Rotatable cold plate assembly for cooling pluggable modules
US-10874032-B2 · Dec 22, 2020 · US
Rotating lid for module cooler
US2022418134A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022418134-A1 |
| Application number | US-202117304855-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 28, 2021 |
| Priority date | Jun 28, 2021 |
| Publication date | Dec 29, 2022 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electronic assembly comprising: an electronic module mounted to a laminate; a cooling apparatus directly above the module; a single thermal interface material positioned between and directly contacting the module and the cooling apparatus; and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover comprises an open position and a closed position. 2 . The electronic assembly according to claim 1 , wherein in the closed position the rotating cover is held in place by the cooling apparatus and a load hardware such that pivot features securing the rotating cover to the laminate are disengaged and do not influence a vertical position of the rotating cover, and wherein the rotating cover cannot remain in the open position without being held open by an operator. 3 . The electronic assembly according to claim 1 , wherein the rotating cover floats vertically. 4 . The electronic assembly according to claim 1 , wherein the rotating cover comprises alignment features, and opposite edges of the cooling apparatus are captured by the alignment features. 5 . The electronic assembly according to claim 1 , wherein the cooling apparatus is a liquid cold plate comprising an inlet port and an outlet port, and where the inlet port and the outlet port protrude through openings in the rotating cover. 6 . The electronic assembly according to claim 1 , further comprising: an elastomeric material sandwiched between the rotating cover and a load hardware directly above the rotating cover. 7 . An electronic assembly comprising: an electronic module mounted to a laminate; a cooling apparatus directly above the module; a single thermal interface material positioned between and directly contacting the module and the cooling apparatus; and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the top frame surrounds all sides of both the module and the cooling apparatus. 8 . The electronic assembly according to claim 7 , wherein the rotating cover is held in place by the cooling apparatus and a load hardware such that pivot features securing the rotating cover to the laminate are disengaged and do not influence a vertical position of the rotating cover. 9 . The electronic assembly according to claim 7 wherein the rotating cover floats vertically. 10 . The electronic assembly according to claim 7 , wherein the rotating cover comprises alignment features, and opposite edges of the cooling apparatus are captured by the alignment features. 11 . The electronic assembly according to claim 7 , wherein the cooling apparatus is a liquid cold plate comprising an inlet port and an outlet port, and where the inlet port and the outlet port protrude through openings in the rotating cover. 12 . The electronic assembly according to claim 7 , further comprising: an elastomeric material sandwiched between the rotating cover and a load hardware directly above the rotating cover. 13 . The electronic assembly according to claim 7 , further comprising an: elastomeric material sandwiched between the cooling apparatus and the rotating cover. 14 . An electronic assembly comprising: an electronic module mounted to a laminate; a cooling apparatus directly above the module; a single thermal interface material positioned between and directly contacting the module and the cooling apparatus; and a rotating cover rotatably attached to the laminate with pivot features. 15 . The electronic assembly according to claim 14 , wherein the rotating cover is held in place by the cooling apparatus and a load hardware such that the pivot features are disengaged and do not influence a vertical position of the rotating cover. 16 . The electronic assembly according to claim 14 , wherein the rotating cover floats vertically. 17 . The electronic assembly according to claim 14 , wherein the rotating cover comprises alignment features, and opposite edges of the cooling apparatus are captured by the alignment features. 18 . The electronic assembly according to claim 14 , wherein the cooling apparatus is a liquid cold plate comprising an inlet port and an outlet port, and where the inlet port and the outlet port protrude through openings in the rotating cover. 19 . The electronic assembly according to claim 14 , further comprising: an elastomeric material sandwiched between the rotating cover and a load hardware directly above the rotating cover. 20 . The electronic assembly according to claim 14 , further comprising an: elastomeric material sandwiched between the cooling apparatus and the rotating cover.
Assignees
Inventors
Classifications
- H05K7/20254Primary
Cold plates transferring heat from heat source to coolant · CPC title
- H05K5/03Primary
Covers · CPC title
Patent family
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2022418134A1 cover?
- An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes a…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20254. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).