Package comprising multi-level vertically stacked redistribution portions

Patent metadata

Field	Value
Publication number	US-2021351145-A1
Application number	US-202016868349-A
Country	US
Kind code	A1
Filing date	May 6, 2020
Priority date	May 6, 2020
Publication date	Nov 11, 2021
Grant date	—

Abstract

A package that includes a first redistribution portion, a second redistribution portion, a third redistribution portion, a first encapsulation layer coupled to the first redistribution portion and the third redistribution portion, a first discrete device encapsulated by the first encapsulation layer, wherein the first discrete device is located between the first redistribution portion and the third redistribution portion, a second encapsulation layer coupled to the first redistribution portion and the second redistribution portion, and a second discrete device encapsulated by the second encapsulation layer, wherein the second discrete device is located between the first redistribution portion and the second redistribution portion.

First claim

What is claimed is:

1 . A package comprising:
a first redistribution portion; a second redistribution portion; a third redistribution portion; a first encapsulation layer coupled to the first redistribution portion and the third redistribution portion; a first discrete device encapsulated by the first encapsulation layer, wherein the first discrete device is located between the first redistribution portion and the third redistribution portion; a second encapsulation layer coupled to the first redistribution portion and the second redistribution portion; and a second discrete device encapsulated by the second encapsulation layer, wherein the second discrete device is located between the first redistribution portion and the second redistribution portion.

2 . The package of claim 1 , further comprising a third discrete device located at least laterally to the first redistribution portion, wherein the third discrete device is located between the second redistribution portion and the third redistribution portion.

3 . The package of claim 2 , wherein the third discrete device is encapsulated by at least the first encapsulation layer and/or the second encapsulation layer.

4 . The package of claim 1 , further comprising:
a fourth redistribution portion; a third encapsulation layer coupled to the third redistribution portion and the fourth redistribution portion; and a third discrete device encapsulated by the third encapsulation layer, wherein the third discrete device is located between the third redistribution portion and the fourth redistribution portion.

5 . The package of claim 4 , further comprising a fourth discrete device located at least laterally to the first redistribution portion, wherein the fourth discrete device is located between the second redistribution portion and the third redistribution portion.

6 . The package of claim 5 ,
wherein the first redistribution portion comprises:
at least one first dielectric layer; and
a first plurality of redistribution interconnects,
wherein the second redistribution portion comprises:
at least one second dielectric layer; and
a second plurality of redistribution interconnects,
wherein the third redistribution portion comprises:
at least one third dielectric layer; and
a third plurality of redistribution interconnects, and
wherein the fourth redistribution portion comprises:
at least one fourth dielectric layer; and
a fourth plurality of redistribution interconnects.

7 . The package of claim 6 , wherein at least one redistribution interconnect from the first plurality of redistribution interconnects, the second plurality of redistribution interconnects, the third plurality of redistribution interconnects, and/or the fourth plurality of redistribution interconnects comprises a thickness of approximately 5-10 micrometers (μm).

8 . The package of claim 6 , wherein at least one redistribution interconnects from the first plurality of redistribution interconnects, the second plurality of redistribution interconnects, the third plurality of redistribution interconnects, and/or the fourth plurality of redistribution interconnects comprises a U-shape interconnect and/or V-shape interconnect.

9 . The package of claim 1 ,
wherein the first discrete device includes a first integrated device or a first passive device, and wherein the second discrete device includes a second integrated device or a second passive device.

10 . The package of claim 1 , wherein the package is a first package from a package on package (PoP).

11 . The package of claim 1 , wherein the package is incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.

12 . An apparatus comprising:
means for first redistribution; means for second redistribution; means for third redistribution; means for first encapsulation coupled to the means for first redistribution and the means for third redistribution; a first discrete device encapsulated by the means for first encapsulation, wherein the first discrete device is located between the means for first redistribution and the means for third redistribution; means for second encapsulation coupled to the means for first redistribution and the means for second redistribution; and a second discrete device encapsulated by the means for second encapsulation, wherein the second discrete device is located between the means for first redistribution and the means for second redistribution.

13 . The apparatus of claim 12 , further comprising a third discrete device located at least laterally to the means for first redistribution, wherein the third discrete device is located between the means for second redistribution and the means for third redistribution.

14 . The apparatus of claim 13 , wherein the third discrete device is encapsulated by at least the means for first encapsulation and/or the means for second encapsulation.

15 . The apparatus of claim 12 , further comprising:
means for fourth redistribution; means for third encapsulation coupled to the means for third redistribution and the means for fourth redistribution; and a third discrete device encapsulated by the means for third encapsulation, wherein the third discrete device is located between the means for third redistribution and the means for fourth redistribution.

16 . The apparatus of claim 15 , further comprising a fourth discrete device located at least laterally to the means for first redistribution, wherein the fourth discrete device is located between the means for second redistribution and the means for third redistribution.

17 . The apparatus of claim 16 ,
wherein the means for first redistribution comprises a first plurality of redistribution interconnects, wherein the means for second redistribution comprises a second plurality of redistribution interconnects, wherein the means for third redistribution comprises a third plurality of redistribution interconnects, and wherein the means for fourth redistribution comprises a fourth plurality of redistribution interconnects.

18 . The apparatus of claim 17 , wherein at least one redistribution interconnects from the first plurality of redistribution interconnects, the second plurality of redistribution interconnects, the third plurality of redistribution interconnects, and/or the fourth plurality of redistribution interconnects comprises a U-shape interconnect and/or V-shape interconnect.

19 . The apparatus of claim 12 ,
wherein the first discrete device includes a first integrated device or a first passive device, and wherein the second discrete device includes a second integrated device or a second passive device.

20 . The apparatus of claim 12 , wherein the apparatus is incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.

21

Assignees

• Qualcomm Inc

Inventors

• Patil Aniket
• Rae David Fraser
• We Hong Bok

Classifications

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title