Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder

Patent metadata

Field	Value
Publication number	US-2021114101-A1
Application number	US-202017138480-A
Country	US
Kind code	A1
Filing date	Dec 30, 2020
Priority date	Feb 3, 2012
Publication date	Apr 22, 2021
Grant date	—

Abstract

A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.

First claim

1 . A substrate holder for use in a lithographic apparatus, the substrate holder comprising:
a main body having a surface; a thin-film stack provided on the surface and forming an electric component; and a plurality of burls provided on the thin-film stack and having end surfaces to support a substrate.

2 . The substrate holder according to claim 1 , wherein the main body is formed of a different material than the burls.

3 . (Currently Amended The substrate holder according to claim 1 , wherein the burls have been formed by a process selected from the group consisting of:
deposition and selective etching; sputtering through a patterned resist layer; deposition through a hardmask; and laser-sintering.

4 . The substrate holder according to any one of claim 1 , wherein at least one burl comprises a first layer of a first material and a second layer of a second material that is different from the first material.

5 . The substrate holder according to claim 1 wherein the thin-film stack includes at least one via in electrical contact with a burl.

6 . The substrate holder according to claim 1 , wherein the thin-film stack forms a plurality of electric components.

7 . The substrate holder according to claim 6 , wherein a first electric component and a second electric component of the plurality of electric components are arranged in a single layer of the thin-film stack.

8 . The substrate holder according to claim 6 , wherein a first electric component and a second electric component of the plurality of electric components are arranged in two separate layers of the thin-film stack.

9 . The substrate holder according to claim 1 , wherein the component is a component selected from the group consisting of: an electrode, a heater, a sensor, a transistor and a logic device.

10 . A substrate holder for use in a lithographic apparatus, the substrate holder comprising:
a main body having a surface; a thin-film stack provided on the surface and forming an electronic or electric component, the thin-film stack having a plurality of apertures formed therein; and a plurality of projections, each projection provided in an aperture of the thin-film stack, the plurality of projections being configured to support a substrate.

11 . A lithographic apparatus, comprising:
a support structure configured to support a patterning device; a projection system arranged to project a beam patterned by the patterning device onto a substrate; and a substrate holder arranged to hold the substrate, the substrate holder being according to claim 1 .

12 . (canceled)

13 . A method of manufacturing a substrate holder for use in a lithographic apparatus, the method comprising:
providing a main body having a surface; forming a thin-film stack on the surface of the main body; and forming a plurality of burls on the thin-film stack, the burls projecting from the stack and having end surfaces to support a substrate.

14 . The method according to claim 13 , wherein forming the plurality of burls comprises:
forming a layer of burl-forming material on the thin-film stack; forming a mask on the layer of burl-forming material; etching the burl-forming material through the mask; and removing the mask.

15 . The method according to claim 13 , further comprising forming a plurality of apertures in the thin-film stack; and forming the plurality of burls in the apertures of the thin-film stack.

Assignees

• Asml Netherlands Bv

Inventors

• Lafarre Raymond Wilhelmus Louis
• Donders Sjoerd Nicolaas Lambertus
• Ten Kate Nicolaas
• Dziomkina Nina Vladimirovna
• Karade Yogesh Pramod
• Rodenburg Elisabeth Corinne

Classifications

• B22F10/66

  by mechanical means · CPC title

• B22F10/25

  Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS] · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B22F7/062 Primary

  involving the connection or repairing of preformed parts · CPC title

• G03F7/70341 Primary

  Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply (chemical composition of immersion liquids G03F7/2041) · CPC title