Method of manufacturing dielectric film

Patent metadata

Field	Value
Publication number	US-2021305493-A1
Application number	US-202117146841-A
Country	US
Kind code	A1
Filing date	Jan 12, 2021
Priority date	Mar 31, 2020
Publication date	Sep 30, 2021
Grant date	—

Abstract

A method of manufacturing a dielectric film includes the steps of: adjusting a particle size distribution of particles of a dielectric substance to fall within a specified range; kneading the particles having the adjusted particle size distribution and a dispersion medium to obtain a slurry; and forming the slurry into a film shape to obtain a film-like compact.

First claim

1 . A method of manufacturing a dielectric film, the method comprising the steps of:
adjusting a particle size distribution of particles of a dielectric substance to fall within a specified range; kneading the particles having the adjusted particle size distribution and a dispersion medium to obtain a slurry; and forming the slurry into a film shape to obtain a film-like compact.

2 . The method of manufacturing a dielectric film according to claim 1 , wherein in the adjusting step, the particle size distribution of the particles of the dielectric substance is adjusted such that D50 falls within the range of from 0.5 μm to 0.7 μm.

3 . The method of manufacturing a dielectric film according to claim 1 , wherein
in the adjusting step, the particles of the dielectric substance are calcined to at least partially fuse the particles to each other.

4 . The method of manufacturing a dielectric film according to claim 3 , wherein the particles are calcined at a temperature of from 800° C. to 1000° C.

5 . The method of manufacturing a dielectric film according to claim 1 , further comprising a step of sintering the film-like compact.

6 . The method of manufacturing a dielectric film according to claim 1 , wherein the dispersion medium is a solution in which a resin is dissolved in an organic solvent.

7 . The method of manufacturing a dielectric film according to claim 6 , wherein the resin contains polyvinyl butyral.

8 . The method of manufacturing a dielectric film according to claim 6 , wherein the organic solvent contains butanol.

9 . The method of manufacturing a dielectric film according to claim 6 , wherein a concentration of the resin in the solution is from 10 wt. % to 20 wt. %.

10 . The method of manufacturing a dielectric film according to claim 1 , wherein the dispersion medium does not contain a sol component as a binder.

11 . The method of manufacturing a dielectric film according to claim 1 , wherein
in the forming step, the film-like compact having a film thickness of from 60 μm to 80 μm is formed.

12 . The method of manufacturing a dielectric film according to claim 1 , wherein
in the forming step, the slurry is formed into a film shape by using a screen printing method.

13 . The method of manufacturing a dielectric film according to claim 1 , wherein
in the forming step, the slurry is formed into a film shape by using a stencil printing method.

14 . The method of manufacturing a dielectric film according to claim 1 , wherein
the dielectric film is a dielectric film for a piezoelectric body of an ultrasonic sensor, and the forming step includes a step of forming the film-like compact on a surface of an inspection object to be inspected by the ultrasonic sensor and sintering the film-like compact on the surface of the inspection object.

15 . The method of manufacturing a dielectric film according to claim 1 , wherein
in the forming step, the film-like compact is formed on a release sheet.

16 . The method of manufacturing a dielectric film according to claim 15 , wherein
the dielectric film is a dielectric film for a piezoelectric body of an ultrasonic sensor, and the method further includes the steps of: attaching the film-like compact that has been peeled off from the release sheet to a surface of an inspection object to be inspected by the ultrasonic sensor; and sintering the film-like compact on the surface of the inspection object.

Assignees

• Mitsubishi Heavy Ind Ltd

Inventors

• Tsuru Yasuhiko
• Yamamoto Yuko
• Nakano Takashi
• JINNO Kentaro
• Fukuyama Misaki
• Asai Yuki

Classifications

• H10N30/097

  by sintering · CPC title

• H10N30/092

  Forming composite materials · CPC title

• H10N30/081

  by coating or depositing using masks, e.g. lift-off · CPC title

• H10N30/053

  by integrally sintering piezoelectric or electrostrictive bodies and electrodes · CPC title

• G01B17/02 Primary

  for measuring thickness · CPC title