Processing method of wafer

Patent metadata

Field	Value
Publication number	US-2021391217-A1
Application number	US-202117330590-A
Country	US
Kind code	A1
Filing date	May 26, 2021
Priority date	Jun 10, 2020
Publication date	Dec 16, 2021
Grant date	—

Abstract

There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom surface of the recess part, a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into plural device chips and form grooves on the front surface side of the reinforcing part, and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being the points of origin by giving an external force to the reinforcing part.

First claim

What is claimed is:

1 . A processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of a plurality of regions marked out by a plurality of planned dividing lines arranged in a lattice manner to intersect each other and includes a recess part formed in a region corresponding to the device region on a back surface side and includes an annular reinforcing part that surrounds the device region and the recess part at a peripheral part, the processing method of a wafer comprising:
a tape sticking step of sticking an adhesive tape to the back surface side of the wafer along the recess part and the reinforcing part; a holding step of holding a bottom surface of the recess part by a first chuck table with intervention of the adhesive tape; a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into a plurality of device chips and form grooves on the front surface side of the reinforcing part; and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being points of origin by giving an external force to the reinforcing part.

2 . The processing method of a wafer according to claim 1 , wherein,
in the dividing step, by sucking the adhesive tape by a second chuck table having recesses and projections at a position corresponding to the reinforcing part of the wafer in a state in which the wafer is supported by the second chuck table, the adhesive tape is disposed along the recesses and projections to divide the reinforcing part.

3 . The processing method of a wafer according to claim 1 , further comprising:
a separation step of separating the device region and the reinforcing part by annularly cutting a peripheral part of the device region by the cutting blade after execution of the holding step and before execution of the dividing step.

4 . The processing method of a wafer according to claim 1 , further comprising:
a reinforcing part removal step of removing the reinforcing part by jetting fluid to the reinforcing part after execution of the dividing step.

5 . The processing method of a wafer according to claim 4 , wherein
the fluid is jetted from a center side of the wafer toward a peripheral side of the wafer.

6 . The processing method of a wafer according to claim 4 , wherein
the fluid is mixed fluid containing a gas and a liquid.

7 . The processing method of a wafer according to claim 4 , wherein
the fluid is a liquid.

8 . The processing method of a wafer according to claim 1 , further comprising:
a scribed line forming step of forming a plurality of scribed lines in the reinforcing part along a radial direction of the reinforcing part after execution of the cutting step and before execution of the dividing step.

Assignees

• Disco Corp

Inventors

• Okamura Takashi
• Harada Shigenori
• Takita Tomoharu

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10W46/503

  Located in scribe lines · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title