Reliable semiconductor packages

Patent metadata

Field	Value
Publication number	US-2021202339-A1
Application number	US-202017138741-A
Country	US
Kind code	A1
Filing date	Dec 30, 2020
Priority date	Dec 31, 2019
Publication date	Jul 1, 2021
Grant date	—

Abstract

The present disclosure is directed to improving package adhesion to provide more reliable semiconductor packages. The semiconductor package may be, for example, a leadframe including one or multiple dies attached thereto. The semiconductor package may include only clip bonds or only wire bonds or a combination of clip bonds and wire bonds. An adhesion enhancement coating may be disposed in between the package substrate and the encapsulant to improve package adhesion. For example, the adhesion enhancement coating enhances the sealing by bonding respectively with the inorganic materials of the package substrate and the organic materials of the encapsulant.

First claim

1 . A device comprising:
a package substrate having top and bottom major package substrate surfaces, the top major package surface includes a die attach region; a die disposed on the die attach region, wherein the die includes first and second major die surfaces, the second major die surface is attached to the die attach region; an adhesion enhancement layer disposed on a metallic component of the device; and an encapsulant, the encapsulant covers exposed portions of the package substrate and the die, wherein the adhesion enhancement layer enhances adhesion of the encapsulant to the metallic component of the device.

2 . The device of claim 1 wherein the adhesion enhancement layer comprises a polysiloxane layer, the polysiloxane layer is configured to form covalent bonds with the encapsulant and the metallic component of the device.

3 . The device of claim 2 wherein the polysiloxane layer is deposited on the metallic component of the device by spraying a solution comprising organosilanes on the metallic component of the device.

4 . The device of claim 1 wherein the metallic component comprises a copper component.

5 . The device of claim 1 wherein the package substrate comprises a leadframe, wherein the metallic component of the device comprises the leadframe.

6 . The device of claim 5 wherein the leadframe is completely coated with the adhesion enhancement layer.

7 . The device of claim 5 wherein exposed portions of the leadframe are coated with the adhesion enhancement layer.

8 . The device of claim 5 comprises a clip bond coupled to the first die surface and a package pad of the package substrate, wherein the metallic component of the device comprises the clip bond and the leadframe.

9 . The device of claim 8 wherein the leadframe and clip bond are completely coated with the adhesion enhancement layer.

10 . The device of claim 8 wherein exposed portions of the leadframe and clip bond are coated with the adhesion enhancement layer.

11 . The device of claim 8 wherein exposed portions of one of the leadframe and clip bond are coated with the adhesion enhancement layer and other of the leadframe and clip bond is completed coated with the adhesion enhancement layer.

12 . The device of claim 2 comprises a clip bond coupled to the first die surface and a package pad of the package substrate, wherein the metallic component of the device comprises the clip bond.

13 . The device of claim 12 wherein the clip bond is completely coated with the adhesion enhancement layer.

14 . The device of claim 12 wherein exposed portions of the clip bond are coated with the adhesion enhancement layer.

15 . A method for forming a device comprising:
providing a package substrate having top and bottom major package substrate surfaces, the top major package surface includes a die attach region; attaching a second major die surface of a die onto the die attach region, wherein a first major die surface of the die includes a die pad; and depositing an encapsulant on the package substrate to cover exposed portions of the package substrate and the die, the encapsulant bonds with an adhesion enhancement layer disposed on a metallic component of the device, wherein the adhesion enhancement layer enhances adhesion of the encapsulant to the metallic component of the device.

16 . The method of claim 15 wherein the adhesion enhancement layer comprises a polysiloxane layer, the polysiloxane layer is configured to form covalent bonds with the encapsulant and the metallic component of the device.

17 . The method of claim 16 further comprises
providing a clip bond singulated from a conductive sheet with a plurality of clip bonds, wherein the conductive sheet is coated with the polysiloxane layer;
attaching the clip bond to the die pad of the die and a package pad disposed on the top major package surface of the package substrate; and
wherein the encapsulant covers exposed portions of the package substrate, the die and the clip bond.

18 . The method of claim 16 further comprises
attaching a clip bond to the die pad of the die and a package pad disposed on the top major package surface of the package substrate;
depositing the polysiloxane layer on the package substrate to coat exposed portions of the package substrate, the die and the clip bond; and
wherein the encapsulant covers exposed portions of the package substrate, the die and the clip bond.

19 . The method of claim 16 wherein providing the package substrate comprises
depositing the polysiloxane layer on the package substrate to coat exposed portions of the package substrate.

20 . The method of claim 19 further comprises
attaching a clip bond to the die pad of the die and a package pad disposed on the top major package surface of the package substrate; and
wherein the encapsulant covers exposed portions of the package substrate, the die and the clip bond.

Assignees

• Utac Headquarters Pte Ltd

Inventors

• Uraisakul Surachai
• Ounkaew Siriwanna
• Thammavet Panumard
• Chaowasakoo Tanawan

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/655

  of outermost layers of multilayered strap connectors, e.g. material of a coating · CPC title

• H10W72/653

  not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · CPC title

• H10W74/016

  using moulds · CPC title

• H10W72/076

  of strap connectors · CPC title