Heating device and semiconductor manufacturing apparatus
US-10916457-B2 · Feb 9, 2021 · US
US2020350189A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020350189-A1 |
| Application number | US-202016931563-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 17, 2020 |
| Priority date | Oct 31, 2016 |
| Publication date | Nov 5, 2020 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A heating device is provided. The heating device includes a conveyance member, first and second support members, and a heat reflecting plate. The first support member is provided on the conveyance member and supports a substrate during movement of the conveyance member. The second support member includes a heater and supports the substrate during processing of the substrate. The heat reflecting plate travels with the conveyance member and reflects heat from the heater toward the substrate.
Opening claim text (preview).
What is claimed is: 1 . A heating device comprising: a conveyance member; a first support member that is provided on the conveyance member and that supports a substrate during movement of the conveyance member; a second support member that includes a heater and that supports the substrate during processing of the substrate; and a heat reflecting plate that travels with the conveyance member and that reflects heat from the heater toward the substrate. 2 . The heating device as recited in claim 1 , wherein the heat reflecting plate is attached to the conveyance member. 3 . The heating device as recited in claim 1 , wherein the heat reflecting plate is integrally formed from a portion of the conveyance member. 4 . The heating device as recited in claim 1 , wherein the second support member comprises an electrostatic chuck that is operable when engaged to hold the substrate to the second support member. 5 . The heating device as recited in claim 1 , wherein the second support member comprises an electrostatic chuck or a mechanical clamp which, when engaged, holds the substrate to the second support member. 6 . The heating device as recited in claim 5 , further comprising: a temperature sensor; and a controller configured to: control the temperature sensor to measure a temperature of the substrate; determine a temperature difference between the measured temperature and a reference temperature; and control the electrostatic chuck or mechanical clamp based on the determined temperature difference. 7 . The heating device as recited in claim 6 , wherein the controller is configured to, in response to the determined temperature difference being less than or equal to a threshold temperature, control the electrostatic chuck or mechanical clamp to engage to hold the substrate to the second support member. 8 . The heating device as recited in claim 7 , wherein the controller is further configured to measure a temperature of the second support member, and wherein the reference temperature comprises the measured temperature of the second support member. 9 . The heating device as recited in claim 6 , wherein the controller is further configured to measure a temperature of the second support member, and wherein the reference temperature comprises the measured temperature of the second support member. 10 . The heating device as recited in claim 1 , further comprising a controller configured to turn on the heater to heat the substrate. 11 . The heating device as recited in claim 1 , wherein the heat reflecting plate is configured to cover the substrate. 12 . The heating device as recited in claim 1 , further comprising a controller configured to transfer the substrate from the first support member to the second support member, and convey the transferred substrate to a position closer to the heat reflecting plate than a position at which the first support member supports the substrate. 13 . The heating device as recited in claim 12 , wherein the second support member immovably supports the substrate after the transfer by one or more of a mechanical manner, an electrostatic manner or a vacuum suction manner. 14 . The heating device as recited in claim 1 , wherein the heat reflecting plate is formed with an opening. 15 . The heating device as recited in claim 1 , wherein the heat reflecting plate has a concave shape. 16 . A heating device comprising: an arm having a substrate support that supports a substrate attached thereto; a heater operable to heat a surface of the substrate; and a heat reflecting plate formed of a portion of the arm that is opposite to the substrate. 17 . The heating device as recited in claim 16 , wherein the heater heats a first surface of the substrate, and the heat reflecting plate reflects heat toward a second surface of the substrate that is opposite to the first surface. 18 . The heating device as recited in claim 16 , wherein the heat reflecting plate comprises two half plates and two connecting portions, each connecting portion connecting a respective one of the two half plates to the portion of the arm. 19 . The heating device as recited in claim 16 , wherein the heat reflecting plate comprises at least one opening. 20 . The heating device as recited in claim 16 , wherein the heat reflecting plate is concave.
characterised by edge clamping, e.g. clamping ring · CPC title
using electrostatic chucks · CPC title
Temperature monitoring · CPC title
mainly by radiation · CPC title
the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.