Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
High-performance led fabrication
US2021050480A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021050480-A1 |
| Application number | US-202016907650-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 22, 2020 |
| Priority date | Sep 18, 2009 |
| Publication date | Feb 18, 2021 |
| Grant date | — |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
High-performance light-emitting diode together with apparatus and method embodiments thereto are disclosed. The light emitting diode devices emit at a wavelength of 390 nm to 470 nm or at a wavelength of 405 nm to 430 nm. Light emitting diode devices are characterized by having a geometric relationship (e.g., aspect ratio) between a lateral dimension of the device and a vertical dimension of the device such that the geometric aspect ratio forms a volumetric light emitting diode that delivers a substantially flat current density across the device (e.g., as measured across a lateral dimension of the active region). The light emitting diode devices are characterized by having a current density in the active region of greater than about 175 Amps/cm2.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electrical or opto-electrical subassembly comprising: A submount defining at least a first contact; a chip mounted on said submount defining at least a second contact, wherein said first and second contacts define a distance therebetween; wherein at least one of said first or second contacts defines a coated portion comprising a layer of material having low wettability for solder, and a non-coated portion; and solder electrically connecting said first and second contacts, said solder being balled-up on said non-coated portion to span said distance between said first and second contacts.
Assignees
Inventors
Classifications
Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title
of interconnections · CPC title
of packages · CPC title
Containers · CPC title
Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title
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Frequently asked questions
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- What does patent US2021050480A1 cover?
- High-performance light-emitting diode together with apparatus and method embodiments thereto are disclosed. The light emitting diode devices emit at a wavelength of 390 nm to 470 nm or at a wavelength of 405 nm to 430 nm. Light emitting diode devices are characterized by having a geometric relationship (e.g., aspect ratio) between a lateral dimension of the device and a vertical dimension of th…
- Who is the assignee on this patent?
- Ecosense Lighting Inc
- What technology area does this patent fall under?
- Primary CPC classification H10H20/825. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 18 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).