Mid-infrared avalanche photodiodes with low dark currents
US-2024170601-A1 · May 23, 2024 · US
US2021066521A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021066521-A1 |
| Application number | US-202016999421-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 21, 2020 |
| Priority date | Aug 28, 2019 |
| Publication date | Mar 4, 2021 |
| Grant date | — |
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A light receiving device includes a substrate, a first contact layer disposed on a surface of the substrate, a light receiving layer disposed on the first contact layer, an intermediate layer disposed on the light receiving layer, a wide-gap layer having a pn junction disposed on the intermediate layer, a second contact layer disposed on the wide-gap layer, and a groove formed for pixel isolation by removing the second contact layer and part of the wide-gap layer, wherein the intermediate layer has a wider band gap than the light receiving layer, and wherein the wide-gap layer has a wider band gap than the intermediate layer.
Opening claim text (preview).
What is claimed is: 1 . A light receiving device comprising: a substrate; a first contact layer disposed on a surface of the substrate; a light receiving layer disposed on the first contact layer; an intermediate layer disposed on the light receiving layer; a wide-gap layer having a pn junction disposed on the intermediate layer; a second contact layer disposed on the wide-gap layer; and a groove formed for pixel isolation by removing the second contact layer and part of the wide-gap layer, wherein the intermediate layer has a wider band gap than the light receiving layer, and wherein the wide-gap layer has a wider band gap than the intermediate layer. 2 . The light receiving device as claimed in claim 1 , wherein the intermediate layer is made of a plurality of layers having different composition ratios, and the plurality of layers are arranged in an ascending order of band gaps from the light receiving layer to the wide-gap layer. 3 . The light receiving device as claimed in claim 1 , wherein the wide-gap layer includes a p-type wide-gap layer and an n-type wide-gap layer, the n-type wide-gap layer serving as a bottom surface of the groove. 4 . The light receiving device as claimed in claim 1 , wherein light incident on an opposite surface of the substrate is detected. 5 . The light receiving device as claimed in claim 1 , wherein the light receiving layer includes InGaAs, and the intermediate layer includes InGaAsP, with the wide-gap layer including InP. 6 . The light receiving device as claimed in claim 1 , wherein a side surface of the wide-gap layer situated at a sidewall of the groove is covered with a passivation film made of SiN or SiON. 7 . The light receiving device as claimed in claim 1 , wherein the first contact layer is an n-type contact layer, and the second contact layer is a p-type contact layer. 8 . The light receiving device as claimed in claim 1 , wherein pixels isolated by a plurality of said grooves are arranged in a one-dimensional array or in a two-dimensional array.
Pixel isolation structures · CPC title
the potential barrier being a PN heterojunction · CPC title
the devices comprising active layers made of only Group III-V materials · CPC title
having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP · CPC title
having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays · CPC title
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