Module

Patent metadata

Field	Value
Publication number	US-2021280503-A1
Application number	US-202117327821-A
Country	US
Kind code	A1
Filing date	May 24, 2021
Priority date	Nov 30, 2018
Publication date	Sep 9, 2021
Grant date	—

Abstract

A module includes: a substrate including a first main surface; a first component mounted on the first main surface; a first land electrode provided on the first main surface; a first mold resin that covers at least the first main surface and the first component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin; a first conductor pillar provided in the first mold resin to electrically connect the first land electrode and the top surface shield film; and an upper first bypass conductor provided in the first mold resin to electrically connect the top surface shield film and the side surface shield film.

First claim

What is claimed is:

1 . A module comprising:
a substrate including a first main surface; a first component mounted on the first main surface; a first land electrode on the first main surface; a first mold resin that covers at least the first main surface and the first component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin; a first conductor pillar in the first mold resin to electrically connect the first land electrode and the top surface shield film; and an upper first bypass conductor in the first mold resin to electrically connect the top surface shield film and the side surface shield film.

2 . The module according to claim 1 , further comprising an upper second bypass conductor in the first mold resin to connect the first land electrode and the side surface shield film.

3 . The module according to claim 2 , wherein the upper first bypass conductor and the upper second bypass conductor are integrally provided.

4 . The module according to claim 1 , wherein
the substrate includes a second main surface on an opposite side of the first main surface; the module further includes:
a second component mounted on the second main surface;
a second land electrode on the second main surface;
a second mold resin that covers at least the second main surface and the second component;
a bottom land electrode on a bottom surface of the second mold resin; and
a second conductor pillar in the second mold resin to electrically connect the second land electrode and the bottom land electrode;
the side surface shield film covers a side surface of the substrate and a side surface of the second mold resin; and the module further includes a lower bypass conductor in the second mold resin to electrically connect the bottom land electrode and the side surface shield film.

5 . A module comprising:
a substrate including a first main surface and a second main surface that faces opposite to the first main surface; a first component mounted on the first main surface; a first mold resin that covers at least the first main surface and the first component; a second component mounted on the second main surface; a substrate land electrode on the second main surface; a second mold resin that covers at least the second main surface and the second component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin, a side surface of the substrate, and a side surface of the second mold resin; a bottom land electrode on a bottom surface of the second mold resin; a conductor pillar in the second mold resin to electrically connect the substrate land electrode and the bottom land electrode; and a lower bypass conductor in the second mold resin to electrically connect the bottom land electrode and the side surface shield film.

6 . The module according to claim 1 , wherein at least one solder ball or solder bump is provided on the first main surface.

7 . The module according to claim 1 , wherein the substrate is a multilayer substrate that includes internal conductor patterns.

8 . The module according to claim 1 , wherein the substrate is a resin multilayer substrate or a ceramic multilayer substrate.

9 . The module according to claim 1 , wherein the substrate includes an internal ground electrode that is electrically connected to the side surface shield film.

10 . The module according to claim 1 , wherein the first component is a power amplifier, a low noise amplifier, a switching integrated circuit, a high-frequency integrated circuit, a baseband integrated circuit, or a surface acoustic wave filter.

11 . The module according to claim 1 , wherein the first component is solder mounted or wire-bond mounted on the first main surface.

12 . The module according to claim 4 , wherein the second component is a surface mount device.

13 . The module according to claim 1 , wherein the upper first bypass conductor has a plate shape.

14 . The module according to claim 1 , wherein the upper first bypass conductor is spaced apart from the first main surface.

15 . The module according to claim 1 , wherein a distance between the first component and the upper first bypass conductor is shorter than a distance between the first component and either of the top surface shield film and the side surface shield film.

Assignees

• Murata Manufacturing Co

Inventors

• Sato Kazushige
• Takagi Masayoshi

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W42/271

  the arrangements being between stacked chips · CPC title