Thermal imaging

Patent metadata

Field	Value
Publication number	US-2021203861-A1
Application number	US-201716075222-A
Country	US
Kind code	A1
Filing date	Jul 11, 2017
Priority date	Jul 11, 2017
Publication date	Jul 1, 2021
Grant date	—

Abstract

Some examples include a thermal imaging assembly, comprising a thermal imaging device including a thermal sensor, a transistor to generate heat, a thermal jacket forming a cavity to house the thermal imaging device, the thermal jacket forming a space around the thermal imaging device, the thermal jacket thermally coupled to the transistor to transmit heat generated by the transistor to the cavity, and an insulative shell disposed around the thermal jacket to maintain a temperature of the thermal imaging device within the insulative shell.

First claim

1 . A thermal imaging assembly, comprising:
a thermal imaging device including a thermal sensor; a transistor to generate heat; a thermal jacket forming a cavity to house the thermal imaging device, the thermal jacket forming a space around the thermal imaging device, the thermal jacket thermally coupled to the transistor to transmit heat generated by the transistor to the cavity; and an insulative shell disposed around the thermal jacket to maintain a temperature of the thermal imaging device within the insulative shell.

2 . The thermal imaging assembly of claim 1 , wherein the thermal imaging device is a non-contact thermal imaging device.

3 . The thermal imaging assembly of claim 1 , comprising:
a thermal interface disposed between the transistor and the thermal jacket, the thermal interface to transmit heat generated by the transistor to the thermal jacket.

4 . The thermal imaging assembly of claim 1 , comprising:
a housing disposed around the insulative shell, the thermal imaging device and the transistor coupled to the printed circuit board within the housing.

5 . The thermal imaging assembly of claim 1 , comprising:
a thermopile mounted to the printed circuit board.

6 . The thermal imaging assembly of claim 1 , comprising:
a printed circuit board disposed along a first side of the thermal imaging device, and wherein the thermal jacket and insulative shell extend toward the printed circuit board around a side perimeter of the thermal imaging device.

7 . A thermal measurement assembly for an additive manufacturing machine, comprising:
a thermal camera including a sensor to sense a thermal temperature profile within a build chamber of the additive manufacturing machine; a transistor to generate heat; a thermal jacket thermally conductively connected to the transistor, the thermal camera disposed in a cavity formed within the thermal jacket to transfer dissipated heat to the thermal camera; and an insulative shell disposed around the thermal jacket, a perimeter spaced defined between the insulative shell and the thermal jacket.

8 . The thermal measurement assembly of claim 7 , wherein the thermal jacket comprises a ceramic filled silicon foam.

9 . The thermal measurement assembly of claim 7 , wherein the cavity defines a space around the thermal camera.

10 . The thermal measurement assembly of claim 7 , comprising:
a window disposed across an opening of the thermal jacket, the window positioned at a field of view of the sensor.

11 . A thermal measurement assembly of claim 7 , comprising:
a microcontroller coupled to a printed circuit board to control the transistor heat generation.

12 . The thermal measurement assembly of claim 7 , comprising:
circuits to control a temperature of the thermal camera.

13 . A method of controlling thermal conditions of a thermal imaging device in an additive manufacturing machine, comprising:
housing the thermal imaging device within a thermally conductive jacket, the thermally conductive jacket forming a space around the thermal imaging device; housing the thermally conductive jacket within a thermally insulative shell, the thermally insulative shell forming a perimeter space around the thermally conductive jacket; generating heat with a transistor thermally coupled to the thermally conductive jacket; and transferring heat from the transistor to the space around the thermal imaging device through the thermally conductive jacket.

14 . The method of claim 13 , comprising:
controlling the heat generation with a feedback control loop.

15 . The method of claim 13 , comprising:
maintaining the transistor on a printed circuit board disposed along an open side of the thermally conductive jacket.

Assignees

• Hewlett Packard Development Co

Inventors

• Yasbek Joshua Peter
• Goyen Todd
• Soriano David
• Weiss Asa
• Barnes Arthur H

Classifications

• G01J5/22 Primary

  Electrical features thereof · CPC title

• B33Y40/00

  Auxiliary operations or equipment, e.g. for material handling · CPC title

• H04N23/23

  from thermal infrared radiation · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• B29C64/393

  for controlling or regulating additive manufacturing processes · CPC title