Methods for gapfill in substrates

Patent metadata

Field	Value
Publication number	US-2021287900-A1
Application number	US-202016817378-A
Country	US
Kind code	A1
Filing date	Mar 12, 2020
Priority date	Mar 12, 2020
Publication date	Sep 16, 2021
Grant date	—

Abstract

The present disclosure provides methods for treating film layers in a substrate including positioning the substrate in a processing volume of a processing chamber. The substrate can have high aspect ratio features extending a depth from a substrate surface to a bottom surface. The feature can have a width defined by a first sidewall and a second sidewall. A film with a composition that includes metal is formed on the substrate surface and the first sidewall, the second sidewall, and the bottom surface of each feature. The film in the feature can have a seam extending substantially parallel to the first and second sidewalls. The film is annealed and exposed to an oxygen radical while converting the metal of the film to a metal oxide. The metal oxide is exposed to a hydrogen radical while converting the metal oxide to a metal fill layer.

First claim

1 . A method of processing a substrate, comprising:
positioning the substrate in a processing chamber comprising a processing volume, the substrate having at least one feature extending a depth from a substrate surface to a bottom surface, the at least one feature having an inner sidewall surface; forming a film comprising a metal on the substrate surface and the inner sidewall surface of the at least one feature, and the bottom surface of the at least one feature, the film having a seam extending substantially parallel to the inner sidewall surface, the seam having a seam width; heating the substrate at a temperature of about 300° C. to about 1000° C.; exposing the film within the seam to an oxygen radical while converting the metal of the film to a metal oxide, wherein the seam is at least partially filled with the metal oxide; and exposing the metal oxide to a hydrogen radical while converting the metal oxide to a metal fill layer.

2 . The method of claim 1 , wherein the seam is completely filled with the metal oxide.

3 . The method of claim 1 , wherein exposing the film to the oxygen radical comprises dissociating molecules of an oxygen gas to produce the oxygen radical.

4 . The method of claim 3 , wherein exposing the film to the oxygen radical comprises flowing the oxygen radical with a first gas selected from the group consisting of H 2 , Ar, Kr, Xe, N 2 , He, Ne, and a combination thereof.

5 . The method of claim 3 ,
wherein exposing the film to the oxygen radical comprises flowing the oxygen radical into the processing volume at about 0.1 slm to about 10 slm, and wherein exposing the metal oxide containing film to the hydrogen radical comprises flowing the hydrogen radical into the processing volume at a rate of about 0.1 slm to about 10 slm.

6 . The method of claim 3 , wherein dissociating molecules of the oxygen gas occurs within the processing volume.

7 . The method of claim 6 , wherein the processing volume comprises an excitation source having a radio frequency (RF) at a power of from about 6 kW to about 10 kW.

8 . The method of claim 1 , wherein exposing the film to the oxygen radical comprises exposing the film to the oxygen radical for about 100 seconds to about 400 seconds,
wherein exposing the metal oxide comprises exposing the metal oxide to the hydrogen radical for about 100 seconds to about 400 seconds.

9 . The method of claim 1 , wherein the metal of the film comprises Ta, Ti, W, Cr, Co, Al, Cu, Mo, Rb, TaN, TiN, WN, CrN, AlN, RbN, alloys thereof, or combinations thereof.

10 . The method of claim 1 , wherein exposing the metal oxide to the hydrogen radical comprises flowing the hydrogen radical with a second gas selected from the group consisting of Ar, Kr, Xe, N 2 , He, Ne, and combinations thereof.

11 . The method of claim 1 , further comprising exposing the metal fill layer to a nitrogen radical for about 100 seconds to about 400 seconds while converting the metal fill layer to a metal nitride layer, wherein the metal nitride layer is substantially seamless.

12 . The method of claim 11 , wherein exposing the metal fill layer to the nitrogen radical comprises dissociating molecules of a nitrogen gas into the nitrogen radical.

13 . The method of claim 1 , wherein the processing volume is maintained at a pressure of about 0.5 Torr to about 5 Torr.

14 .- 17 . (canceled)

18 . A method of processing a substrate, comprising:
positioning the substrate in a first processing chamber comprising a first processing volume, the substrate having at least one feature extending a depth from a substrate surface to a bottom surface, the at least one feature having an inner sidewall surface; forming a film comprising metal on the substrate surface and the inner sidewall surface, and the bottom surface of the at least one feature, the film having a seam extending substantially parallel to the inner sidewall surface, the seam having a seam width; positioning the substrate in a second processing chamber comprising a second processing volume; heating the film at a temperature of about 400° C. to about 650° C.; exposing the film within the seam to an oxygen radical while converting the metal of the film to a metal oxide, wherein the seam is at least partially filled with the metal oxide; exposing the metal oxide to a hydrogen radical while converting the metal oxide to a metal fill layer; and exposing the metal fill layer to a nitrogen radical to convert the metal fill layer to a metal nitride fill layer.

19 . The method of claim 18 , wherein the seam width of the film before heating and exposing the film is from 2 Å to about 10 Å and the seam width after heating and exposing the film is less than about 2 Å.

20 . A system comprising an algorithm stored in a memory of the system, wherein the algorithm comprises a number of instructions which, when executed by a processor, causes the method of claim 18 to be performed.

21 . The method of claim 18 , wherein the at least one feature has an aspect ratio of greater than or equal to 5:1.

22 . The method of claim 18 , wherein exposing the film to the oxygen radical comprises flowing the oxygen radical with a first gas selected from the group consisting of H 2 , Ar, Kr, Xe, N 2 , He, Ne, and a combination thereof.

23 . The method of claim 18 , wherein exposing the film to the oxygen radical comprises exposing the film to the oxygen radical for about 100 seconds to about 400 seconds,
wherein exposing the metal oxide comprises exposing the metal oxide to the hydrogen radical for about 100 seconds to about 400 seconds.

24 . The method of claim 18 , wherein the metal of the film comprises Ta, Ti, W, Cr, Co, Al, Cu, Mo, Rb, alloys thereof, or combinations thereof.

Assignees

• Applied Materials Inc

Inventors

• Yang Yixiong
• Liu Wei
• Lo Yuan-Hui
• Gandikota Srinivas
• Wrench Jacqueline Samantha
• Lin Yongjing
• Chen Wen Ting
• Chen Shihchung

Classifications

• H10P14/6318

  Formation by simultaneous oxidation and nitridation · CPC title

• H10P14/6314 Primary

  of a metallic layer · CPC title

• H10W20/056 Primary

  by filling conductive material into holes, grooves or trenches · CPC title

• H10P14/6319

  Formation by plasma treatments, e.g. plasma oxidation of the substrate · CPC title

• H01L21/02249

  Electricity · mapped topic