Flexible LED Light Engine Interconnects

Patent metadata

Field	Value
Publication number	US-2021108789-A1
Application number	US-202017062709-A
Country	US
Kind code	A1
Filing date	Oct 5, 2020
Priority date	Oct 10, 2019
Publication date	Apr 15, 2021
Grant date	—

Abstract

Systems and methods disclosed herein include a light engine circuit board including a flexible substrate having a first interconnect region located at a first end of the flexible substrate and a second interconnect region located at a second end of the flexible substrate, in which the first interconnect region and the second interconnect region each comprise one or more solder strips, and one or more LEDs on the flexible substrate.

First claim

What is claimed is:

1 . A light engine circuit board, comprising:
a flexible substrate having a first interconnect region located at a first end of the flexible substrate and a second interconnect region located at a second end of the flexible substrate, wherein the first interconnect region and the second interconnect region each comprise one or more solder strips; and a plurality of light emitting diodes (LEDs) on the flexible substrate.

2 . The light engine circuit board of claim 1 , wherein the first interconnect region is located on a top surface of the flexible substrate and the second interconnect region is located on a bottom surface of the flexible substrate.

3 . The light engine circuit board of claim 1 , wherein the one or more solder strips comprise two solder strips.

4 . The light engine circuit board of claim 1 , wherein the one or more solder strips are line shaped, T-shaped, or I-shaped.

5 . The light engine circuit board of claim 1 , wherein the one or more solder strips on the first interconnect region and the one or more solder strips on the second interconnect region are shaped and positioned in such a way as to overlap each other when the first end is placed on top of the second end.

6 . The light engine circuit board of claim 1 , wherein the first interconnect region and the second interconnect region are shaped to overlap each other when the first end is placed on top of the second end.

7 . The light engine circuit board of claim 1 , wherein the one or more solder strips are electrically coupled to the plurality of LEDs via one or more traces.

8 . The light engine circuit board of claim 1 , further comprising an adhesive tape layer.

9 . The light engine circuit board of claim 1 , wherein:
the plurality of LEDs are electrically coupled to a power source; and when a portion of the light engine circuit board is cut, a remaining plurality of LEDs on the light engine circuit board are still electrically coupled to the power source.

10 . A system, comprising:
a first light engine circuit board, comprising:
a first flexible substrate having a first interconnect region located at a first end of the first flexible substrate, wherein the first interconnect region comprises one or more solder strips; and
a plurality of light emitting diodes (LEDs) on the first flexible substrate; and
a second light engine circuit board, comprising:
a second flexible substrate having a second interconnect region located at a second end of the second flexible substrate, wherein the second interconnect region comprises one or more solder strips; and
a plurality of LEDs on the second flexible substrate;
wherein the first interconnect region of the first light engine circuit board overlaps with the second interconnect region of the second light engine circuit board to provide an electrical connection between the first light engine circuit board and the second light engine circuit board.

11 . The system of claim 10 , wherein the one or more solder strips on the first interconnect region and the one or more solder strips on the second interconnect region overlap when the first interconnect region overlaps the second interconnect region in order to provide the electrical connection.

12 . The system of claim 10 , wherein the first interconnect region is located on a top surface of the first flexible substrate and the second interconnect region is located on a bottom surface of the second flexible substrate.

13 . The system of claim 10 , wherein the first light engine circuit board may be angularly bent with respect to the second light engine circuit board at the location where the first interconnect region overlaps the second interconnect engine.

14 . The system of claim 13 , wherein the first light engine circuit board may be bent at a 90° angle with respect to the second light engine circuit board.

15 . The system of claim 13 , wherein the first light engine circuit board may be bent at an acute angle with respect to the second light engine circuit board.

16 . The system of claim 13 , wherein the first light engine circuit board and the second light engine circuit board are bent in an arc shape.

17 . The system of claim 13 , wherein the arc shape has a radius of curvature of 1 inch or greater.

18 . The system of claim 16 , wherein the arc shape has a radius of curvature between 1 inch and 6 inches.

19 . The system of claim 13 , wherein the arc shape has a radius of curvature that depends on at least one of a physical dimension of the plurality of LEDs, a number of LEDs per unit length of the first and second light engine circuit boards, and a thickness of one or more materials comprising the first and second light engine circuit boards.

Assignees

• Chikkegowda Nagaraja
• Thangavelu Sivakumar
• Baba Driss
• Osram Sylvania Inc

Inventors

• Chikkegowda Nagaraja
• Thangavelu Sivakumar
• Baba Driss

Classifications

• H05K2201/09709

  Staggered pads, lands or terminals; Parallel conductors in different planes · CPC title

• H05K3/363

  by soldering · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K2201/0154

  Polyimide · CPC title