Laminate and method for producing same

Patent metadata

Field	Value
Publication number	US-2022235468-A1
Application number	US-202017595570-A
Country	US
Kind code	A1
Filing date	Jul 9, 2020
Priority date	Jul 31, 2019
Publication date	Jul 28, 2022
Grant date	—

Abstract

A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

First claim

1 . A laminate comprising a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer,
wherein pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater.

2 . The laminate according to claim 1 , wherein the metallic base material comprises at least a metal selected from the group consisting of stainless steel, iron, aluminum, aluminum alloys, copper, and copper alloys.

3 . The laminate according to claim 1 , having a nickel strike layer between the metallic base material and the nickel-containing plating film layer.

4 . The laminate according to claim 1 , wherein the nickel-containing plating film layer comprises a nickel-phosphorus alloy plating layer (1) having a phosphorus concentration of 8% by mass or higher and lower than 10% by mass, and a nickel-phosphorus alloy plating layer (2) having a phosphorus concentration of 10% by mass or higher and 12% by mass or lower in this order from the metallic base material.

5 . The laminate according to claim 1 , wherein the gold plating film layer comprises a displacement gold plating film layer and a reduction gold plating film layer in this order from the nickel-containing plating film layer.

6 . A constituent member of a semiconductor production device, made up of the laminate according to claim 1 .

7 . A method for producing a laminate, comprising
a step (A) of forming a nickel-containing plating film layer on a metallic base material, a step (B) of forming a gold plating film layer on the nickel-containing plating film layer, and a sealing treatment step (C) of forming a passive film having a thickness of 15 nm or greater on pinholes in the gold plating film layer.

8 . The method for producing a laminate according to claim 7 , wherein the sealing treatment step (C) is performed in an atmosphere in which an oxygen gas concentration is 50% by volume or higher and a temperature is 140° C. to 200° C.

9 . The method for producing a laminate according to claim 7 , wherein the metallic base material comprises at least a metal selected from the group consisting of stainless steel, iron, aluminum, aluminum alloys, copper, and copper alloys.

10 . The method for producing a laminate according to claim 7 , comprising a step of subjecting the metallic base material to a nickel strike treatment under the condition of a current density of 5 to 20 A/dm 2 before the step (A).

11 . The method for producing a laminate according to claim 7 , wherein the step (A) comprises a step (a1) of forming the nickel-phosphorus alloy plating layer (1) having a phosphorus concentration of 8% by mass or higher and lower than 10% by mass, and a step (a2) of forming the nickel-phosphorus alloy plating layer (2) having a phosphorus concentration of 10% by mass or higher and 12% by mass or lower after the step (a1).

12 . The method for producing a laminate according to claim 7 , wherein the step (B) comprises a step (b1) of forming a displacement gold plating film layer, and a step (b2) of forming a reduction gold plating film layer after the step (b1).

Assignees

• Showa Denko Kk

Inventors

• Furuya Akira
• Kojima Tadaaki
• Suzuki Hiroshi
• Naka Fumiaki

Classifications

• C25D3/12

  of nickel or cobalt · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title

• C23C18/44

  using reducing agents · CPC title

• C23C18/36

  using hypophosphites · CPC title

• C23C18/1824

  by chemical pretreatment · CPC title