Substrate designed to provide EMI shielding

Patent metadata

Field	Value
Publication number	US-9793222-B1
Application number	US-201615135071-A
Country	US
Kind code	B1
Filing date	Apr 21, 2016
Priority date	Apr 21, 2016
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

Packages and packaging techniques for providing EMI shielding are described. In an embodiment, a package includes an electrically conductive ground structure on a ground pad at a periphery of a package substrate. The electrically conductive ground structure is encapsulated in a molding compound, and a surface of the electrically conductive ground structure is exposed at a side surface of the molding compound. An electrically conductive shield layer is on top and side surfaces of the molding compound, and in physical contact with the surface of the exposed electrically conductive ground structure.

First claim

What is claimed is:

1. A method comprising:
attaching a die to a top surface of a wiring substrate;
attaching a plurality of wire bonds to a plurality of ground pads and a plurality of dummy pads at the top surface of the wiring substrate such that each wire bond is attached to a corresponding ground pad and a corresponding dummy pad;
encapsulating the die and the plurality of wire bonds within a molding compound;
cutting through the molding compound and a corresponding plurality of bond areas of the plurality of wire bonds to expose a corresponding plurality of surfaces of the bond areas at cut side surfaces of the molding compound; and
depositing an electrically conductive shield layer on a top surface and the cut side surfaces of the molding compound, and in physical contact with the plurality of surfaces of the exposed bond areas at the cut side surfaces of the molding compound.

2. The method of claim 1 , further comprising dicing though the electrically conductive shield layer and the wiring substrate to singulate a package.

3. The method of claim 2 , further comprising placing a plurality of solder balls on a bottom surface of the wiring substrate prior to dicing though the wiring substrate and the electrically conductive shield layer to singulate the package.

4. The method of claim 1 , wherein cutting further comprises cutting through the wiring substrate to singulate a package.

5. The method of claim 4 , further comprising placing the package on a temporary carrier, and depositing the electrically conductive shield layer on the top surface and the cut side surfaces of the molding compound, and in physical contact with the plurality of surfaces of the exposed bond areas at the cut side surfaces of the molding compound.

6. The method of claim 1 , further comprising:
attaching a first wire bond of the plurality of wire bonds to a first ground pad of the plurality of ground pads and a first dummy pad of the plurality of dummy pads, and attaching a second wire bond of the plurality of wire bonds to a second ground pad of the plurality of ground pads and the first dummy pad;
cutting through the molding compound and a first bond area of the first wire bond to expose a first surface of the first bond area at a first cut side surface of the molding compound; and
cutting through the molding compound and a second bond area of the second wire bond to expose a second surface of the second bond area at the first cut side surface of the molding compound.

7. The method of claim 6 , further comprising dicing though the electrically conductive shield layer and the wiring substrate to singulate a package including the first surface of the first bond area and the second surface of the second bond area.

8. The method of claim 1 , further comprising:
attaching a first wire bond of the plurality of wire bonds to a first ground pad of the plurality of ground pads and a first dummy pad of the plurality of dummy pads, and attaching a second wire bond of the plurality of wire bonds to a second ground pad of the plurality of ground pads and the first dummy pad;
cutting through the molding compound and a first bond area of the first wire bond to expose a first surface of the first bond area at a first cut side surface of the molding compound; and
cutting through the molding compound and a second bond area of the second wire bond to expose a second surface of the second bond area at a second cut side surface of the molding compound.

9. The method of claim 8 , further comprising dicing though the electrically conductive shield layer and the wiring substrate to singulate a first package including the first surface of the first bond area and a second package including the second surface of the second bond area.

10. The package of claim 5 , further comprising:
attaching a first wire bond of the plurality of wire bonds to a first ground pad of the plurality of ground pads and a first dummy pad of the plurality of dummy pads, and attaching a second wire bond of the plurality of wire bonds to a second ground pad of the plurality of ground pads and the first dummy pad;
cutting through the molding compound and a first bond area of the first wire bond to expose a first surface of the first bond area at a first cut side surface of the molding compound; and
cutting through the molding compound and a second bond area of the second wire bond to expose a second surface of the second bond area at the first cut side surface of the molding compound.

11. The package of claim 10 , further comprising dicing though the electrically conductive shield layer and the wiring substrate to singulate the package including the first surface of the first bond area and the second surface of the second bond area.

12. The package of claim 5 , further comprising:
attaching a first wire bond of the plurality of wire bonds to a first ground pad of the plurality of ground pads and a first dummy pad of the plurality of dummy pads, and attaching a second wire bond of the plurality of wire bonds to a second ground pad of the plurality of ground pads and the first dummy pad;
cutting through the molding compound and a first bond area of the first wire bond to expose a first surface of the first bond area at a first cut side surface of the molding compound; and
cutting through the molding compound and a second bond area of the second wire bond to expose a second surface of the second bond area at a second cut side surface of the molding compound.

13. The package of claim 12 , further comprising dicing though the electrically conductive shield layer and the wiring substrate to singulate the package including the first surface of the first bond area, wherein the package does not include the second surface of the second bond area.

14. A package manufactured according to the method, comprising:
attaching a die to a wiring substrate;
bonding a plurality of wires bonds to a plurality of ground pads at a top surface of the wiring substrate and a plurality of dummy pads at the top surface of the wiring substrate, such that each wire bond is bonded to a corresponding ground pad and a corresponding dummy pad;
encapsulating the die and the plurality of wire bonds with a molding compound;
cutting through the molding compound and the plurality of wire bonds to expose a corresponding plurality of surfaces of the plurality of electrically conductive ground structures at cut side surfaces of the molding compound; and
depositing an electrically conductive shield layer on a top surface and the cut side surfaces of the molding compound, and in physical contact with the plurality of surfaces of the exposed plurality of wire bonds at the cut side surfaces of the molding compound.

15. The package of claim 14 , wherein cutting through the plurality of wire bonds comprises cutting through bond areas of the plurality of wire bonds.

16. The package of claim 15 , wherein the bond areas are selected from the group consisting of ball bond areas and wedge bond areas.

17. The package of claim 14 , wherein cutting through the plurality of wire bonds comprises cutting through wires of the plurality of wire bonds.

Assignees

• Apple Inc

Inventors

• Lee Myungho

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/0198

  batch processes · CPC title