Method for manufacturing copper foil for high frequency circuit

Patent metadata

Field	Value
Publication number	US-2020332428-A1
Application number	US-202016917914-A
Country	US
Kind code	A1
Filing date	Jul 1, 2020
Priority date	Nov 15, 2017
Publication date	Oct 22, 2020
Grant date	—

Abstract

A method of manufacturing a copper foil for a high frequency circuit includes sequentially forming a fine roughness copper nodule layer on a surface of an electroplated copper layer, the fine roughness copper nodule layer being consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm; then, performing electroplating with a Zn—Ni co-electroplating formula for 3 seconds or more to form a Zn—Ni plating layer on the fine roughness copper nodule layer, the Zn—Ni plating layer including 90-150 μg/dm2 of zinc and 75-120 μg/dm2 of nickel; forming a rust-proof layer on the Zn—Ni plating layer, the rust-proof layer including 20-40 μg/dm2 of chromium; and next, forming a hydrophobic layer on the rust-proof layer, the hydrophobic layer having a water contact angle of 80 to 150 degrees.

First claim

What is claimed is:

1 . A method of manufacturing a copper foil for a high frequency circuit, comprising:
forming a fine roughness copper nodule layer on a surface of an electroplated copper layer, the fine roughness copper nodule layer being consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm; performing electroplating with a Zn—Ni co-electroplating formula for 3 seconds or more to form a Zn—Ni plating layer on the fine roughness copper nodule layer, the Zn—Ni plating layer comprising 90-150 μg/dm 2 of zinc and 75-120 μg/dm 2 of nickel; forming a rust-proof layer on the Zn—Ni plating layer, the rust-proof layer comprising 20-40 μg/dm 2 of chromium; and forming a hydrophobic layer on the rust-proof layer, the hydrophobic layer having a water contact angle of 80 to 150 degrees.

2 . The method of manufacturing a copper foil for a high frequency circuit according to claim 1 , wherein the Zn—Ni co-electroplating formula comprises zinc, nickel, and potassium pyrophosphate.

3 . The method of manufacturing a copper foil for a high frequency circuit according to claim 1 , wherein a duration of the electroplating for forming the Zn—Ni plating layer is 3 to 5 seconds.

4 . The method of manufacturing a copper foil for a high frequency circuit according to claim 1 , wherein an organosilane solution for forming the hydrophobic layer comprises vinyl silane, epoxy silane, or amino silane.

5 . The method of manufacturing a copper foil for a high frequency circuit according to claim 4 , wherein the amino silane comprises: (3-trimethoxysilylpropyl)ethylenediamine, (3-triethoxysilylpropyl)ethylenediamine, (3-aminopropyl)trimethoxysilane, or (3-aminopropyl)triethoxysilane.

6 . The method of manufacturing a copper foil for a high frequency circuit according to claim 4 , wherein the vinyl silane comprises: vinyltrimethoxysilane or vinyltriethoxysilane.

7 . The method of manufacturing a copper foil for a high frequency circuit according to claim 1 , wherein the copper alloy particles are formed of copper and elements selected from a group consisting of Fe, and Mo.

8 . The method of manufacturing a copper foil for a high frequency circuit according to claim 1 , wherein a step of forming the fine roughness copper nodule layer comprises treating the surface of the electroplated copper layer by an ultra-fine surface roughening process.

9 . The method of manufacturing a copper foil for a high frequency circuit according to claim 8 , wherein a solution used in the ultra-fine surface roughening process comprises a copper sulfate-based solution with Fe and Mo added as inhibitors in the ultra-fine surface roughening process.

10 . The method of manufacturing a copper foil for a high frequency circuit according to claim 8 , wherein the ultra-fine surface roughening process comprises performing an nucleation electroplating and then performing a covering electroplating.

11 . The method of manufacturing a copper foil for a high frequency circuit according to claim 10 , further comprising performing a bonding electroplating after cycling twice of the nucleation electroplating and the covering electroplating.

12 . The method of manufacturing a copper foil for a high frequency circuit according to claim 1 , wherein a step of forming the rust-proof layer comprises impregnating the Zn—Ni plating layer in a chromic acid solution.

13 . The method of manufacturing a copper foil for a high frequency circuit according to claim 12 , wherein a duration of the impregnating for forming the rust-proof layer is 10 to 15 seconds.

Assignees

• Ind Tech Res Inst

Inventors

• Chen Jhen-Rong
• Chiu Chiu-Yen

Classifications

• C25D5/605

  Surface topography of the layers, e.g. rough, dendritic or nodular layers · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• C25D3/565

  containing more than 50% by weight of zinc · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title