Electronic systems with inverted circuit board with heat sink to chassis attachment

Patent metadata

Field	Value
Publication number	US-2021043537-A1
Application number	US-202016986122-A
Country	US
Kind code	A1
Filing date	Aug 5, 2020
Priority date	Aug 6, 2019
Publication date	Feb 11, 2021
Grant date	—

Abstract

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

First claim

1 . An apparatus, comprising:
an electronic system comprising:
a) a chassis;
b) a semiconductor chip cooling component that is rigidly fixed to the chassis;
c) a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component; and,
d) an electronic circuit board, the packaged semiconductor chip electro-mechanically attached to the electronic circuit board.

2 . The apparatus of claim 1 wherein the semiconductor chip cooling component is in contact with an inner face of the chassis.

3 . The apparatus of claim 1 wherein the semiconductor chip cooling component is rigidly fixed to an inner face of the chassis through a frame, the frame in contact with and rigidly fixed to the chassis face, the semiconductor chip cooling component being rigidly fixed to the frame.

4 . The apparatus of claim 3 wherein the semiconductor chip cooling component is in contact with the frame.

5 . The apparatus of claim 1 wherein the semiconductor chip cooling component is any of:
a heat sink;
a liquid cooling cold plate;
a liquid cooling manifold.

6 . The apparatus of claim 1 wherein the electronic circuit board is double-sided.

7 . The apparatus of claim 1 wherein the electronic circuit board is mounted to a tray that mates with the chassis.

8 . The apparatus of claim 1 wherein the semiconductor chip cooling component is mounted to an inner face of the chassis through a standoff.

9 . The apparatus of claim 8 wherein there exists at least one spring between the standoff and the semiconductor chip cooling component.

10 . The apparatus of claim 1 wherein the electronic circuit board is positioned between a spring and the electronic cooling component.

11 . The apparatus of claim 10 wherein a backplate of the electronic circuit board exists between the spring and the electronic circuit board.

12 . The apparatus of claim 10 wherein the electronic circuit board is mounted to a tray that mates with the chassis, the tray positioned between the spring and the electronic circuit board.

13 . The apparatus of claim 1 wherein the semiconductor chip cooling component is mounted to a sidewall of the chassis.

14 . The apparatus of claim 13 wherein the electronic circuit board and semiconductor chip cooling component are mounted to a tray that mates with the chassis.

15 . The apparatus of claim 1 wherein the electronic circuit board is mounted to a motherboard of the electronic system.

16 . The apparatus of claim 15 wherein a structural midplane exists between the motherboard and the chassis.

17 . The apparatus of claim 1 wherein the semiconductor chip cooling component is rigidly fixed to an inner face of the chassis, wherein the inner face of the chassis is structured.

18 . The apparatus of claim 17 wherein the semiconductor chip cooling component is mounted to structures of the structured inner face of the chassis directly and/or through a frame.

19 . The apparatus of claim 17 wherein the semiconductor chip cooling component is a liquid cooling component and structures of the structured inner face of the chassis are designed to collect and run off leakage of liquid from a cooling system that the liquid cooling component is a component of.

20 . The apparatus of claim 19 wherein the structures of the structured inner face of the chassis comprise:
alignment features to align components of the electronic system;
an attach point or guide feature for an assembly tool;

a cable clip;
finger access space;
an embedded liquid detector;
an embedded thermocouple.

21 . A data center, comprising:
a rack mounted computing system, comprising:
a) a chassis;
b) a semiconductor chip cooling component that is rigidly fixed to the chassis;
c) a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component; and,
d) an electronic circuit board, the packaged semiconductor chip electro-mechanically attached to the electronic circuit board.

22 . A method, comprising:
mounting a semiconductor chip cooling component to a chassis; and, mechanically integrating a circuit board to the chassis, the mechanically integrating of the circuit board to the chassis further comprising mechanically integrating the semiconductor chip cooling component with a semiconductor chip of the circuit board so that the semiconductor chip cooling component is able to cool the semiconductor chip when the circuit board is operating.

Assignees

• Intel Corp

Inventors

• Faneuf Barrett M
• Geng Phil
• Arik Kenan
• Shia David
• Winkel Casey
• Ahuja Sandeep
• Mcafee Eric D
• Smalley Jeffory L
• Le Minh T D
• Miele Ralph V
• Milobinski Marc
• Anderson Aaron P
• Pavelek Brendan T

Classifications

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/231

  characterised by their places of attachment or cooling paths · CPC title

• H10W40/235

  attached to package parts · CPC title