Electrical connection device, method for producing the same, and structure of flexible wiring board

Patent metadata

Field	Value
Publication number	US-2021282264-A1
Application number	US-202117158439-A
Country	US
Kind code	A1
Filing date	Jan 26, 2021
Priority date	Mar 6, 2020
Publication date	Sep 9, 2021
Grant date	—

Abstract

In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

First claim

What is claimed is:

1 . An electrical connection device, comprising:
a flexible base; an adhesive layer disposed on the flexible base, the adhesive layer containing a pressure sensitive adhesive; an elastomer pattern disposed on the adhesive layer, the elastomer pattern being formed of a cured ink containing an elastomer composition; and a conductor pattern disposed on the elastomer pattern, the conductor pattern being formed of a cured ink containing conductive particles, wherein a longitudinal elastic modulus of the elastomer pattern is larger than a longitudinal elastic modulus of the adhesive layer.

2 . The electrical connection device according to claim 1 , wherein the elastomer pattern and the conductor pattern have an identical pattern shape.

3 . The electrical connection device according to claim 1 , wherein the longitudinal elastic modulus of the elastomer pattern is not greater than 1000 MPa.

4 . A method for producing the electrical connection device according to claim 1 , the method comprising:
a step for forming the conductor pattern, in which an ink pattern containing the conductive particles is printed on a blanket and then is heat-cured into the conductor pattern; a step for forming the elastomer pattern, in which an ink pattern containing the elastomer composition is printed on the blanket so as to lie over the conductor pattern and then is heat-cured into the elastomer pattern; and a step for transferring the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer disposed on the flexible base so that the elastomer pattern is positioned directly on the adhesive layer.

5 . A method for producing the electrical connection device according to claim 2 , the method comprising:
a step for forming the conductor pattern, in which an ink pattern containing the conductive particles is printed on a blanket and then is heat-cured into the conductor pattern; a step for forming the elastomer pattern, in which an ink pattern containing the elastomer composition is printed on the blanket so as to lie over the conductor pattern and then is heat-cured into the elastomer pattern; and a step for transferring the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer disposed on the flexible base so that the elastomer pattern is positioned directly on the adhesive layer.

6 . A method for producing the electrical connection device according to claim 3 , the method comprising:
a step for forming the conductor pattern, in which an ink pattern containing the conductive particles is printed on a blanket and then is heat-cured into the conductor pattern; a step for forming the elastomer pattern, in which an ink pattern containing the elastomer composition is printed on the blanket so as to lie over the conductor pattern and then is heat-cured into the elastomer pattern; and a step for transferring the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer disposed on the flexible base so that the elastomer pattern is positioned directly on the adhesive layer.

7 . A method for producing the electrical connection device according to claim 1 , the method comprising:
a step for printing an ink pattern containing the conductive particles on a blanket; a step for printing an ink pattern containing the elastomer composition on the blanket so as to lie over the ink pattern containing the-conductive particles; a step for forming the conductor pattern and the elastomer pattern by simultaneously heat-curing the ink pattern containing the conductive particles and the ink pattern containing the elastomer composition; and a step for transferring the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer disposed on the flexible base so that the elastomer pattern is positioned directly on the adhesive layer.

8 . A method for producing the electrical connection device according to claim 2 , the method comprising:
a step for printing an ink pattern containing the conductive particles on a blanket; a step for printing an ink pattern containing the elastomer composition on the blanket so as to lie over the ink pattern containing the-conductive particles; a step for forming the conductor pattern and the elastomer pattern by simultaneously heat-curing the ink pattern containing the conductive particles and the ink pattern containing the elastomer composition; and a step for transferring the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer disposed on the flexible base so that the elastomer pattern is positioned directly on the adhesive layer.

9 . A method for producing the electrical connection device according to claim 3 , the method comprising:
a step for printing an ink pattern containing the conductive particles on a blanket; a step for printing an ink pattern containing the elastomer composition on the blanket so as to lie over the ink pattern containing the-conductive particles; a step for forming the conductor pattern and the elastomer pattern by simultaneously heat-curing the ink pattern containing the conductive particles and the ink pattern containing the elastomer composition; and a step for transferring the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer disposed on the flexible base so that the elastomer pattern is positioned directly on the adhesive layer.

10 . A structure of a flexible wiring board, comprising:
a first flexible base; a first adhesive layer disposed on the first flexible base, the first adhesive layer containing a first pressure sensitive adhesive; an elastomer pattern disposed on the first adhesive layer, the elastomer pattern being formed of a first cured ink containing a first elastomer composition, wherein a longitudinal elastic modulus of the elastomer pattern is larger than a longitudinal elastic modulus of the first adhesive layer; a conductor pattern disposed on the elastomer pattern, the conductor pattern being formed of a cured ink containing conductive particles; a second flexible base; a second adhesive layer disposed on the second flexible base, the second adhesive layer containing a second pressure sensitive adhesive; and an elastomer layer disposed on the second adhesive layer, the elastomer layer being formed of a second cured ink containing a second elastomer composition, wherein a longitudinal elastic modulus of the elastomer layer is larger than a longitudinal elastic modulus of the second adhesive layer; wherein the first flexible base, the first adhesive layer, the elastomer pattern, and the conductor pattern forming altogether a first layer structure, while the second flexible base, the second adhesive layer, and the elastomer layer forming altogether a second layer structure, the second layer structure lies over the first layer structure in a way that the conductor pattern faces the elastomer layer, wherein a part of a surface of the first adhesive layer on which none of the elastomer pattern and the conductor pattern is disposed and a part of a surface of the elastomer layer are bonded to each other so that the first layer structure and the second layer structure are mechanically coupled with each other.

11 . A structure of a flexible wiring board, comprising:
a first flexible base; a first adhesive layer disposed on the first flexible base, the first adhesive layer containing a first pressure sensitive adhesive; a first elastomer pattern disposed on the first adhesive layer, the first elastomer pattern being formed of a first cured ink containing a first elastomer composition, wherein a longitudinal elastic modulus

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Sato Junya
• Mitsui Ryosuke
• Yamabayashi Yoshiaki
• Tanaka Atsushi

Classifications

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K1/0393 Primary

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title