Backside initiated uniform heat sink loading

Patent metadata

Field	Value
Publication number	US-10170391-B2
Application number	US-201414274191-A
Country	US
Kind code	B2
Filing date	May 9, 2014
Priority date	May 9, 2014
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit.

First claim

The invention claimed is:

1. A backside initiated uniform heat sink loading system comprising:
a system board assembly comprising at least a processing unit;
a heat sink assembly mounted upon the processing unit from a topside of the system board assembly, the heat sink assembly comprising a base, a plurality of fins formed on the base, a plurality of tension members that extend through the system board assembly and through the base into the plurality of fins, and compressive springs mounted about each of the plurality of tension members on a topside of the base;
a loading plate mounted to the plurality of tension members from a backside of the system board assembly, opposite the topside of the system board assembly; and
a fastener that engages with the loading plate from a backside of the loading plate,
wherein the compressive springs are located within the plurality of fins to be surrounded by the plurality of fins,
wherein the fastener is structured to force the loading plate away from the system board assembly when it is engaged with the loading plate from the backside of the system board assembly,
wherein the loading plate is a plate including stiffening features configured to prevent warpage or deflection of the loading plate, and
wherein the loading plate includes a threaded clearance hole structured to engage with threads of the fastener to force the loading plate away from the system board assembly when the threads of the fastener are engaged with the threaded clearance hole of the loading plate from the backside of the loading plate.

2. The backside initiated uniform heat sink loading system of claim 1 , wherein the plurality of tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit to the system board assembly.

3. The backside initiated uniform heat sink loading system of claim 1 , wherein the plurality of tension members uniformly force a thermal contact between the heat sink assembly and the processing unit.

4. The backside initiated uniform heat sink loading system of claim 1 , wherein each of the plurality of tension members comprise an upper flare portion that contacts an upper surface of an associated compressive spring of the compressive springs and an elongated portion that extends through the system board assembly and contacts the loading plate.

5. The backside initiated uniform heat sink loading system of claim 1 , wherein the system board assembly further comprises a lower chassis directly connected to a bottom surface of a system board.

6. The backside initiated uniform heat sink loading system of claim 5 , wherein the fastener contacts a bottom surface of the lower chassis to force the loading plate away from the system board assembly.

7. The backside initiated uniform heat sink loading system of claim 1 , wherein the loading plate is configured to compress the compressive springs when the loading plate is forced away from the system board assembly to force the heat sink assembly into the processing unit to provide a uniform loading force to the processing unit.

8. An electronic system comprising:
a system board assembly comprising at least a processing unit;
a heat sink assembly mounted upon the processing unit from a topside of the system board assembly, the heat sink assembly comprising a base, a plurality of fins formed on a first area of the base, a plurality of tension members that extend through the system board assembly and through the base into the plurality of fins, and compressive springs mounted about each of the plurality of tension members on a topside of the base;
a loading plate mounted to the plurality of tension members from a backside of the system board assembly, opposite the topside of the system board assembly;
a fastener that engages with the loading plate from a backside of the loading plate; and
a lower chassis directly connected to a bottom surface of the system board assembly,
wherein the compressive springs are located on the first area of the base within the plurality of fins to be at least partially surrounded by the plurality of fins,
wherein the fastener extends through a threaded clearance hole in the loading plate into contact with a bottom surface of the lower chassis to apply a uniform loading force to the processing unit,
wherein the loading plate is a stiff plate including at least one of ribs or embosses to stiffen the loading plate configured to prevent warpage or deflection of the loading plate, and
wherein the loading plate includes the threaded clearance hole structured to engage with threads of the fastener to force the loading plate away from the system board assembly when the threads of the fastener are engaged with the threaded clearance hole of the loading plate from the backside of the loading plate.

9. The electronic system of claim 8 , wherein the fastener forces the loading plate away from the system board assembly.

10. The electronic system of claim 9 , wherein the plurality of tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit to the system board assembly.

11. The electronic system of claim 9 , wherein the plurality of tension members uniformly force a thermal contact between the heat sink assembly and the processing unit.

12. The electronic system of claim 8 , wherein each of the tension members comprises an upper flare portion that contacts an upper surface of an associated compressive spring of the compressive springs and an elongated portion that extends through the system board assembly and contacts the loading plate.

13. The electronic system of claim 8 , wherein the fastener contacts a bottom surface of the lower chassis to force the loading plate away from the system board assembly.

14. The electronic system of claim 8 , wherein the loading plate is configured to compress the compressive springs when the loading plate is forced away from the system board assembly to force the heat sink assembly into the processing unit to provide a uniform loading force to the processing unit.

15. A uniform backside heat sink loading method comprising:
mounting a heat sink assembly to a processing unit from a topside of a system board assembly, wherein the heat sink assembly comprises a base, and a plurality of fins formed on a first area of the base;
installing a plurality of tension members through the heat sink assembly and through the system board assembly from the topside of the system board assembly, such that the plurality of tension members extends through the base into the plurality of fins, wherein each of the plurality of tension members includes a coiled compressive spring thereabout;
connecting a loading plate to the plurality of tension members from a backside of the system board assembly, opposite the topside of the system board assembly;
engaging a fastener to the loading plate from a backside of the loading plate to force the loading plate away from the system board assembly; and
wherein the coiled compressive springs are located on the first area of the base within the plurality of fins to be at least partially surrounded by the plurality of fins,
wherein the loading plate is a plate including stiffening features configured to prevent warpage or deflection of the loading plate, and
wherein the loading plate includes a threaded clearance hole structured to engage with threads of the fastener to force the loading plate away from the system board assembly when the threads of the fastener are engaged with the threaded clearance hole of the loading plate from the backside of the loading plate.

Assignees

• Lenovo Entpr Solutions Singapore Pte Ltd

Inventors

• Dickover Scott W
• Kerrigan Brian M
• Meserth Timothy A

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/774

  Pistons, e.g. spring-loaded members · CPC title

• H10W40/611 Primary

  Bolts or screws · CPC title

• Y10T29/49352

  Repairing, converting, servicing or salvaging · CPC title

• B23P15/26

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title