Method for making nanoporous nickel composite material

Patent metadata

Field	Value
Publication number	US-2020321602-A1
Application number	US-201916395527-A
Country	US
Kind code	A1
Filing date	Apr 26, 2019
Priority date	Apr 2, 2019
Publication date	Oct 8, 2020
Grant date	—

Abstract

A method for making nanoporous nickel composite material comprises: providing a cathode plate and a copper-containing anode plate, electroplating a copper material layer a surface of the cathode plate; laying a carbon nanotube layer on the copper material layer, and forming an overlapped structure of the copper material layer and the carbon nanotube laye; the cathode plate and the overlapped structure are used as a cathode, and a nickel-containing anode plate is used as an anode, plating a nickel material layer on the overlapped structure to form sandwich structure; repeating steps S1 to S3 to obtain a carbon nanotube-reinforced copper-nickel alloy; rolling and annealing the carbon nanotube-reinforced copper-nickel alloy; and etching the carbon nanotube-reinforced copper-nickel alloy to form the nanoporous nickel composite material.

First claim

What is claimed is:

1 . A method for making nanoporous nickel composite material comprising:
S 1 , providing a cathode plate and a copper-containing anode plate, electroplating a copper material layer a surface of the cathode plate; S 2 , laying a carbon nanotube layer on the copper material layer, and forming an overlapped structure of the copper material layer and the carbon nanotube layer on the surface of the cathode plate; S 3 , the cathode plate and the overlapped structure are used as a cathode, and a nickel-containing anode plate is used as an anode, plating a nickel material layer on the overlapped structure to form sandwich structure of the copper material layer, the carbon nanotube layer and the nickel material layer; S 4 : repeating steps S 1 to S 3 to obtain a carbon nanotube-reinforced copper-nickel alloy comprising a plurality of sandwich structures overlapped with each other; S 5 : rolling and annealing the carbon nanotube-reinforced copper-nickel alloy; and S 6 : etching the carbon nanotube-reinforced copper-nickel alloy to form the nanoporous nickel composite material.

2 . The method of claim 1 , wherein in step S 1 , an insulated material is attached on a back surface of the cathode plate to cover the back surface of the cathode plate.

3 . The method of claim 1 , wherein in step S 1 , a duration of the electroplating process is ranged from 1 minute to 30 minutes.

4 . The method of claim 1 , wherein in step S 1 , a current density during the electroplating process is in a range from 1 to 5 A/dm 2 .

5 . The method of claim 1 , wherein in step S 2 , after the carbon nanotube layer is laid on the surface of the copper material layer, the carbon nanotube layer can be further infiltrated with alcohol to make the carbon nanotube layer and the copper material layer combined with each other tightly.

6 . The method of claim 1 , wherein in step S 2 , the carbon nanotube layer comprises a plurality of carbon nanotubes arranged orderly.

7 . The method of claim 5 , wherein in step S 3 , a duration of the electroplating process is ranged from 1 minute to 30 minutes.

8 . The method of claim 1 , wherein in step S 3 , a current density during the electroplating process is in a range from 1 to 5 A/dm 2 .

9 . The method of claim 1 , wherein in step S 4 , each layer of the sandwich structure is obtained by repeating steps S 1 to S 3 and to obtain a plurality of sandwich structures.

10 . The method of claim 9 , wherein the plurality of sandwich structures is overlapped with each other to form the carbon nanotube-reinforced copper-nickel alloy.

11 . The method of claim 1 , wherein step S 5 comprises: S 51 :
S 51 : degreasing the carbon nanotube-reinforced copper-nickel alloy;
S 52 : heat-treating the carbon nanotube-reinforced copper-nickel alloy to de-alloy the carbon nanotube-reinforced copper-nickel alloy.
S 53 : Electrochemical etching the carbon nanotube-reinforced copper-nickel alloy. FL only comprises carbon nanotubes and MoP 2 nanoparticles.

12 . The method of claim 11 , wherein in step S 52 , before the heat-treating the carbon nanotube-reinforced copper-nickel alloy, the carbon nanotube-reinforced copper-nickel alloy is rolled by a manual rolling apparatus to reduce a thickness of the carbon nanotube-reinforced copper-nickel alloy.

13 . The method of claim 12 , wherein the step of heat-treating the carbon nanotube-reinforced copper-nickel alloy comprises: annealing the carbon nanotube-reinforced copper-nickel alloy in an inert atmosphere at a temperature ranged from 400 to 500° C., and an annealing time is ranged from 20 to 24 h.

Assignees

• Univ Tsinghua
• Hon Hai Prec Ind Co Ltd

Inventors

• Hou Ze-Cheng
• Liu Yuan-Feng
• Zhu Lin
• Li Wen-Zhen

Classifications

• H01M4/8853

  Electrodeposition · CPC title

• C22F1/10

  of nickel or cobalt or alloys based thereon · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C23F1/44

  Compositions for etching metallic material from a metallic material substrate of different composition · CPC title

• C25D3/12

  of nickel or cobalt · CPC title