Socket loading element and associated techniques and configurations

Patent metadata

Field	Value
Publication number	US-9848510-B2
Application number	US-201414578037-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Dec 19, 2014
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An apparatus comprising:
a loading element having a profile with at least four connected portions to form an opening to accommodate a die of the apparatus when the loading element is coupled with a socket assembly of the apparatus; and
a heat spreader disposed on the loading element, wherein the heat spreader forms a body having extensions disposed at opposing ends of the body and extending away from the body, wherein the extensions overlay a top surface of the profile of the loading element to couple with respective opposing portions of the loading element, wherein the loading element is to transfer a compressive load from the heat spreader to the socket assembly.

2. The apparatus of claim 1 , wherein the opposing portions of the loading element are to make physical contact with the heat spreader.

3. The apparatus of claim 1 , wherein the loading element is composed of a metal.

4. The apparatus of claim 1 , wherein the profile of the loading element is octagonal.

5. The apparatus of claim 1 , wherein the extensions at a first end of the body of the heat spreader and the extensions at a second end of the body of the heat spreader are in direct physical contact with the opposing portions of the loading element, wherein the first end is opposite the second end.

6. The apparatus of claim 5 , wherein the heat spreader is an integrated heat spreader (IHS).

7. The apparatus of claim 5 , wherein the die is coupled with the heat spreader.

8. The apparatus of claim 7 , further comprising an interposer, wherein the die is electrically coupled with the interposer.

9. The apparatus of claim 8 , wherein the die is electrically coupled with land-grid array (LGA) socket pins of the socket assembly through the interposer.

10. A method comprising: providing a loading element having a profile with at least four connected portions to form an opening to accommodate a die and to transfer a compressive load from a heat spreader to a socket assembly; and coupling the loading element with the heat spreader, the heat spreader forming a body having extensions disposed at opposing ends of the body and extending away from the body, wherein the coupling includes disposing the extensions on a top surface of the profile of the loading element, and connecting the extensions with respective opposing portions of the loading element.

11. The method of claim 10 , wherein providing the loading element comprises:
forming the loading element from sheet metal by stamping or bending the sheet metal.

12. The method of claim 10 , wherein the coupling of the loading element with the heat spreader comprises using a rivet, swage, or press-fit technique.

13. The method of claim 10 , wherein coupling the loading element with the heat spreader comprises coupling the extensions on first and second ends of the heat spreader with a first portion of the loading element, and coupling the extensions on third and fourth ends of the heat spreader with a second portion of the loading element, wherein the first portion is opposite the second portion, wherein the first and second ends are opposite the third and fourth ends.

14. The method of claim 10 , further comprising coupling the die with the heat spreader.

15. The method of claim 14 , further comprising electrically coupling the die with an interposer.

16. The method of claim 15 , further comprising electrically coupling the die with the socket assembly, including coupling the die with land-grid array (LGA) socket pins of the socket assembly.

17. The method of claim 16 , further comprising electrically coupling the die with a motherboard.

18. A system comprising:
a circuit board; and
a package assembly coupled with the circuit board, the package assembly including:
a loading element to transfer a compressive load from a heat spreader to a socket assembly of the system, wherein the loading element has a profile with at least four connected portions to form an opening to accommodate a die when the loading element is coupled with an interposer disposed between the die and the socket assembly; and
a heat spreader disposed on the loading element, wherein the heat spreader forms a body having extensions disposed at opposing ends of the body and extending away from the body, wherein the extensions overlay a top surface of the profile of the loading element to couple with respective opposing portions of the loading element.

19. The system of claim 18 , wherein the extensions on a first end of the body of the heat spreader and the extensions on a second end of the body of the heat spreader are in direct physical contact with opposing portions of the loading element, wherein the first end is opposite the second end, wherein the die is coupled with the heat spreader, wherein the die is electrically coupled with the interposer through a patch structure; and wherein the die is electrically coupled with socket contacts of the socket assembly through the interposer.

20. The system of claim 18 , wherein:
the circuit board is a motherboard; and
the system is a mobile computing device including one or more of an antenna, a display, a touchscreen display, a touchscreen controller, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, a Geiger counter, an accelerometer, a gyroscope, a speaker, or a camera coupled with the circuit board.

Assignees

• Intel Corp

Inventors

• Krithivasan Vijaykumar
• Smalley Jeffory L
• Llapitan David J
• Chawla Gaurav
• Prakash Mani
• Smith Susan F

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W40/10 Primary

  Arrangements for heating · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K2201/10378

  Interposers · CPC title