Electrically conductive vias and methods for producing same

Patent metadata

Field	Value
Publication number	US-2021043464-A1
Application number	US-201917043998-A
Country	US
Kind code	A1
Filing date	Mar 29, 2019
Priority date	Mar 30, 2018
Publication date	Feb 11, 2021
Grant date	—

Abstract

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

First claim

1 . An electrical component comprising:
a substrate defining a first surface and a second surface opposite the first surface, and a hole that extends from the first surface to the second surface; and an electrically conductive metal fill that extends in the hole from the first surface to the second surface so as to define an electrically conductive via, wherein the electrically conductive fill defines an electrically conductive path from the first surface to the second surface, wherein the metal comprises sintered particles, and a majority of the particles are substantially non-densification sintered.

2 . The electrical component as recited in claim 1 , wherein the substrate is a glass substrate.

3 . The electrical component as recited in claim 2 , wherein the metal comprises sintered particles.

4 . (canceled)

5 . The electrical component as recited in claim 3 , wherein the fill defines bumps that extend out with respect to the first and second surfaces, respectively.

6 - 8 . (canceled)

9 . The electrical component as recited in claim 5 , wherein the bumps are defined by pressed overfill of electrically conductive particles.

10 . The electrical component as recited in claim 3 , wherein the particles are forced into the hole under a force that is defined by one of a pressure differential, a centrifugal force, and an electrostatic force.

11 . The electrical component as recited in claim 10 , wherein the sintered particles have an average particle size between approximately 1 micron and approximately 10 microns prior to sintering.

12 . The electrical component as recited in claim 11 , wherein the sintered particles define a plurality of first particles having the average particle size, and the sintered particles define a plurality of second particles having an average particle size between approximately 0.01 micron and approximately 1 micron.

13 . The electrical component as recited in claim 12 , wherein the second particles extend from the first particles to the first and second surfaces of the substrate, respectively.

14 - 20 . (canceled)

21 . The electrical component as recited in claim 1 , wherein the hole has a cross sectional dimension that ranges from 10 μm to 25 μm.

22 . The electrical component as recited in claim 21 , wherein the via has a hermeticity less than 10 −7 .

23 - 238 . (canceled)

239 . A method of metalizing a hole that extends in a substrate from a first surface to an opposed second surface, the method comprising the steps of:
introducing a first final fill into the hole at a first side of the substrate under one of a pressure differential, a centrifugal force, and an electrostatic force, such that the first final fill extends from the second surface toward the first surface, wherein the first side of the substrate defines the first surface; introducing a bulk fill into the hole at the first side of the substrate under one of a pressure differential, a centrifugal force, and an electrostatic force, such that the bulk fill extends from the first final fill toward the first surface; and introducing a second final fill into the hole at the first side of the substrate under one of a pressure differential, a centrifugal force, and an electrostatic force, such that the second final fill extends from the bulk fill to the first surface.

240 . The method as recited in claim 239 , wherein the introducing steps comprise introducing the first final fill, the bulk fill, and the second final fill as respective particles suspended in a liquid medium, and evacuating the liquid medium.

241 . The method as recited in claim 240 , further comprising the step of isostatically pressing the particles at least one of the first final fill, the bulk fill, and the second final fill.

242 . The method as recited in claim 241 , further comprising the step of sintering the particles after the final introducing step.

243 . The method as recited in claim 242 , wherein the particles of first final fill extends from the hole onto the second surface, and the particles of the second final fill extends from the hole onto the first surface.

244 . The method as recited in claim 243 , further comprising the step of hard pressing particles of the first and final fills against the second and first surfaces, respectively, so as to define a button.

245 . The method as recited in claim 240 , wherein the particles of the first and second final fill are smaller than the particles of the bulk fill.

246 . The method as recited in claim 245 , wherein the first final fill comprises a bimodal distribution of particles.

247 . The method as recited in claim 246 , wherein the bimodal distribution includes a plurality of first particles having a first average particle size, and a plurality of second particles having a second average particle size, wherein the first average particle size ranges from approximately 1 micron to approximately 10 microns, and the second average particle size ranges from approximately 0.1 micron to approximately 2.5 microns.

248 - 253 . (canceled)

254 . The method as recited in claim 247 , wherein the first average particle size and the second average particle size defines a ratio that ranges from approximately 4:1 to approximately 10:1.

255 . The method as recited in claim 254 , wherein the ratio is approximately 7:1.

256 - 286 . (canceled)

Assignees

• Samtec Inc

Inventors

• Nolet Alan
• Goia Daniel
• Hardikar Vishwas
• Kumar Ajeet
• Long Daniel
• Liotta Andrew

Classifications

• H10W70/692 Primary

  Ceramics or glasses · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/095 Primary

  of vias therein · CPC title

• H01L23/49827

  Electricity · mapped topic

• H01L23/15

  Electricity · mapped topic