EUV Collector Contamination Prevention

US2020236768A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020236768-A1
Application numberUS-202016839526-A
CountryUS
Kind codeA1
Filing dateApr 3, 2020
Priority dateApr 30, 2018
Publication dateJul 23, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An extreme ultra-violet (EUV) lithography system includes an EUV source and EUV scanner. A droplet generator provides a droplet stream in the EUV source. A gas shield is configured to surround the droplet stream. When a laser reacts a droplet in the stream EUV radiation and ionized particles are produced. The gas shield can reduce contamination resulting from the ionized particles by conveying the ionized particles to a droplet catcher. Components of the EUV source may be biased with a voltage to repel or attract ionized particles to reduce contamination from the ionized particles.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method comprising: producing a stream of first material droplets from a droplet generator in an extreme ultra-violet (EUV) source device; biasing a collector of the EUV source device with a positive voltage; biasing vanes of the EUV source device with a negative voltage; and vaporizing a droplet of the stream of first material droplets to produce EUV radiation and positively charged particles of the first material, wherein the biased collector repels a first plurality of the particles of the first material from the collector, and wherein the biased vanes attract the first plurality of the particles of the first material to adhere to the vanes. 2 . The method of claim 1 , wherein the first material is tin. 3 . The method of claim 1 , further comprising: providing a first gas shield around the droplet stream, wherein the first gas shield directs a second plurality of the positively charged particles to a droplet catcher. 4 . The method of claim 3 , wherein the gas shield is provided by a gas injection tube disposed around a nozzle of the droplet generator, wherein the droplet stream passes through the gas injection tube. 5 . The method of claim 4 , further comprising: providing a vacuum exhaust around a droplet opening of the droplet catcher, the vacuum exhaust receiving gas from the gas injection tube. 6 . The method of claim 1 , further comprising: biasing a cone of the EUV source device with a second positive voltage. 7 . The method of claim 1 , wherein a magnitude of the positive voltage is different than a magnitude of the negative voltage. 8 . An extreme ultraviolet radiation (EUV) apparatus, comprising: a source vessel comprising: a collector at one end of the source vessel, the collector configured to have a first bias voltage applied thereto during an EUV process, the first bias voltage being a positive bias voltage, vanes attached to the collector, the vanes configured to have a second bias voltage applied thereto during the EUV process, the second bias voltage being a negative bias voltage, and a cone attached to the vanes; a droplet generator configured to generate droplets of a first material at one side of the source vessel and provide the droplets in a stream of droplets across a reflective surface of the collector to an opposite side of the source vessel; and a droplet catcher disposed at the opposite side of the source vessel configured to collect a first portion of the droplets; and a laser configured to vaporize a second portion of the stream of droplets to produce EUV radiation and positive ion particles of the first material, the positive ion particles being repelled from the collector and attracted to the vanes. 9 . The EUV apparatus of claim 8 , wherein the cone is configured to have a third bias voltage applied thereto during the EUV process, the third bias voltage being a positive bias voltage. 10 . The EUV apparatus of claim 8 , further comprising: a gas injection system comprising a gas injection tube disposed around an outlet of the droplet generator, the gas injection tube configured to provide a ring of gas surrounding a length of the stream of droplets; and a vacuum exhaust system comprising a vacuum exhaust tube disposed around an inlet of the droplet catcher, the vacuum exhaust tube comprising a ringed inlet surrounding the inlet of the droplet catcher configured to vacuum the ring of gas. 11 . The EUV apparatus of claim 10 , wherein the ring of gas comprises H 2 , He, Ar, N 2 , O 2 , N 2 O, clean dry air (CDA), ambient air, or combinations thereof. 12 . The EUV apparatus of claim 10 , wherein the gas injection tube comprises multiple lengthwise sections. 13 . A method comprising: producing a droplet stream from a droplet generator in an ultra-violet radiation source device, the droplet stream comprising a first material; providing a gas to a gas injection head disposed around an outlet of the droplet generator, the droplet stream passing through the gas injection head, the gas injection head funneling the gas from a first cavity having a first width to a head outlet, the head outlet surrounding the droplet stream, the head outlet having a second width narrower than the first width; providing a first gas shield from the head outlet, the first gas shield encircling the droplet stream along an entire length of travel of the droplet stream; and while providing the first gas shield, pulsing a laser to vaporize a droplet from the droplet stream to produce ultra-violet radiation and particles of the first material, wherein the particles of the first material are directed to a droplet catcher by the first gas shield. 14 . The method of claim 13 , wherein the first material is tin. 15 . The method of claim 13 , wherein the particles of the first material comprise positively charged ions of the first material, further comprising: biasing a collector of the ultra-violet radiation source device with a positive voltage to repel a second plurality of the particles of the first material from the collector; and biasing vanes of the ultra-violet radiation source device with a negative voltage to attract the second plurality of the particles of the first material to adhere to the vanes. 16 . The method of claim 13 , wherein the gas shield comprises H 2 , He, Ar, N 2 , O 2 , N 2 O, clean dry air (CDA), ambient air, or combinations thereof. 17 . The method of claim 13 , wherein the gas shield is provided by a gas injection tube completely surrounding a nozzle of the droplet generator, wherein the droplet stream passes through the gas injection tube. 18 . The method of claim 17 , further comprising: heating the gas injection tube to a temperature between 50° C. and 450° C. 19 . The method of claim 17 , wherein the gas injection tube comprises a second cavity, wherein the gas shield comprises a first gas shield and a second gas shield, wherein the first gas shield is provided from the first cavity, and wherein the second gas shield is provided from the second cavity. 20 . The method of claim 19 , wherein a first flow rate of the first gas shield is different than a second flow rate of the second gas shield.

Assignees

Inventors

Classifications

  • H05G2/0094Primary

    Reduction, prevention or protection from contamination; Cleaning · CPC title

  • G03F7/2004Primary

    characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light · CPC title

  • Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source · CPC title

  • by plasma extreme ultraviolet [EUV] sources · CPC title

  • Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps · CPC title

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What does patent US2020236768A1 cover?
An extreme ultra-violet (EUV) lithography system includes an EUV source and EUV scanner. A droplet generator provides a droplet stream in the EUV source. A gas shield is configured to surround the droplet stream. When a laser reacts a droplet in the stream EUV radiation and ionized particles are produced. The gas shield can reduce contamination resulting from the ionized particles by conveying …
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05G2/0094. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).