Organic el display device and manufacturing method therefor
US-2020388661-A1 · Dec 10, 2020 · US
US2022310579A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022310579-A1 |
| Application number | US-202217841247-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 15, 2022 |
| Priority date | Aug 9, 2018 |
| Publication date | Sep 29, 2022 |
| Grant date | — |
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A display device and a method for fabricating the same. The display device includes a substrate including a circuit layer and a first pad unit; an auxiliary substrate disposed below the substrate and comprising a driving circuit and a second pad unit; a light-emitting unit disposed on the circuit layer; and a connection electrode in contact with a side surface of the substrate and electrically connecting the first pad unit with the second pad unit. The method includes forming a circuit layer and a first pad unit on a first surface of a substrate; forming a driving circuit and a second pad unit on a fourth surface of an auxiliary substrate; and attaching a second surface of the substrate opposite the first surface to a third surface of the auxiliary substrate opposite the fourth surface.
Opening claim text (preview).
What is claimed is: 1 . A method of fabricating a display device, the method comprising: forming a circuit layer and a first pad unit on a first surface of a substrate; forming a driving circuit and a second pad unit on a fourth surface of an auxiliary substrate; and attaching a second surface the substrate opposite the first surface to a third surface of the auxiliary substrate opposite the fourth surface. 2 . The method of claim 1 , further comprising a connection electrode that connects the first pad unit with the second pad unit. 3 . The method of claim 2 , further comprising forming a light-emitting unit on the circuit layer. 4 . The method of claim 3 , wherein the auxiliary substrate is made of a glass material. 5 . The method of claim 4 , wherein the light-emitting unit comprises a light-emitting diode. 6 . The method of claim 5 , wherein the light-emitting diode comprises a first semiconductor layer, a second semiconductor layer, and an intermediate layer between the first semiconductor layer and the second semiconductor layer; and a first electrode pad is formed on the first semiconductor layer and a second electrode pad is formed on the second semiconductor layer.
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