Module

Patent metadata

Field	Value
Publication number	US-2021350196-A1
Application number	US-202117380212-A
Country	US
Kind code	A1
Filing date	Jul 20, 2021
Priority date	Jan 30, 2019
Publication date	Nov 11, 2021
Grant date	—

Abstract

A module (101) includes: a substrate (1) having a first main surface (1a); a first sealing resin (6a) disposed to cover the first main surface (1a); a shielding film (8) that covers an upper surface and a side surface of the first sealing resin (6a); and two or more RFID tags (41, 42) sealed in the first sealing resin (6a) with the two or more RFID tags (41, 42) being not electrically connected to the substrate (1). The two or more RFID tags (41, 42) are disposed such that communication surfaces of the two or more RFID tags (41, 42) are oriented in different directions. The shielding film (8) is provided with an opening or notch at a portion facing each of the communication surfaces of the two or more RFID tags (41, 42).

First claim

1 . A module comprising:
a substrate having a first main surface; a first sealing resin disposed to cover the first main surface; a shielding film covering an upper surface and a side surface of the first sealing resin; and two or more RFID tags sealed in the first sealing resin with the two or more RFID tags being not electrically connected to the substrate, wherein the two or more RFID tags are disposed such that communication surfaces of the two or more RFID tags are oriented in different directions, and the shielding film is provided with an opening or notch at a portion facing each of the communication surfaces of the two or more RFID tags.

2 . A module comprising:
a substrate having a first main surface; a first sealing resin disposed to cover the first main surface; a shielding film covering an upper surface and a side surface of the first sealing resin; two or more RFID tags sealed in the first sealing resin with the two or more RFID tags being not electrically connected to the substrate; and a shielding wall provided to stand on the first main surface between the two or more RFID tags, wherein the shielding film is provided with an opening or notch at a portion facing each of communication surfaces of the two or more RFID tags.

3 . The module according to claim 1 , wherein the two or more RFID tags have the same corresponding frequency.

4 . A module comprising:
a substrate having a first main surface and a second main surface, a GND layer being included in the substrate; a first sealing resin disposed to cover the first main surface; a second sealing resin disposed to cover the second main surface; a shielding film covering at least an upper surface and a side surface of the first sealing resin and a side surface of the second sealing resin; a first RFID tag sealed in the first sealing resin with the first RFID tag being not electrically connected to the substrate; and a second RFID tag sealed in the second sealing resin with the second RFID tag being not electrically connected to the substrate, wherein the first RFID tag and the second RFID tag are electromagnetically shielded from each other by the GND layer, and the shielding film is provided with an opening or notch at a portion facing each of communication surfaces of the first RFID tag and the second RFID tag.

5 . The module according to claim 4 , wherein the first RFID tag and the second RFID tag have the same corresponding frequency.

6 . The module according to claim 1 , wherein each of the RFID tags is a passive type RFID tag.

7 . The module according to claim 4 , wherein each of the first RFID tag and the second RFID tag is a passive type RFID tag.

8 . The module according to claim 2 , wherein the two or more RFID tags have the same corresponding frequency.

9 . The module according to claim 2 , wherein each of the RFID tags is a passive type RFID tag.

10 . The module according to claim 3 , wherein each of the RFID tags is a passive type RFID tag.

11 . The module according to claim 5 , wherein each of the first RFID tag and the second RFID tag is a passive type RFID tag.

Assignees

• Murata Manufacturing Co

Inventors

• Yoshimori Hiroki

Classifications

• H10W44/241

  for passive devices or passive elements · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W42/273

  the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title