Magnetoelectric composite material and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2020091405-A1
Application number	US-201816189960-A
Country	US
Kind code	A1
Filing date	Nov 13, 2018
Priority date	Sep 19, 2018
Publication date	Mar 19, 2020
Grant date	—

Abstract

A method of manufacturing a magnetoelectric composite material having a 0-3 type connectivity is provided. The manufacturing method includes manufacturing a slurry including an alignment material including one material selected from among a magnetostrictive material and a piezoelectric material. The slurry further comprises a seed composition comprising the other material from the magnetostrictive material and the piezoelectric material. The method further comprises molding the manufactured slurry to manufacture a molding material, and plasticizing and firing the molding material.

First claim

What is claimed is:

1 . A method of manufacturing a magnetoelectric composite material having a 0-3 type connectivity, the method comprising:
manufacturing a slurry comprising an alignment material composition that comprises a first material selected from a magnetostrictive material and a piezoelectric material, wherein the alignment material composition further comprises a seed composition comprising a second material that is not selected as the first material from the magnetostrictive material and the piezoelectric material; molding the manufactured slurry to manufacture a molding material; and plasticizing and firing the molding material.

2 . The method of claim 1 , wherein the alignment material composition comprises the piezoelectric material and wherein the seed composition comprises the magnetostrictive material.

3 . The method of claim 2 , wherein the seed composition is 1 to 50 parts by weight with respect to 100 parts by weight of the alignment material composition.

4 . The method of claim 1 , wherein the alignment material composition comprises the magnetostrictive material and wherein the seed composition comprises the piezoelectric material.

5 . The method of claim 1 , wherein the seed composition comprises a seed material having a particle structure of one selected from a plate shape, an acicular shape, and a rod shape.

6 . The method of claim 5 , wherein the manufacturing of the slurry comprises mixing the alignment material composition, the seed composition, a dispersing agent, a bonding agent, and a plasticizing agent by using a milling process including no ball in a state of maintaining the shape.

7 . The method of claim 1 , wherein the manufacturing of the molding material comprises manufacturing the molding material having a sheet type by using a tape casting process.

8 . The method of claim 7 , wherein a thickness of the molding material manufactured by the tape casting process is 20 μm to 100 μm.

9 . The method of claim 1 , wherein the plasticizing and firing of the molding material comprises:
heating the molding material at a temperature of 300° C. to 800° C.; and firing the heated molding material for 2 hours to 15 hours at a temperature of 820° C. to 950° C. and growing the piezoelectric material included in the alignment material composition through a template grain growth process with respect to the magnetostrictive material included in the seed composition.

10 . A magnetoelectric composite material having a 0-3 type connectivity, the magnetoelectric composite material comprising:
an alignment material composition comprising a first material selected from a magnetostrictive material and a piezoelectric material; and a seed composition comprising a second material that is not selected as the first material from the magnetostrictive material and the piezoelectric material.

11 . The method of claim 10 , wherein the alignment material composition comprises the piezoelectric material, and wherein the seed composition comprises the magnetostrictive material.

12 . The method of claim 10 , wherein the alignment material composition comprises the magnetostrictive material, and wherein the seed composition comprises the piezoelectric material.

Assignees

• Korea Electronics Technology

Inventors

• Han Seung Ho
• Kang Hyung Won

Classifications

• H01L41/183 Primary

  Electricity · mapped topic

• H01L41/37

  Electricity · mapped topic

• H10F71/137

  Batch treatment of the devices · CPC title

• H10N35/85

  Magnetostrictive active materials · CPC title

• H10N30/097 Primary

  by sintering · CPC title