Monolithic integration of iii-v cells for powering memory erasure devices
US-2018033906-A1 · Feb 1, 2018 · US
Method for producing electronic device
US2022173089A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022173089-A1 |
| Application number | US-202017600873-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 16, 2020 |
| Priority date | Apr 9, 2019 |
| Publication date | Jun 2, 2022 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
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The present invention is a method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures including a compound semiconductor, the solar cell structures being formed on a starting substrate by epitaxial growth, and a second wafer having a plurality of independent drive circuits formed, so that the plurality of solar cell structures and the plurality of drive circuits are respectively superimposed; wiring the bonded wafer so that electric power can be supplied from the plurality of solar cell structures to the plurality of drive circuits respectively; and producing an electronic device having the drive circuit including the solar cell structure by dicing the bonded wafer. This provides a method for producing an electronic device including a drive circuit and a solar cell structure in one chip and having a suppressed production cost.
First claim
Opening claim text (preview).
1 - 5 . (canceled) 6 . A method for producing an electronic device having a drive circuit comprising a solar cell structure, the method comprising the steps of: obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures comprising a compound semiconductor, the solar cell structures being formed on a starting substrate by epitaxial growth, and a second wafer having a plurality of independent drive circuits formed, so that the plurality of solar cell structures and the plurality of drive circuits are respectively superimposed; wiring the bonded wafer so that electric power can be supplied from the plurality of solar cell structures to the plurality of drive circuits respectively; and producing an electronic device having the drive circuit comprising the solar cell structure by dicing the bonded wafer. 7 . The method for producing an electronic device according to claim 6 , wherein the bonding is carried out using a thermosetting adhesive. 8 . The method for producing an electronic device according to claim 7 , wherein the thermosetting adhesive has a thickness of 2.0 μm or more. 9 . The method for producing an electronic device according to claim 6 , wherein the starting substrate is isolated from the bonded wafer after carrying out the bonding. 10 . The method for producing an electronic device according to claim 7 , wherein the starting substrate is isolated from the bonded wafer after carrying out the bonding. 11 . The method for producing an electronic device according to claim 8 , wherein the starting substrate is isolated from the bonded wafer after carrying out the bonding. 12 . The method for producing an electronic device according to claim 6 , wherein the wiring is carried out by: providing a pad electrode in the second wafer before carrying out the bonding so that electric power can be supplied to the drive circuit; forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that electric power can be extracted from the solar cell structure of the first wafer; and electrically connecting the pad electrode and the electrode for a solar cell structure. 13 . The method for producing an electronic device according to claim 7 , wherein the wiring is carried out by: providing a pad electrode in the second wafer before carrying out the bonding so that electric power can be supplied to the drive circuit; forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that electric power can be extracted from the solar cell structure of the first wafer; and electrically connecting the pad electrode and the electrode for a solar cell structure. 14 . The method for producing an electronic device according to claim 8 , wherein the wiring is carried out by: providing a pad electrode in the second wafer before carrying out the bonding so that electric power can be supplied to the drive circuit; forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that electric power can be extracted from the solar cell structure of the first wafer; and electrically connecting the pad electrode and the electrode for a solar cell structure. 15 . The method for producing an electronic device according to claim 9 , wherein the wiring is carried out by: providing a pad electrode in the second wafer before carrying out the bonding so that electric power can be supplied to the drive circuit; forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that electric power can be extracted from the solar cell structure of the first wafer; and electrically connecting the pad electrode and the electrode for a solar cell structure. 16 . The method for producing an electronic device according to claim 10 , wherein the wiring is carried out by: providing a pad electrode in the second wafer before carrying out the bonding so that electric power can be supplied to the drive circuit; forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that electric power can be extracted from the solar cell structure of the first wafer; and electrically connecting the pad electrode and the electrode for a solar cell structure. 17 . The method for producing an electronic device according to claim 11 , wherein the wiring is carried out by: providing a pad electrode in the second wafer before carrying out the bonding so that electric power can be supplied to the drive circuit; forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that electric power can be extracted from the solar cell structure of the first wafer; and electrically connecting the pad electrode and the electrode for a solar cell structure.
Assignees
Inventors
Classifications
between stacked chips · CPC title
the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title
hardening the adhesive by curing, e.g. thermosetting · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
On different surfaces · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2022173089A1 cover?
- The present invention is a method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures including a compound semiconductor, the solar cell structures being formed on a starting substrate by epitaxial growth, and a seco…
- Who is the assignee on this patent?
- Shinetsu Handotai Kk
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jun 02 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).