Optical Systems Fabricated by Printing-Based Assembly

Patent metadata

Field	Value
Publication number	US-2022199606-A1
Application number	US-202217690952-A
Country	US
Kind code	A1
Filing date	Mar 9, 2022
Priority date	Jan 17, 2007
Publication date	Jun 23, 2022
Grant date	—

Abstract

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

First claim

1 - 117 . (canceled)

118 . A display system comprising:
a device substrate; a plurality of semiconductor elements disposed directly on a surface of the device substrate, wherein each semiconductor element of the plurality of semiconductor elements has at least a length or a width less than or equal to 200 microns and a thickness less than or equal to 100 microns, wherein the semiconductor elements are non-native to the device substrate so that the semiconductor elements are separate and independent from the device substrate.

119 . The display system of claim 118 , wherein each semiconductor element of the plurality of semiconductor elements has a thickness no greater than 30 microns.

120 . The display system of claim 118 , wherein each semiconductor element of the plurality of semiconductor elements comprises two electrodes disposed on a common side of the semiconductor element.

121 . The display system of claim 118 , wherein each semiconductor element of the plurality of semiconductor elements comprises an inorganic crystal semiconductor.

122 . The display system of claim 118 , wherein the device substrate is flexible, bendable, shapeable, conformable and/or stretchable.

123 . The display system of claim 118 , wherein the device substrate is rigid.

124 . The display system of claim 118 , wherein at least a portion of a bridge element connects to each semiconductor element of the plurality of semiconductor elements.

125 . The display system of claim 118 , wherein the semiconductor elements of the plurality of semiconductor elements are disposed on the device substrate with a density equal to or greater than 5 elements per millimeter.

126 . The display system of claim 118 , wherein the semiconductor elements of the plurality of semiconductor elements are disposed on the device substrate with a density equal to or greater than 50 elements per millimeter.

127 . The display system of claim 118 , wherein the device substrate has an optical transparency of 50% or greater at a selected wavelength.

128 . The display system of claim 118 , wherein the device substrate comprises glass, polymer, or ceramic.

129 . The display system of claim 118 , wherein the device substrate is a display substrate.

130 . The display system of claim 118 , wherein the device substrate has a contoured conformation.

131 . The display system of claim 118 , wherein each semiconductor element of the plurality of semiconductor elements is micro-transfer printed to the device substrate.

132 . The display system of claim 118 , wherein each semiconductor element of the plurality of semiconductor elements is a light-emitting diode.

133 . The display system of claim 118 , comprising optical components, wherein each of the optical components is aligned with a semiconductor element of the plurality of semiconductor elements.

134 . The display system of claim 133 , wherein each of the optical components is a polymer lens.

135 . The display system of claim 118 , comprising a planarizing layer disposed on the device substrate.

136 . The display system of claim 135 , wherein the semiconductor elements are only partially embedded in the planarizing layer.

137 . The display system of claim 118 , wherein the device substrate and the plurality of semiconductor elements comprise a display.

Assignees

• Univ Illinois
• X Celeprint Ltd

Inventors

• Rogers John A
• Nuzzo Ralph
• Meitl Matthew
• Menard Etienne
• Baca Alfred
• Motala Michael
• Ahn Jong-Hyun
• Park Sang-Il
• Yu Chang-Jae
• Ko Heung Cho
• Stoykovich Mark
• Yoon Jongseung

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W72/07307

  the auxiliary member being a temporary substrate, e.g. a removable substrate · CPC title

• H10W72/0711

  Apparatus therefor · CPC title