Electronic component package and method for manufacturing electronic component package
US-2024090133-A1 · Mar 14, 2024 · US
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Particle Metallic Paste
US2021028079A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021028079-A1 |
| Application number | US-201916519277-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 23, 2019 |
| Priority date | Jul 23, 2019 |
| Publication date | Jan 28, 2021 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.
First claim
Opening claim text (preview).
1 .- 7 . (canceled) 8 . A method of fabricating an integrated circuit (IC) device carrier package comprising: connecting a lower contact of a lid-ridge to a pad of an IC device carrier with a first nano particle metallic paste; subsequently attaching an IC device to the IC device carrier; forming a contiguous underfill material instance between the IC device and the IC device carrier and between a bar of the lid-ridge and the IC device carrier; curing the underfill and sintering the first nano particle metallic paste to form a first metallic connection between the lower contact and the first pad. 9 . The method of claim 8 , further comprising: applying seal band material to the IC device carrier around the perimeter of the IC device and the lid-ridge. 10 . The method of claim 8 , further comprising: applying thermal interface material to the IC device upper surface. 11 . The method of claim 8 , further comprising: applying second nano particle metallic paste to the underside of a lid. 12 . The method of claim 11 , further comprising: attaching the lid to the lid-ridge by connecting an upper contact of the lid-ridge to the underside of the lid with the second nano particle metallic paste. 13 . The method of claim 12 , further comprising sintering the second nano particle metallic paste to form a second metallic connection between the upper contact and the lid. 14 . The method of claim 11 , further comprising: attaching the lid to the IC device carrier with seal band material. 15 . The method of claim 11 , further comprising: attaching the lid to the IC device with thermal interface material. 16 .- 20 (canceled)
Assignees
Inventors
Classifications
Package configurations · CPC title
Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title
having interconnections parallel to the insulating or insulated base · CPC title
Containers comprising an insulating or insulated base · CPC title
the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US2021028079A1 cover?
- An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle met…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H10W76/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jan 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).