Hot-melt composition
US-2024059931-A1 · Feb 22, 2024 · US
Resin composition for metal-clad laminates, prepreg, and metal-clad laminate
US2022275195A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022275195-A1 |
| Application number | US-202017632116-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 7, 2020 |
| Priority date | Aug 6, 2019 |
| Publication date | Sep 1, 2022 |
| Grant date | — |
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- Title
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Abstract
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A resin composition for a metal-clad laminate plate includes a block copolymer comprising a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. Further, the resin composition for the metal-clad laminate plate includes polybutadiene having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0.
First claim
Opening claim text (preview).
1 . A resin composition for a metal-clad laminate plate comprising (A) a block copolymer comprising a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. 2 . A resin composition for a metal-clad laminate plate comprising (A) a styrene-butadiene-styrene block copolymer (SBS) having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure in a butadiene block of 80:20 to 100:0. 3 . A resin composition for a metal-clad laminate plate, comprising: (A) a block copolymer comprising a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block, and (B) polybutadiene having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0. 4 . A resin composition for a metal-clad laminate plate, comprising: (A) a styrene-butadiene-styrene block copolymer (SBS) having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure in a butadiene block of 80:20 to 100:0, and (B) polybutadiene having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0. 5 . The resin composition for the metal-clad laminate plate according to claim 1 , wherein a weight ratio of the styrene block to the butadiene block in the component (A) is 10:90 to 80:20. 6 . The resin composition for the metal-clad laminate plate according to claim 1 , wherein a weight average molecular weight (Mw) of the component (A) is 2,000 to 100,000. 7 . The resin composition for the metal-clad laminate plate according to claim 1 , wherein a molecular weight distribution (Mw/Mn) of the component (A) is 1.00 to 3.00. 8 . The resin composition for the metal-clad laminate plate according to claim 3 , wherein a weight average molecular weight (Mn) of the component (B) is 500 to 5,000. 9 . The resin composition for the metal-clad laminate plate according to claim 3 , wherein a content ratio of the component (A) to the component (B) is component (A): component (B)=5:95 to 95:5 in terms of weight ratio. 10 . The resin composition for the metal-clad laminate plate according to claim 1 , further comprising a crosslinking agent. 11 . The resin composition for the metal-clad laminate plate according to claim 1 , further comprising a flame retardant. 12 . A prepreg wherein the resin composition for the metal-clad laminate plate according to claim 1 is impregnated in a base material. 13 . A metal-clad laminate plate produced by laminating the prepreg according to claim 12 and a metal foil by hot press molding.
Assignees
Inventors
Classifications
reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title
containing O · CPC title
Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title
Characterised by the use of homopolymers or copolymers of conjugated diene hydrocarbons · CPC title
of vinyl aromatic monomers and conjugated dienes · CPC title
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- What does patent US2022275195A1 cover?
- A resin composition for a metal-clad laminate plate includes a block copolymer comprising a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. Further, the resin composition for the metal-clad laminate plate includes polybutadiene having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to …
- Who is the assignee on this patent?
- Nippon Soda Co
- What technology area does this patent fall under?
- Primary CPC classification C08L53/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Sep 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).