Communication module

Patent metadata

Field	Value
Publication number	US-2021126623-A1
Application number	US-202016786222-A
Country	US
Kind code	A1
Filing date	Feb 10, 2020
Priority date	Oct 25, 2019
Publication date	Apr 29, 2021
Grant date	—

Abstract

A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.

First claim

What is claimed is:

1 . A communications module, comprising:
a module substrate comprising a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate, wherein at least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.

2 . The communications module of claim 1 , wherein the ground layer comprises a shape corresponding to a shape of the filter module.

3 . The communications module of claim 1 , wherein the ground layer overlaps at least a portion of the filter module in the thickness direction of the module substrate.

4 . The communications module of claim 1 , wherein a portion of the ground layer overlaps an entirety of the filter module in the thickness direction of the module substrate.

5 . The communications module of claim 1 , wherein the first region corresponds to a space defined by an area in which the filter module and the ground layer overlap each other in the thickness direction of the module substrate, and a space between the filter module and the ground layer.

6 . The communications module of claim 1 , wherein a portion of at least one of the wiring layers and at least one of the wiring vias disposed in the first region form at least one of an inductor and a capacitor connected to the filter module.

7 . The communications module of claim 1 , further comprising an electronic component electrically separated from the filter module,
wherein at least one of the wiring layers and at least one of the wiring vias connected to the electronic component are disposed in a second region of the module substrate different from the first region.

8 . The communications module of claim 1 , further comprising a front-end module mounted on the module substrate, and electrically connected to the filter module,
wherein the filter module and the front-end module are electrically connected to each other through at least one of the wiring vias.

9 . The communications module of claim 8 , wherein a portion of the at least one wiring via electrically connecting the filter module to the front-end module penetrates through the ground layer.

10 . The communications module of claim 1 , wherein the filter module comprises a plurality of volume acoustic resonators.

11 . A communications module, comprising:
a module substrate comprising a plurality insulating layers, a plurality of wiring layers, and a plurality of wiring vias; a filter module disposed on the module substrate; and an electronic component electrically separated from the filter module, at least one of the wiring layers overlaps the filter module and is connected to a ground potential to function as a ground layer, and at least one of the wiring layers and at least one of the wiring vias are connected to the electronic component and disposed in a second region of the module substrate different from a first region between the filter module and the ground layer in a thickness direction of the module substrate.

12 . The communications module of claim 11 , wherein the ground layer comprises a shape corresponding to a shape the filter module.

13 . The communications module of claim 11 , wherein the ground layer overlaps at least a portion of the filter module in the thickness direction of the module substrate.

14 . The communications module of claim 11 , wherein a portion of the ground layer overlaps an entirety of the filter module in the thickness direction of the module substrate.

15 . The communications module of claim 11 , wherein an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in the first region are electrically connected to the filter module.

16 . The communications module of claim 11 , wherein a portion of at least one of the wiring layers and at least one of the wiring vias disposed in the first region form at least one of an inductor and a capacitor connected to the filter module.

17 . The communications module of claim 11 , wherein the filter module and the electronic component are disposed on different surfaces of the module substrate.

18 . The communications module of claim 11 , wherein the filter module and the electronic component are disposed on a same surface of the module substrate.

Assignees

• Samsung Electro Mech

Inventors

• Jeong Chan Yong

Classifications

• H05K2201/10166

  Transistor · CPC title

• H05K2201/1006

  Non-printed filter · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title

• H05K1/0218 Primary

  by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence) · CPC title

• H03H9/02007

  of bulk acoustic wave devices · CPC title