Method and apparatus for inspection

Patent metadata

Field	Value
Publication number	US-2021375581-A1
Application number	US-202117403006-A
Country	US
Kind code	A1
Filing date	Aug 16, 2021
Priority date	Dec 24, 2015
Publication date	Dec 2, 2021
Grant date	—

Abstract

An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns, the actuator system including a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.

First claim

1 .- 15 . (canceled)

16 . An electron beam inspection apparatus comprising:
a plurality of electron beam columns arranged in an array of one or more rows and one or more columns, each electron beam column configured to provide a multi-beam of electron beams to an object, the object having a plurality of separate fields or dies, each field or die having a boundary to enable separation of the object into pieces; and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns, wherein each electron beam column in a row in the array and in a column of the array inspects a portion of the object and the actuator system is configured to move the one or more of the electron beam columns relative to another so that each electron beam column is aligned with its portion.

17 . The inspection apparatus of claim 16 , wherein all optical components or structures of each electron beam column are electrostatic electron-optical components or structures.

18 . The inspection apparatus of claim 16 , wherein the portion is at least part of a die so that each electron beam column in a row in the array and in a column of the array inspects at least a portion of its at least part of a die.

19 . The inspection apparatus of claim 18 , wherein the columns are configured to be at a distance apart corresponding to a distance between adjacent dies on the object.

20 . The inspection apparatus of claim 16 , wherein each column comprises a detector configured to measure secondary or scattered electrons from the object.

21 . The inspection apparatus of claim 16 , wherein the array is a two dimensional array.

22 . The inspection apparatus of claim 16 , wherein a selection of the plurality of separate fields or dies are inspected in parallel by a selection of the beams in their respective fields of view, or wherein a selection of a plurality of beams are projected at the object at a same time such that each beam inspects a respective field or die, such that each electron beam column scans a same portion of its respective field or die at the same time.

23 . The inspection apparatus of claim 16 , wherein the number of electron beam columns corresponds to the number of fields or dies.

24 . The inspection apparatus of claim 16 , wherein the actuator is arranged to change a pitch of at least two of the electron beam columns.

25 . The inspection apparatus of claim 16 , wherein each electron beam column has an identical, or nearly identical, datapath.

26 . The inspection apparatus of claim 16 , wherein at least one of the electron beam columns in a row or column has its position adjusted independent of one or more other electron beam columns in that row or column.

27 . The inspection apparatus of claim 16 , wherein a portion of each field or die is inspected.

28 . An electron beam inspection apparatus comprising:
a plurality of electron beam columns arranged in an array of one or more rows and one or more columns, each electron beam column configured to provide a multi-beam of electron beams to an object, the object having a plurality of separate fields or dies, each field or die having a boundary to enable separation of the object into pieces; and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns, wherein each electron beam column is arranged to scan a same portion of a respective field or die at a same time when the electron beams are scanned relative to the object.

29 . The inspection apparatus of claim 28 , wherein each portion corresponds to a different die on the object.

30 . The inspection apparatus of claim 28 , wherein all optical components or structures of each electron beam column are electrostatic electron-optical components or structures.

31 . The inspection apparatus of claim 28 , wherein the portion is at least part of a die so that each electron beam column in a row in the array and in a column of the array inspects at least a portion of its at least part of a die.

32 . The inspection apparatus of claim 31 , wherein the columns are configured to be at a distance apart corresponding to a distance between adjacent dies on the object.

33 . The inspection apparatus of claim 28 , wherein each electron beam column comprises a detector configured to measure secondary or scattered electrons from the object.

34 . The inspection apparatus of claim 28 , wherein the array is a two dimensional array.

35 . The inspection apparatus of claim 28 , wherein the number of electron beam columns corresponds to the number of fields or dies.

36 . The inspection apparatus of claim 28 , wherein the actuator is arranged to change a pitch of at least two of the electron beam columns.

37 . The inspection apparatus of claim 28 , wherein each electron beam column has an identical, or nearly identical, datapath.

Assignees

• Asml Netherlands Bv

Inventors

• Kastrup Bernardo
• Mulkens Johannes Catharinus Hubertus
• Van Den Brink Marinus Aart
• Benschop Jozef Petrus Henricus
• Smakman Erwin Paul
• Druzhinina Tamara
• Verschuren Coen Adrianus

Classifications

• H01J37/244

  Detectors; Associated components or circuits therefor · CPC title

• H01J37/28

  with scanning beams {(H01J37/268, H01J37/292, H01J37/2955 take precedence)} · CPC title

• H01J2237/0245

  Moving whole optical system relatively to object · CPC title

• H01J37/023 Primary

  Means for mechanically adjusting components not otherwise provided for · CPC title

• H01J37/22

  Optical {, image processing} or photographic arrangements associated with the tube · CPC title