Coil component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2022310311-A1
Application number	US-202217695774-A
Country	US
Kind code	A1
Filing date	Mar 15, 2022
Priority date	Mar 27, 2021
Publication date	Sep 29, 2022
Grant date	—

Abstract

A coil component includes a main body made of a magnetic material, a linear inductor wiring conductor arranged in the main body, an electrically insulating pedestal having a top surface extending along the inductor wiring conductor in the main body and a pair of side surfaces each extending from both outer edges of the top surface in a direction intersecting the top surface, and a conductive seed layer provided over an entire region of at least a region sandwiched between the top surface of the pedestal and the inductor wiring conductor. When a width dimension of a surface of the inductor wiring conductor in contact with the seed layer is defined as a first width dimension and a width dimension of the seed layer is defined as a second width dimension, the second width dimension is larger than the first width dimension.

First claim

What is claimed is:

1 . A coil component comprising:
a main body including a magnetic material; a linear inductor wiring conductor arranged in the main body; an electrically insulating pedestal having a top surface extending along the inductor wiring conductor in the main body and a pair of side surfaces each extending from both outer edges of the top surface in a direction intersecting the top surface; and a conductive seed layer over an entire region of at least a region sandwiched between the top surface of the pedestal and the inductor wiring conductor, wherein when a width dimension in a width direction of a surface of the inductor wiring conductor in contact with the seed layer is defined as a first width dimension and a width dimension in the width direction of the seed layer is defined as a second width dimension, the second width dimension is larger than the first width dimension.

2 . The coil component according to claim 1 , further comprising:
an external terminal electrode exposed on an outer surface of the main body; and an extended conductor that is positioned so as to overlap an end portion of the inductor wiring conductor and electrically connects the end portion of the inductor wiring conductor to the external terminal electrode.

3 . The coil component according to claim 1 , wherein
the seed layer is on the top surface and the side surface of the pedestal.

4 . The coil component according to claim 3 , wherein
the seed layer is over an entire region of each of the top surface and the side surface of the pedestal.

5 . The coil component according to claim 3 , wherein
the seed layer has a discontinuous portion on a part of at least one of the top surface and the side surface of the pedestal.

6 . The coil component according to claim 1 , wherein
the seed layer is on the top surface of the pedestal, but is absent from the side surface of the pedestal.

7 . The coil component according to claim 1 , further comprising:
a close contact layer configured to improve a close contact property between the seed layer and the pedestal.

8 . The coil component according to claim 1 , wherein
the inductor wiring conductor and the seed layer include materials having the same main component.

9 . The coil component according to claim 1 , wherein
the pedestal includes resin.

10 . The coil component according to claim 2 , wherein
the seed layer is on the top surface and the side surface of the pedestal.

11 . The coil component according to claim 2 , wherein
the seed layer is on the top surface of the pedestal, but is absent from the side surface of the pedestal.

12 . The coil component according to claim 2 , further comprising:
a close contact layer configured to improve a close contact property between the seed layer and the pedestal.

13 . The coil component according to claim 3 , further comprising:
a close contact layer configured to improve a close contact property between the seed layer and the pedestal.

14 . The coil component according to claim 4 , further comprising:
a close contact layer configured to improve a close contact property between the seed layer and the pedestal.

15 . The coil component according to claim 2 , wherein
the inductor wiring conductor and the seed layer include materials having the same main component.

16 . The coil component according to claim 3 , wherein
the inductor wiring conductor and the seed layer include materials having the same main component.

17 . The coil component according to claim 2 , wherein
the pedestal includes resin.

18 . The coil component according to claim 3 , wherein
the pedestal includes resin.

19 . A method of manufacturing a coil component comprising:
preparing a support substrate having a first main surface and a second main surface opposed to each other; providing an electrically insulating pedestal on the first main surface of the support substrate, with the pedestal having a top surface extending along a linear inductor wiring conductor to be formed and a pair of side surfaces each extending from both outer edges of the top surface in a direction intersecting the top surface; forming a conductive seed layer so as to cover the pedestal and cover the first main surface of the support substrate exposed from the pedestal; providing a first resist on the seed layer, the first resist having an opening that exposes the seed layer on a central portion in a width direction of the top surface of the pedestal; forming an inductor wiring conductor on the seed layer through the opening of the first resist by electrolytic plating; removing the first resist; providing a first magnetic layer on the first main surface side of the support substrate so as to position the inductor wiring conductor inside; removing the support substrate and a portion of the seed layer other than a portion covering the pedestal from the second main surface side of the support substrate; and providing a second magnetic layer which is in contact the pedestal and the first magnetic layer.

20 . The method of manufacturing a coil component according to claim 19 , further comprising:
after removing the first resist, providing a second resist on the seed layer, the second resist having an opening of a pattern corresponding to a pattern of an extended conductor electrically connected to an end portion of the inductor wiring conductor; forming an extended conductor on the end portion of the inductor wiring conductor through the opening of the second resist by electrolytic plating; and removing the second resist, wherein forming of the first magnetic layer is performed such that the first magnetic layer incorporates the inductor wiring conductor and the extended conductor, and the method further includes: after forming the first magnetic layer, scraping the first magnetic layer to expose an end surface of the extended conductor; and forming an external terminal electrode electrically connected to the extended conductor.

Assignees

• Murata Manufacturing Co

Inventors

• Tominaga Ryuichiro
• Kunimori Keisuke
• Kawakami Yuuki
• Yoshioka Yoshimasa

Classifications

• H01F27/2804

  Printed windings · CPC title

• H01F17/04

  with magnetic core · CPC title

• H01F17/0006 Primary

  Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F41/043

  by thick film techniques · CPC title