Method For Manufacturing Led Display

Patent metadata

Field	Value
Publication number	US-2020402867-A1
Application number	US-202016931772-A
Country	US
Kind code	A1
Filing date	Jul 17, 2020
Priority date	Feb 6, 2018
Publication date	Dec 24, 2020
Grant date	—

Abstract

The present invention provides a method for manufacturing an LED display including a wiring board and LEDs arranged at a constant distance from the wiring board. The method includes: aligning an LED substrate 1 having LEDs 11 with a wiring board 2, and pressing and joining the LED substrate onto the wiring board. Each LED has a bonding surface. The wiring board includes bonding layers. The aligning step is performed so that the bonding surfaces are joined on the bonding layers in the pressing and joining step. The method further includes: temporarily bonding the LEDs onto the wiring board by curing the bonding layers through irradiation with ultraviolet light UV; peeling off the LEDs from the LED substrate through irradiation with laser light L; and permanently bonding the LEDs onto the wiring board by heating the bonding layers of the LEDs so as to further cure the bonding layers.

First claim

1 . A method for manufacturing an LED display by joining an LED substrate onto a wiring board, the LED substrate including a light transmitting wafer and LEDs formed in a plurality of rows at predetermined intervals on a first surface of the wafer, each LED having LED electrodes, the wiring board including wiring board electrodes and a circuit layer having a circuit configured to drive the LEDs and laminated on a first surface of the wiring board, and then by irradiating the LED substrate with laser light from a second surface of the wafer and peeling off the LEDs from the LED substrate so as to mount the LEDs on the wiring board so that the LED electrodes are electrically conductively connected to the wiring board electrodes, the method comprising:
aligning the LED substrate with the wiring board,
wherein each LED having the LED electrodes and a bonding surface on an upper surface of the LED, the bonding surface being disposed in a predetermined region neighboring the LED electrodes,
wherein the wiring board further includes:
a circuit layer having a circuit configured to drive the LEDs and laminated on a first surface of the wiring board;
elastic support members disposed at predetermined positions on the circuit layer;
stop layers disposed at positions corresponding to positions of the bonding surfaces and configured to restrict compression of the elastic support members when the LED substrate and the wiring board are pressed together; and
bonding layers having photocurable and thermosetting properties and disposed on the stop layers, and

wherein, in the aligning step, the bonding surfaces of the LEDs are positioned on upper surfaces of the bonding layers in the wiring board in preparation for joining the LED substrate onto the wiring board;
pressing and joining the LED substrate onto the wiring board; temporarily bonding the LEDs onto the wiring board by curing the bonding layers through ultraviolet light irradiation from a second surface of the wafer while continuing to press the LED substrate against the wiring board; peeling off the LEDs from the LED substrate after laser light irradiation from the second surface of the wafer; and permanently bonding the LEDs onto the wiring board by heating the bonding layers of the LEDs mounted on the wiring board so as to further cure the bonding layers.

2 . The method for manufacturing an LED display, according to claim 1 , the method further comprising, subsequent to the pressing and joining step:
inspecting the LEDs in the LED substrate, wherein, in the inspecting step, the LEDs are individually energized through the LED electrodes and the wiring board electrodes to determine whether the respective LEDs are defective or non-defective.

3 . The method for manufacturing an LED display, according to claim 2 ,
wherein, when the LEDs are determined to be non-defective in the inspecting step,
in the temporarily bonding step, the LEDs determined to be non-defective are temporary bonded onto the wiring board, and
in the peeling off step, the LEDs determined to be non-defective are peeled off from the LED substrate and mounted on the wiring board.

4 . The method for manufacturing an LED display, according to claim 2 ,
wherein, when at least one of the LEDs is determined to be defective in the inspecting step,
in the temporarily bonding step, one or more LEDs at least including the at least one LED determined to be defective are not temporary bonded onto the wiring board, and
in the peeling off step, the one or more LEDs that are not temporary bonded are not subjected to the laser light irradiation and remain on the LED substrate.

5 . The method for manufacturing an LED display, according to claim 4 ,
wherein the one or more LEDs that are not temporary bonded onto the wiring board in the temporarily bonding step are LEDs in a row including the at least one LED determined to be defective, and wherein, in the peeling off step, the LEDs in the row are not subjected to the laser light irradiation so that LEDs in the other rows are selectively peeled off from the LED substrate and mounted on the wiring board.

6 . The method for manufacturing an LED display, according to claim 5 , further comprising:
aligning a replacement LED substrate including a single row of replacement LEDs with the wiring board on which non-defective LEDs are mounted and which has a vacancy due to an absence of the row of the LEDs including the at least one LED determined to be defective,
wherein, in the aligning step, the bonding surfaces of the replacement LEDs in the single row are positioned on upper surfaces of bonding layers located in the vacancy of the wiring board; and
pressing and joining the replacement LED substrate onto the wiring board, wherein, when the replacement LEDs are determined to be non-defective in the inspecting step,
in the temporarily bonding step, the replacement LEDs determined to be non-defective are temporary bonded onto the wiring board having the vacancy, and
in the peeling off step, the replacement LEDs determined to be non-defective are peeled off from the replacement LED substrate and supplementally mounted on the wiring board so as to fill the vacancy.

7 . The method for manufacturing an LED display, according to claim 1 ,
wherein the LEDs are micro LEDs each configured to emit light in a blue wavelength band or a near-ultraviolet wavelength band.

Assignees

• V Tech Co Ltd

Inventors

• Yanagawa Yoshikatsu
• Fukaya Koichiro
• Okura Naoya

Classifications

• H10W72/0198 Primary

  batch processes · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title