Optical device production method

Patent metadata

Field	Value
Publication number	US-2021191106-A1
Application number	US-201816761294-A
Country	US
Kind code	A1
Filing date	Aug 2, 2018
Priority date	Nov 15, 2017
Publication date	Jun 24, 2021
Grant date	—

Abstract

A method for manufacturing an optical device includes: preparing a semiconductor substrate that includes a portion corresponding to a base, a movable unit, and an elastic support portion; forming a first resist layer in a region corresponding to the base on a surface of a first semiconductor layer which is opposite to an insulating layer; forming a depression in the first semiconductor layer by etching the first semiconductor layer using the first resist layer as a mask; forming a second resist layer in a region corresponding to a rib portion on a bottom surface of the depression, a side surface of the depression, and the surface of the first semiconductor layer which is opposite to the insulating layer; and forming the rib portion by etching the first semiconductor layer until reaching the insulating layer using the second resist layer as a mask.

First claim

1 . A method for manufacturing an optical device,
the optical device comprising: a base, a movable unit, an elastic support portion connected between the base and the movable unit, and an optical function unit disposed on the movable unit, wherein the base, the movable unit, and the elastic support portion are constituted by a semiconductor substrate including a first semiconductor layer, a second semiconductor layer, and an insulating layer disposed between the first semiconductor layer and the second semiconductor layer, the base is constituted by the first semiconductor layer, the second semiconductor layer, and the insulating layer, at least one of the movable unit and the elastic support portion includes a rib portion constituted at least by the first semiconductor layer and disposed on the second semiconductor layer, and the first semiconductor layer constituting the rib portion is thinner than the first semiconductor layer constituting the base, the method comprising: a first step of preparing the semiconductor substrate that includes a portion corresponding to the base, the movable unit, and the elastic support portion; a second step of forming a first resist layer in a region corresponding to the base on a surface of the first semiconductor layer which is opposite to the insulating layer after the first step; a third step of forming a depression in the first semiconductor layer by etching the first semiconductor layer up to an intermediate portion in a thickness direction using the first resist layer as a mask after the second step; a fourth step of forming a second resist layer in a region corresponding to the rib portion on a bottom surface of the depression, a side surface of the depression, and the surface of the first semiconductor layer which is opposite to the insulating layer after the third step; and a fifth step of forming the rib portion by etching the first semiconductor layer until reaching the insulating layer using the second resist layer as a mask after the fourth step.

2 . The method for manufacturing an optical device according to claim 1 ,
wherein in the first step, the semiconductor substrate in which the first semiconductor layer is thicker than the second semiconductor layer is prepared.

3 . The method for manufacturing an optical device according to claim 1 , further comprising:
a sixth step of forming the optical function unit on a surface of the second semiconductor layer on a side of the insulating layer after the fifth step.

4 . The method for manufacturing an optical device according to claim 1 ,
wherein the rib portion includes a plurality of portions having widths different from each other.

5 . The method for manufacturing an optical device according to claim 1 ,
wherein the elastic support portion supports the movable unit so that the movable unit is capable of moving along a direction that intersects a main surface of the base.

6 . The method for manufacturing an optical device according to claim 1 ,
wherein the elastic support portion supports the movable unit so that the movable unit is capable of swinging around a predetermined axial line.

7 . The method for manufacturing an optical device according to claim 1 ,
wherein the optical device further includes, a fixed comb electrode provided to the base and including a plurality of fixed comb fingers, and a movable comb electrode provided to at least one of the movable unit and the elastic support portion and including a plurality of movable comb fingers disposed alternately with the plurality of fixed comb fingers.

8 . The method for manufacturing an optical device according to claim 1 ,
wherein the optical device further includes a coil or a piezoelectric element provided to the movable unit.

9 . The method for manufacturing an optical device according to claim 1 ,
wherein the rib portion is constituted by the first semiconductor layer and the insulating layer.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Sugimoto Tatsuya
• Suzuki Tomofumi
• KOTANI Kyosuke
• Kuramoto Yutaka
• Suzuki Daiki

Classifications

• B81C2201/0198

  for making a masking layer · CPC title

• B81C2201/0174

  for making multi-layered devices, film deposition or growing · CPC title

• B81C2201/013

  Etching · CPC title

• B81C1/00555

  Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity (B81C1/00023 - B81C1/0019 take precedence) · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title