Gas supply method and gas supply system

US2020278084A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020278084-A1
Application numberUS-202016803467-A
CountryUS
Kind codeA1
Filing dateFeb 27, 2020
Priority dateFeb 28, 2019
Publication dateSep 3, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provide a gas supply method including: preparing a gas container filled with an easy-to-liquefy gas; and supplying the easy-to-liquefy gas from the gas container to a processing container in which a substrate process is performed using the easy-to-liquefy gas, via a gas supply path, wherein a pressure and a temperature of the easy-to-liquefy gas are controlled such that in the gas supply path, the pressure of the easy-to-liquefy gas decreases in a step-by-step manner and the temperature of the easy-to-liquefy gas increases from the gas container toward the processing container.

First claim

Opening claim text (preview).

What is claimed is: 1 . A gas supply method comprising: preparing a gas container filled with an easy-to-liquefy gas; and supplying the easy-to-liquefy gas from the gas container to a processing container in which a substrate process is performed using the easy-to-liquefy gas, via a gas supply path, wherein a pressure and a temperature of the easy-to-liquefy gas are controlled such that in the gas supply path, the pressure of the easy-to-liquefy gas decreases in a step-by-step manner and the temperature of the easy-to-liquefy gas increases from the gas container toward the processing container. 2 . The method of claim 1 , wherein the pressure and the temperature of the easy-to-liquefy gas are controlled based on a saturated vapor pressure curve of the easy-to-liquefy gas. 3 . The method of claim 2 , wherein the temperature of the easy-to-liquefy gas is increased by dividing a region from the gas container to the processing container into a plurality of heating regions and heating each of the plurality of heating regions with a heater unit. 4 . The method of claim 3 , wherein the pressure of the easy-to-liquefy gas is adjusted by a regulator. 5 . The method of claim 4 , wherein the pressure and the temperature of the easy-to-liquefy gas are controlled such that even when the easy-to-liquefy gas is cooled down by an adiabatic expansion caused by the regulator, a relationship between the pressure and the temperature is on a lower side of a saturated vapor pressure curve. 6 . The method of claim 5 , wherein the easy-to-liquefy gas is a gas having a saturated vapor pressure of 100 kPa or less at a room temperature of 20 degrees C. 7 . The method of claim 6 , wherein the easy-to-liquefy gas is an HF gas or a ClF 3 gas. 8 . The method of claim 1 , wherein the temperature of the easy-to-liquefy gas is increased by dividing a region from the gas container to the processing container into a plurality of heating regions and heating each of the plurality of heating regions with a heater unit. 9 . The method of claim 1 , wherein the pressure of the easy-to-liquefy gas is adjusted by a regulator. 10 . The method of claim 1 , wherein the easy-to-liquefy gas is a gas having a saturated vapor pressure of 100 kPa or less at a room temperature of 20 degrees C. 11 . A gas supply system comprising: a gas container filled with an easy-to-liquefy gas; a gas supply path through which the easy-to-liquefy gas is supplied from the gas container to a processing container in which a substrate process is performed using the easy-to-liquefy gas; a plurality of regulators provided in the gas supply path, a plurality of heater units configured to heat a plurality of heating regions obtained by dividing the gas container and the gas supply path into plural regions; a controller configured to control the plurality of regulators and the plurality of heater units such that in the gas supply path, a pressure of the easy-to-liquefy gas decreases in a step-by-step manner and a temperature of the easy-to-liquefy gas increases from the gas container toward the processing container. 12 . The system of claim 11 , wherein the controller controls the pressure and the temperature of the easy-to-liquefy gas based on a saturated vapor pressure curve of the easy-to-liquefy gas. 13 . The system of claim 12 , wherein the controller controls the pressure and temperature of the easy-to-liquefy gas such that even when the easy-to-liquefy gas is cooled down by an adiabatic expansion caused by the plurality of regulators, a relationship between the pressure and the temperature is on a lower side of the saturated vapor pressure curve. 14 . The system of claim 13 , wherein the easy-to-liquefy gas is a gas having a saturated vapor pressure of 100 kPa or less at a room temperature of 20 degrees C. 15 . The system of claim 14 , wherein the easy-to-liquefy gas is an HF gas or a ClF 3 gas. 16 . The system of claim 1 , wherein the easy-to-liquefy gas is a gas having a saturated vapor pressure of 100 kPa or less at a room temperature of 20 degrees C.

Assignees

Inventors

Classifications

  • Hydrogen storage · CPC title

  • with details of the manifold · CPC title

  • F17C7/00Primary

    Methods or apparatus for discharging liquefied, solidified, or compressed gases from pressure vessels, not covered by another subclass · CPC title

  • Valves · CPC title

  • Small (<1 m3) · CPC title

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What does patent US2020278084A1 cover?
There is provide a gas supply method including: preparing a gas container filled with an easy-to-liquefy gas; and supplying the easy-to-liquefy gas from the gas container to a processing container in which a substrate process is performed using the easy-to-liquefy gas, via a gas supply path, wherein a pressure and a temperature of the easy-to-liquefy gas are controlled such that in the gas supp…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification F17C7/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Sep 03 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).