US2021143417A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021143417-A1 |
| Application number | US-201916679369-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 11, 2019 |
| Priority date | Nov 11, 2019 |
| Publication date | May 13, 2021 |
| Grant date | — |
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A method of forming a solid-state lithium ion rechargeable battery may include depositing a metal layer onto a top surface of a substrate, depositing a handle layer onto a top surface of the metal layer, wherein a portion of the handle layer overlaps the metal layer and the substrate, spalling a portion of the substrate thereby forming a spalled substrate layer, porosifying the spalled substrate layer thereby forming a porous substrate layer, depositing an electrolyte layer onto a top surface of the porous substrate layer, wherein the electrolyte layer is in direct contact with the porous substrate layer, and depositing a cathode onto a top surface of the electrolyte layer. The method may include depositing a cathode contact layer onto a top surface of the cathode, wherein the cathode contact layer is in direct contact with the cathode. The porous substrate layer may be made of silicon.
Opening claim text (preview).
What is claimed is: 1 . A method comprising: depositing a metal layer onto a top surface of a substrate; depositing a handle layer onto a top surface of the metal layer, wherein a portion of the handle layer overlaps the metal layer and the substrate; spalling a portion of the substrate thereby forming a spalled substrate layer; porosifying the spalled substrate layer thereby forming a porous substrate layer; depositing an electrolyte layer onto a top surface of the porous substrate layer, wherein the electrolyte layer is in direct contact with the porous substrate layer; and depositing a cathode onto a top surface of the electrolyte layer. 2 . The method of claim 1 , further comprising: depositing a cathode contact layer onto a top surface of the cathode, wherein the cathode contact layer is in direct contact with the cathode. 3 . The method of claim 1 , wherein the porous substrate layer is made of silicon. 4 . The method of claim 1 , wherein the porous substrate layer is an anode. 5 . The method of claim 1 , wherein the metal layer is made of non-reactive metal having high tensile strength. 6 . The method of claim 1 , further comprising: initiating a spalling mode fracture in the substrate at a depth below a substrate/metal layer interface; and pulling of the handle layer causing the portion of the substrate to be spalled. 7 . A method comprising: growing a layer of doped silicon on top of a top surface of a substrate; porosifying the layer of doped silicon thereby forming a porous substrate layer; depositing a cathode on top of the porous substrate layer; depositing a metal layer on top of the cathode, wherein the metal layer is in direct contact with the cathode; depositing a handle layer directly on top of the metal layer; and spalling the porous substrate layer, the cathode, and the metal layer. 8 . The method of claim 7 , further comprising: depositing an electrolyte layer on the top of the porous substrate layer, wherein the electrolyte layer is between the porous substrate layer and the cathode; and depositing an anode contact layer on top of the porous substrate layer. 9 . The method of claim 7 , further comprising: initiating a spalling mode fracture in the substrate at a substrate/porous substrate layer interface; and pulling of the handle layer causing the porous substrate layer to be spalled. 10 . The method of claim 7 , further comprising: initiating a spalling mode fracture in the substrate below a substrate/porous substrate layer interface; and pulling of the handle layer causing a portion of the substrate to be spalled thereby forming the spalled substrate layer. 11 . The method of claim 7 , wherein the porous substrate layer is made of silicon. 12 . The method of claim 7 , wherein the metal layer is made of non-reactive metal having high tensile strength. 13 . A structure comprising: a porous substrate layer positioned along a metal layer, wherein the porous substrate layer is made of silicon; and a cathode positioned on top of an electrolyte layer, wherein the electrolyte layer separates the cathode from the porous substrate layer. 14 . The structure of claim 13 , further comprising: a handle layer positioned below the metal layer, wherein the metal layer separates the handle layer from the porous substrate layer; and a cathode contact layer positioned on top of the cathode. 15 . The structure of claim 13 , wherein the metal layer is made of non-reactive metal having high tensile strength.
Methods of deposition of the material · CPC title
Metal or alloys, e.g. alloy coatings (H01M4/669 take precedence) · CPC title
Silicon or alloys based on silicon · CPC title
of electrodes based on metals, Si or alloys · CPC title
Energy storage using batteries · CPC title
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