Workpiece grinding method

US2022016741A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2022016741-A1
Application numberUS-202117347765-A
CountryUS
Kind codeA1
Filing dateJun 15, 2021
Priority dateJul 16, 2020
Publication dateJan 20, 2022
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A workpiece grinding method includes a groove formation step, a groove removal step, and a full surface grinding step. In the groove formation step, the workpiece is ground by performing grinding feed of a grinding unit while rotating a spindle without rotation of a chuck table, so that an arcuate groove is formed with a depth not reaching a finish thickness on a side of a back surface of the workpiece. In the groove removal step, rotation of the chuck table is started with the spindle kept rotating, so that the groove is ground at side walls thereof and is removed from the workpiece. In the full surface grinding step, grinding feed of the grinding unit is performed while the spindle and chuck table are rotated, so that the workpiece is ground in an entirety thereof on the side of the back surface until the workpiece has the finish thickness.

First claim

Opening claim text (preview).

What is claimed is: 1 . A workpiece grinding method for grinding a workpiece with use of a grinding machine including a chuck table that holds the workpiece and a grinding unit that has a spindle and a grinding wheel disposed on the spindle, the grinding wheel having a plurality of grinding stones arranged in an annular pattern, and that grinds the workpiece held on the chuck table with the grinding wheel kept rotating about the spindle, comprising: a groove formation step of grinding the workpiece by performing grinding feed of the grinding unit while rotating the spindle without rotation of the chuck table on which the workpiece is held, so that an arcuate groove is formed with a depth not reaching a finish thickness of the workpiece on a side of a back surface of the workpiece; a groove removal step of, after the groove formation step, starting rotation of the chuck table with the spindle kept rotating, so that the groove is ground at side walls thereof and is removed from the workpiece; and a full surface grinding step of, after the groove removal step, performing grinding feed of the grinding unit while rotating the spindle and the chuck table, so that the workpiece is ground in an entirety thereof on the side of the back surface until the workpiece has the finish thickness. 2 . The workpiece grinding method according to claim 1 , wherein, in the groove removal step, the chuck table is rotated while grinding feed of the grinding unit is performed.

Assignees

Inventors

Classifications

  • Accessories therefor · CPC title

  • grinding machines with a plurality of working posts · CPC title

  • Table-like supports for panels, sheets or the like · CPC title

  • with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means (see also B24B27/0023, B24B7/16) · CPC title

  • B24B19/02Primary

    for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements · CPC title

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What does patent US2022016741A1 cover?
A workpiece grinding method includes a groove formation step, a groove removal step, and a full surface grinding step. In the groove formation step, the workpiece is ground by performing grinding feed of a grinding unit while rotating a spindle without rotation of a chuck table, so that an arcuate groove is formed with a depth not reaching a finish thickness on a side of a back surface of the w…
Who is the assignee on this patent?
Disco Corp
What technology area does this patent fall under?
Primary CPC classification B24B19/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jan 20 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).