Manufacturing method for substrate having conductive pattern, manufacturing method for electronic device, substrate having conductive pattern, and protective film for metal nanobody
US-2022400553-A1 · Dec 15, 2022 · US
This page is not indexed by search engines while we improve data quality.
Patent family 84390195
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 84390195 |
| Family type | — |
| Earliest priority | May 31, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2022400553A1 — Manufacturing method for substrate having conductive pattern, manufacturing method for electronic device, substrate having conductive pattern, and protective film for metal nanobody |
Representative publication
Best representative member for this family based on priority and filing country.
US2022400553A1 — Manufacturing method for substrate having conductive pattern, manufacturing method for electronic device, substrate having conductive pattern, and protective film for metal nanobody (published Dec 15, 2022)
Member publications
Related publications in this family.