Semiconductor device package and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2022130776-A1
Application number	US-202017078070-A
Country	US
Kind code	A1
Filing date	Oct 22, 2020
Priority date	Oct 22, 2020
Publication date	Apr 28, 2022
Grant date	—

Abstract

A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

First claim

What is claimed is:

1 . A semiconductor device package, comprising:
an electronic component having a first surface and a second surface; and a substrate connected to the first surface of the electronic component through an adhesive layer, wherein the substrate comprises a first antenna disposed over the second surface of the electronic components through the adhesive layer.

2 . The semiconductor device package of claim 1 , wherein the substrate further comprises a third surface and a second antenna disposed over the third surface through the adhesive layer.

3 . The semiconductor device package of claim 1 , wherein the substrate includes a flexible printed circuit board.

4 . The semiconductor device package of claim 2 , wherein the substrate comprises at least a bending portion located between the first antenna and the second antenna.

5 . The semiconductor device package of claim 4 , wherein the substrate comprises an opening to expose the corresponding bending portion.

6 . The semiconductor device package of claim 1 , wherein a signal transmission path from the first antenna to the electronic component includes an interconnection structure of the substrate and an active surface of the electronic component, and the signal transmission path is along a lateral surface of the electronic component.

7 . The semiconductor device package of claim 2 , wherein the substrate further comprises:
a first circuit layer in contact with the adhesive layer; a dielectric layer in contact with the first circuit layer, wherein the first antenna and the second antenna are in contact with the dielectric layer.

8 . The semiconductor device package of claim 7 , wherein a dielectric constant (Dk) or a dielectric loss tangent (Df) of the dielectric layer is less than a Dk or a Df of the first surface and the second surface of the electronic component.

9 . The semiconductor device package of claim 1 , wherein the substrate is conformally disposed on at least four surfaces of the electronic component.

10 . The semiconductor device package of claim 2 , wherein
the first antenna and the second antenna are spaced apart from each other; and the first antenna and the second antenna are configured to radiate electromagnetic waves in different directions.

11 . A semiconductor device package, comprising:
an electronic component having a first surface and an active surface adjacent to the first surface; and a substrate connected to the electronic component and having an interconnection structure, wherein the substrate comprises a first antenna disposed over the first surface of the electronic components, and wherein a signal transmission path from the first antenna to the electronic component includes the first surface of the electronic component, the interconnection structure of the substrate, and an active surface of the electronic component.

12 . The semiconductor device package of claim 11 , further comprising an adhesive layer connecting the electronic component with the substrate.

13 . The semiconductor device package of claim 11 , wherein the substrate comprises a second antenna disposed over a second surface of the electronic components and a bending portion separate the first antenna from the second antenna.

14 . The semiconductor device package of claim 13 , wherein the substrate comprises an opening to expose the bending portion.

15 . The semiconductor device package of claim 12 , wherein the electronic component has a conductive element on the active surface, and the conductive element penetrates the adhesive layer.

16 . A method of manufacturing a semiconductor device package, comprising:
(a) providing a flexible substrate having a first antenna; (b) attaching an electronic component to the flexible substrate through an adhesive layer; and (c) bending the flexible substrate to align the first antenna with a first surface of the electronic component.

17 . The method of claim 16 , further comprising: (d) attaching a second surface of the electronic component to the flexible substrate through the adhesive layer.

18 . The method of claim 17 , wherein operation (d) further comprises attaching a second antenna of the flexible substrate to the second surface of the electronic component.

19 . The method of claim 16 , further comprising connecting a conductive element of the electronic component with the flexible substrate by penetrating the adhesive layer.

20 . The method of claim 19 , further comprising performing a reflow operation after the flexible substrate has been fully connected to the electronic component.

Assignees

• Advanced Semiconductor Eng

Inventors

• Lu wen-long

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W44/248

  for antennas · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title