Substrate processing apparatus, process fluid treating apparatus, and ozone decomposition method

Patent metadata

Field	Value
Publication number	US-2021114902-A1
Application number	US-202017133104-A
Country	US
Kind code	A1
Filing date	Dec 23, 2020
Priority date	Oct 26, 2016
Publication date	Apr 22, 2021
Grant date	—

Abstract

Disclosed are a substrate processing apparatus and a process fluid treating apparatus. The substrate processing apparatus includes a process chamber that processes a substrate with a process fluid including ozone, a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate, and a process fluid treating apparatus connected with the discharge conduit. The process fluid treating apparatus includes a housing having an inner space with a set volume in which the process fluid is received and an injection nozzle connecting the discharge conduit and the inner space of the housing.

First claim

What is claimed is:

1 . A substrate processing apparatus comprising:
a process chamber configured to process a substrate with a process fluid containing ozone; a discharge conduit configured to discharge the process fluid used to process the substrate from the process chamber; and a process fluid treating apparatus connected to the discharge conduit, wherein the process fluid treating apparatus includes: a housing configured to form an inner space in which the process fluid is received; an injection nozzle configured to supply, into the inner space, the process fluid introduced into the discharge conduit; and a strike plate located inside the housing such that an upper surface of the strike plate faces the process fluid injected through the injection nozzle, and wherein the strike plate is disposed so as not to be immersed in the process fluid received in the inner space.

2 . The substrate processing apparatus of claim 1 , wherein the strike plate is implemented with a blocking plate having no hole formed therein.

3 . The substrate processing apparatus of claim 1 , wherein the process fluid treating apparatus further includes a gas supply conduit configured to supply a decomposition gas reacting with the ozone of the process fluid to facilitate decomposition of the ozone.

4 . The substrate processing apparatus of claim 3 , wherein the gas supply conduit injects the decomposition gas into the inner space.

5 . The substrate processing apparatus of claim 4 , wherein the gas supply conduit includes a lower injection part configured to inject the decomposition gas in a state of being immersed in the process fluid received in the inner space.

6 . The substrate processing apparatus of claim 5 , wherein the lower injection part extends in a left/right direction and injects the decomposition gas from one or more locations thereof in a longitudinal direction.

7 . The substrate processing apparatus of claim 1 , wherein the process fluid treating apparatus further includes a circulation line configured to provide a path along which the process fluid received in the inner space circulates.

8 . The substrate processing apparatus of claim 7 , wherein one end of the circulation line is connected with a lower portion of the housing,
wherein an opposite end of the circulation line is connected to an upper portion of the housing, and wherein a circulation nozzle having a plurality of holes formed therein is located at the opposite end of the circulation line.

9 . The substrate processing apparatus of claim 7 , wherein at least one turbulence creating part is located inside the circulation line.

10 . The substrate processing apparatus of claim 9 , wherein the turbulence creating part has the shape of a plate having one or more flow holes formed therein.

11 . The substrate processing apparatus of claim 10 , wherein the flow holes are formed to be inclined with respect to an axial direction of the circulation line.

12 . The substrate processing apparatus of claim 9 , wherein the turbulence creating part includes:
a first plate; and a second plate, and wherein the first plate and the second plate are installed at different slopes with respect to an axial direction of the circulation line and are located to block part of a flow passage inside the circulation line.

13 . A process fluid treating apparatus comprising:
a housing having an inner space with a set volume in which a process fluid containing ozone is received; an injection nozzle configured to supply, into the inner space, the process fluid used to process a substrate; and a strike plate located inside the housing such that an upper surface of the strike plate faces the process fluid injected through the injection nozzle, wherein the strike plate is disposed so as not to be immersed in the process fluid received in the inner space.

14 . The process fluid treating apparatus of claim 13 , wherein the strike plate is implemented with a blocking plate having no hole formed therein.

15 . The process fluid treating apparatus of claim 13 , further comprising:
a gas supply conduit configured to supply a decomposition gas reacting with the ozone of the process fluid to facilitate decomposition of the ozone.

16 . The process fluid treating apparatus of claim 15 , wherein the gas supply conduit injects the decomposition gas into the inner space.

17 . The process fluid treating apparatus of claim 16 , wherein the gas supply conduit includes a lower injection part configured to inject the decomposition gas in a state of being immersed in the process fluid received in the inner space.

18 . The process fluid treating apparatus of claim 17 , wherein the lower injection part extends in a left/right direction and injects the decomposition gas from one or more locations thereof in a longitudinal direction.

19 . An apparatus for processing a substrate, the apparatus comprising:
a nozzle configured to dispense a process fluid containing ozone onto the substrate; a cup configured to recover the process fluid dispensed onto the substrate to perform a process; a discharge conduit connected with the cup and configured to discharge the process fluid; and a process fluid treating apparatus connected to the discharge conduit, wherein the process fluid treating apparatus includes: a housing configured to form an inner space in which the process fluid is received; an injection nozzle configured to supply, into the inner space, the process fluid introduced into the discharge conduit; and a strike plate located inside the housing such that an upper surface of the strike plate faces the process fluid injected through the injection nozzle, and wherein the strike plate is disposed so as not to be immersed in the process fluid received in the inner space and is implemented with a blocking plate having no hole formed therein.

20 . The apparatus of claim 19 , wherein the process fluid treating apparatus further includes a gas supply conduit configured to supply a decomposition gas reacting with the ozone of the process fluid to facilitate decomposition of the ozone, and
wherein the gas supply conduit includes a lower injection part configured to inject the decomposition gas in a state of being immersed in the process fluid received in the inner space.

Assignees

• Semes Co Ltd

Inventors

• YOUN Junhee
• Cho Seung Hwan

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0451 Primary

  Apparatus for manufacturing or treating in a plurality of work-stations · CPC title

• C02F1/727 Primary

  using pure oxygen or oxygen rich gas · CPC title