparatus of claim 17 , wherein the supplier includes:
a housing; a first opening at one end of the housing and to couple with the transferor; and a second opening at another end of the housing for the semiconductor light emitting diodes to enter and exit the housing.

20 . The apparatus of claim 19 , wherein the first and second openings have different sizes.

Assignees

• Lg Electronics Inc

Inventors

• Shin Yongil
• Kim Dohee
• Yang Dohwan

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H01L33/005

  Electricity · mapped topic

• H01L25/0753 Primary

  Electricity · mapped topic

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title