Substrate heating device

US2020413493A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020413493-A1
Application numberUS-202016892552-A
CountryUS
Kind codeA1
Filing dateJun 4, 2020
Priority dateJun 28, 2019
Publication dateDec 31, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A substrate heating device is provided. The substrate heating device includes a vacuum chamber and a heater. The vacuum chamber receives a substrate. The heater includes a body, a heating wire, and a terminal part. The body penetrates through a wall of the vacuum chamber such that a portion of the body is in a vacuum atmosphere of the vacuum chamber. The heating wire is provided inside the body and partly disposed inside the vacuum chamber. The terminal part is connected to the heating wire and is disposed outside the vacuum chamber.

First claim

Opening claim text (preview).

What is claimed is: 1 . A substrate heating device comprising: a vacuum chamber that receives a substrate; and a heater comprising: a body that penetrates through a wall of the vacuum chamber such that a portion of the body is in a vacuum atmosphere of the vacuum chamber; a heating wire provided inside the body and partly disposed inside the vacuum chamber; and a terminal part to which the heating wire is connected, the terminal part being disposed outside the vacuum chamber. 2 . The substrate heating device as recited in claim 1 , wherein the body is disposed to penetrate through a through-hole formed in the wall, and provided with a sealing member around an outer peripheral surface thereof, and wherein the heating wire is configured such that an amount of heat generated by the heating wire at a first portion of the body penetrating through the through-hole is less than that at a second portion of the body disposed inside the vacuum chamber. 3 . The substrate heating device as recited in claim 2 , wherein the heating wire is configured such that an electrical resistance of the first portion is less than that of the second portion. 4 . The substrate heating device as recited in claim 3 , further comprising a light leakage suppressing member that is provided inside the body and that blocks light rays emitted from the heating wire. 5 . The substrate heating device as recited in claim 1 , further comprising a light leakage suppressing member that is provided inside the body and that blocks light rays emitted from the heating wire. 6 . The substrate heating device as recited in claim 4 , wherein a position of the light leakage suppressing member inside the body lies in a range from a height position of an inner wall surface of the wall to a height position at which the sealing member is provided. 7 . The substrate heating device as recited in claim 1 , wherein the body is provided with a protrusion protruding inwardly from an inner peripheral surface of a portion thereof that penetrates through the wall, and wherein the substrate heating device further comprises a support member that is provided inside the body and that is attached to the heating wire while being supported by the protrusion. 8 . The substrate heating device as recited in claim 1 , wherein the body comprises a first end portion and a second end portion each penetrating through the wall, and an elongated portion that connects the first end portion to the second end portion and is bent from the first end portion and the second end portion and disposed inside the vacuum chamber. 9 . The substrate heating device as recited in claim 1 , wherein the body is a tube-shaped body. 10 . The substrate heating device as recited in claim 2 , wherein the body is a tube-shaped body and the sealing member is a ring-shaped sealing member. 11 . A substrate heating device comprising: a vacuum chamber that receives a substrate; and a heater comprising: a body that penetrates a wall of the vacuum chamber, a first portion of the body being disposed in the vacuum chamber; a heating wire provided inside the body; and a terminal part to which the heating wire is connected, the terminal part being disposed outside the vacuum chamber. 12 . The substrate heating device as recited in claim 11 , wherein the body comprises a second portion disposed outside the wall. 13 . The substrate heating device as recited in claim 12 , wherein the terminal part is provided at a distal end of the second portion. 14 . The substrate heating device as recited in claim 11 , further comprising a sealing member provided around an outer periphery of the body that seals the first portion to maintain the first portion in a vacuum atmosphere of the vacuum chamber. 15 . The substrate heating device as recited in claim 11 , further comprising a metal plate that is provided inside the body and that blocks light rays emitted from the heating wire. 16 . The substrate heating device as recited in claim 11 , further comprising a plurality of support members that support the heating wire within the body to space the heating wire away from a wall of the body. 17 . A substrate heating device comprising: a vacuum chamber that receives a substrate; and a heating device including a plurality of heaters, each comprising: a body that penetrates a wall of the vacuum chamber, a first portion of the body being disposed in the vacuum chamber; a heating wire provided inside the body; and a terminal part to which the heating wire is connected, the terminal part being disposed outside the vacuum chamber.

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What does patent US2020413493A1 cover?
A substrate heating device is provided. The substrate heating device includes a vacuum chamber and a heater. The vacuum chamber receives a substrate. The heater includes a body, a heating wire, and a terminal part. The body penetrates through a wall of the vacuum chamber such that a portion of the body is in a vacuum atmosphere of the vacuum chamber. The heating wire is provided inside the body…
Who is the assignee on this patent?
Nissin Ion Equipment Co Ltd, Himeji Rika Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0436. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Dec 31 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).