Substrate processing module and method of moving a workpiece

Patent metadata

Field	Value
Publication number	US-2022013383-A1
Application number	US-202016923792-A
Country	US
Kind code	A1
Filing date	Jul 8, 2020
Priority date	Jul 8, 2020
Publication date	Jan 13, 2022
Grant date	—

Abstract

Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

First claim

What is claimed is:

1 . A substrate processing module, comprising:
a shutter stack configured to store one or more workpieces, the one or more workpieces comprising one or more of substrates or shutter discs, the shutter stack comprising:
a shutter base;
one or more shutter disc supports coupled to the shutter base, each of the one or more shutter disc supports configured to support a shutter disc; and
a substrate support coupled to the shutter base, the substrate support configured to support a substrate; and
two process stations, the shutter stack disposed between the processing stations.

2 . The substrate processing module of claim 1 , wherein the shutter stack further comprises:
a shutter actuator coupled to the shutter base, the shutter actuator configured to move the shutter base.

3 . The substrate processing module of claim 1 , wherein each of the process stations comprise a source assembly.

4 . The substrate processing module of claim 3 , wherein the source assembly comprises a target, a magnetron assembly, a lid, and a sputtering power supply.

5 . A substrate processing module, comprising:
a shutter stack configured to store one or more workpieces, the one or more workpieces comprising one or more of substrates or shutter discs, the shutter stack comprising:
a shutter base;
one or more shutter disc supports coupled to the shutter base, each of the one or more shutter disc supports configured to support a shutter disc; and
a substrate support coupled to the shutter base, the substrate support configured to support a substrate;
two process stations, the shutter stack disposed between the process stations; and a central transfer robots comprising one or more supporting portions configured to transfer at least one of the one or more workpieces from the shutter stack to one of the process stations.

6 . The substrate processing module of claim 5 , wherein the shutter stack further comprises:
a shutter actuator coupled to the shutter base, the shutter actuator configured to move the shutter base.

7 . The substrate processing module of claim 5 , wherein each of the process stations comprise a source assembly.

8 . The substrate processing module of claim 7 , wherein the source assembly comprises a target, a magnetron assembly, a lid, and a sputtering power supply.

9 . The substrate processing module of claim 5 , wherein each of the one or more supporting portions are configured to grasp the substrate and the shutter disc.

10 . The transfer chamber assembly of claim 9 , wherein each of the supporting portions comprise a supporting portion actuator configured to move the supporting portion with respect to the central transfer robot.

11 . A method of moving a workpiece, comprising:
moving a supporting portion from a first location to a shutter stack in a first direction; retrieving the workpiece from the shutter stack, wherein the workpiece is a substrate or a shutter disc; and moving the supporting portion to a second location.

12 . The method of claim 11 , wherein the supporting portion is configured to grasp the substrate and the shutter disc.

13 . The method of claim 11 , wherein the second location comprises a process station.

14 . The method of claim 13 , wherein the process station comprises:
a top apparatus; and an upper chamber.

15 . The method of claim 11 , wherein the supporting portion comprises a supporting portion actuator, and the retrieving the workpiece comprises:
moving the supporting portion in a second direction perpendicular to the first direction.

16 . The method of claim 15 , wherein the retrieving the workpiece from the shutter stack comprises either:
(1) retrieving the shutter disc from the shutter stack; or (2) retrieving the substrate from the shutter stack, wherein the retrieving the shutter disc and the retrieving the substrate are performed at a different elevation in the second direction.

17 . The method of claim 11 , wherein the shutter stack comprises:
a shutter base; and a shutter actuator coupled to the shutter base, the shutter actuator configured to move the shutter base in a second direction perpendicular to the first direction.

18 . The method of claim 17 , wherein the shutter stack further comprises:
one or more shutter disc supports coupled to the shutter base, each of the one or more shutter disc supports configured to support a shutter disc; and a substrate support coupled to the shutter base, the substrate support configured to support a substrate.

19 . The method of claim 18 , wherein the retrieving the workpiece from the shutter stack comprises either:
(1) retrieving the shutter disc from the shutter stack; or (2) retrieving the substrate from the shutter stack, wherein the retrieving the shutter disc and the retrieving the substrate are performed at a different elevation in the second direction.

20 . The method of claim 18 , wherein the supporting portion comprises:
a first grasper; and a second grasper.

Assignees

• Applied Materials Inc

Inventors

• Savandaiah Kirankumar Neelasandra
• Yedla Srinivasa Rao
• Brezoczky Thomas

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3402

  Mechanical parts of transfer devices · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• H10P72/0454

  surrounding a central transfer chamber · CPC title