Vacuum-packaged product of high-purity metal and method for producing vacuum-packaged product

Patent metadata

Field	Value
Publication number	US-2020180840-A1
Application number	US-201816463628-A
Country	US
Kind code	A1
Filing date	Mar 6, 2018
Priority date	Mar 8, 2017
Publication date	Jun 11, 2020
Grant date	—

Abstract

The purpose of the present invention is to provide a high-purity tin product not containing undesirable carbon impurities by producing a high-purity metal vacuum-packaged product (high-purity tin vacuum-packaged product) by means of vacuum-packaging of a high-purity metal (high-purity tin), wherein at least a portion of the surface of the high-purity metal is covered with dust-free paper, and the high-purity metal, at least a portion of the surface thereof being covered with the dust-free paper, is vacuum-packaged using a vacuum-packaging film.

First claim

1 . A vacuum-packaged product of a high-purity metal, the product comprising a vacuum-packaged high-purity metal,
wherein at least a part of a surface of the high-purity metal is covered with dustless paper; and wherein the high-purity metal with at least a part of the surface covered with the dustless paper is vacuum-packaged by a vacuum packaging film.

2 . The vacuum-packaged product of the high-purity metal according to claim 1 , wherein the dustless paper has a number of particles with 0.10 μm or more of 10,000 particles/CF or less, in all of a rubbing test, a scrubbing test and a tear rubbing test, according to a dust generation test in accordance with SEMI G 67-0996.

3 . The vacuum-packaged product of the high-purity metal according to claim 1 , wherein the dustless paper has a thickness of from 0.01 to 0.5 mm.

4 . The vacuum-packaged product of the high-purity metal according to claim 1 , wherein the vacuum packaging film comprises a laminated film having at least one metal vapor deposited layer or at least one metal oxide vapor deposited layer, and wherein the high-purity metal is vacuum-packaged without bringing the at least one metal vapor deposited layer or the at least one metal oxide vapor deposited layer into contact with the high-purity metal.

5 . The vacuum-packaged product of the high-purity metal according to claim 1 , wherein the vacuum packaging film comprises a polyethylene film having at least one metal vapor deposited layer or at least one metal oxide vapor deposited layer; and wherein the high-purity metal is vacuum-packaged without bringing the at least one metal vapor deposited layer or the at least one metal oxide vapor deposited layer into contact with the high-purity metal.

6 . The vacuum-packaged product of the high-purity metal according to claim 1 , wherein the high-purity metal has a surface roughness Ra in a range of from 0.3 to 5.0 μm.

7 . The vacuum-packaged product of the high-purity metal according to claim 1 , wherein the high-purity metal comprises high-purity tin.

8 . A method for producing a vacuum-packaged product of a high-purity metal, the product comprising a vacuum-packaged high-purity metal, the method comprising the steps of:
covering at least a part of a surface of the high-purity metal with dustless paper; and vacuum-packaging the high-purity metal with at least a part of the surface covered with the dustless paper by a vacuum packaging film.

9 . The method for producing the vacuum-packaged product of the high-purity metal according to claim 8 , wherein the vacuum packaging film comprises a laminated film having at least one metal vapor deposited layer or at least one metal oxide vapor deposited layer; and wherein the high-purity metal is vacuum-packaged without bringing the at least one metal vapor deposited layer or the at least one metal oxide vapor deposited layer into contact with the high-purity metal.

10 . The method for producing the vacuum-packaged product of the high-purity metal according to claim 8 , wherein the vacuum packaging film comprises a polyethylene film having at least one metal vapor deposited layer or at least one metal oxide vapor deposited layer; and the high-purity metal is vacuum-packaged without bringing the at least one metal vapor deposited layer or the at least one metal oxide vapor deposited layer into contact with the high-purity metal.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Tsukamoto Shiro
• Takemoto Koichi

Classifications

• B65B55/20

  Embedding contents in shock-absorbing media, e.g. plastic foam, granular material · CPC title

• B65B31/048

  specially adapted for wrappers or bags · CPC title

• B65B23/00

  Packaging fragile or shock-sensitive articles other than bottles; Unpacking eggs (embedding articles in shock-absorbing media B65B55/20) · CPC title

• D21H27/00

  Special paper not otherwise provided for, e.g. made by multi-step processes · CPC title

• B65D81/2023 Primary

  in a flexible container (B65D81/2038 takes precedence) · CPC title